Renesas R5F52317BDFP#30
- Part No.:
- R5F52317BDFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F52317BDFP#30.pdf
- Description:
- IC MCU 32BIT 384KB FLSH 100LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:345
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Product details
Overview
R5F52317BDFP#30 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 384 KB on-chip flash memory, 32 KB SRAM, and integrated 12-bit A/D converter (24 channels), USB 2.0 full-speed host/function/OTG, CAN interface, and TSIP-Lite encryption engine. It operates across 1.8–5.5 V supply and −40 to +85°C, targeting industrial HMI and secure embedded control systems.
For engineers reviewing the R5F52317BDFP#30 datasheet, R5F52317BDFP#30 pinout, R5F52317BDFP#30 application, or R5F52317BDFP#30 equivalent, this MCU delivers deterministic real-time performance with FPU, MPU, ELC event-driven peripheral coordination, and IEC60730-compliant self-test functions for safety-critical firmware deployment.
Technical Context
The R5F52317BDFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling 88.56 DMIPS at 54 MHz. It integrates a single-precision IEEE754 FPU, 32-bit multiplier, and hardware divider with two-cycle minimum latency.
Its peripheral set includes a 6-channel MTU2 timer, 6-channel TPU, 4-channel DMAC, ELC for interrupt-free module linking, and CTSU supporting up to 24 self-capacitive touch keys. The device uses PLQP0100KB-B (100-pin LFQFP, 14 × 14 mm, 0.5 mm pitch) packaging with 79 general I/O pins, 5-V tolerant inputs, and 58 open-drain outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 88.56 DMIPS @ 54 MHz |
| Max Operating Frequency | 54 MHz system clock; supports 48 MHz USB clock via dedicated PLL |
| Memory | 384 KB flash (no-wait ≤32 MHz), 32 KB SRAM (no-wait @ 54 MHz), 8 KB data flash (1M erase cycles) |
| Analog Peripherals | 12-bit S12ADE ADC (24 channels, 0.83 µs conversion), 2-channel 12-bit D/A, 2-unit comparator (4 channels total) |
| Communication Interfaces | USB 2.0 full-speed host/function/OTG (12 Mbps), CAN 2.0B (1 Mbps), 6× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI |
| Security & Safety | TSIP-Lite AES-128/256 (GCM/CBC/ECB), true RNG, MPU, IEC60730 self-test support for ADC, IWDT, CAC, RAM |
| Power & Temp | 1.8–5.5 V operation; −40 to +85°C (D version); three low-power modes including software standby with LPT |
Pinout & Package
Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package, 14 × 14 mm body, 0.5 mm pitch, exposed thermal pad, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Core & I/O power supply / ground | Dual power domains: VCC supplies CPU/peripherals; separate AVCC for analog circuits ensures noise isolation |
| XTAL, EXTAL | Main crystal oscillator input/output | Supports 1–20 MHz external crystal; enables precise timing for USB, RTC, and high-accuracy communication baud rates |
| RTC_VDD, RTC_VSS | RTC backup power domain | Enables calendar/timekeeping during main power loss using coin-cell battery; independent from VCC |
| USB_DP, USB_DM | USB 2.0 differential data pair | Full-speed (12 Mbps) transceiver with internal termination; no external PHY required for basic host/device operation |
| TXD0, RXD0 | SCI0 asynchronous serial interface | Hardware UART with programmable baud rate generator; supports LSB/MSB-first, bit modulation for noise immunity |
| CTX0–CTX23 | Capacitive touch sensing inputs | Direct connection to CTSU scan electrodes; supports self-capacitance mode for up to 24 independent touch keys |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | IEEE754-compliant 32-bit single-precision arithmetic accelerates motor control, sensor fusion, and filtering algorithms |
| Event Link Controller (ELC) | 61-event routing without CPU intervention enables synchronized peripheral operation (e.g., timer-triggered ADC sampling) |
| Trusted Secure IP (TSIP-Lite) | Hardware-accelerated AES-GCM/CBC with key protection prevents firmware cloning and ensures secure boot integrity |
| Realtime Clock (RTCe) | Sub-clock-driven calendar with leap-year correction, alarm interrupts, and time-capture on external event pins |
| Low-power timer (LPT) | 16-bit counter running in software standby mode using sub-clock or IWDT oscillator-enables wake-up at precise intervals |
| Multi-function Pin Controller (MPC) | Per-pin function selection allows dynamic reassignment of peripherals (e.g., SCI/USB/I2C) to optimize PCB layout |
Applications
| Industrial HMI Panel | Secure IoT Gateway |
|---|---|
Use Scenario: Touch-enabled factory operator interface with local data logging and USB configuration port. IC Role / Device Role / Timing Role: Main controller executing GUI logic, managing capacitive touch scan, buffering SD card writes, and handling USB CDC virtual COM port. Use Value: Integrated CTSU eliminates external touch controller; USB OTG enables field firmware updates without host PC dependency. |
Use Scenario: Edge node aggregating sensor data from Modbus/RS485 devices and forwarding via encrypted TLS over Wi-Fi/Ethernet. IC Role / Device Role / Timing Role: Central protocol translator and crypto engine performing AES-GCM encryption before transmission. Use Value: TSIP-Lite offloads encryption from software, reducing CPU load and ensuring side-channel resistant key management. |
| Automotive Body Control Module | Medical Diagnostic Handheld |
Use Scenario: Door lock actuator controller with LIN slave interface, LED drivers, and fault monitoring. IC Role / Device Role / Timing Role: Real-time scheduler managing LIN frame timing, PWM dimming, and watchdog supervision. Use Value: IEC60730-compliant self-tests (RAM check, IWDT, clock accuracy) satisfy Class B functional safety requirements. |
Use Scenario: Portable ultrasound probe with analog front-end signal conditioning and battery-powered operation. IC Role / Device Role / Timing Role: High-precision timing source for ADC sampling synchronization and low-jitter DAC waveform generation. Use Value: 12-bit S12ADE ADC achieves 0.83 µs conversion with per-channel sampling time control-critical for time-of-flight measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52318BDFP#30 | 512 KB flash, 64 KB SRAM, same package and peripheral set; adds SDHI interface | Required when local SD card logging or MMC compatibility is needed | Select R5F52318BDFP#30 if firmware size exceeds 384 KB or SD storage integration is mandatory |
| R5F52306ADFP#30 | RX230 Group part; 256 KB flash, 32 KB SRAM, no CAN or USB; supports only 64-pin packages | Suitable for cost-sensitive, non-USB/CAN applications with smaller code footprint | Choose R5F52306ADFP#30 only when USB/CAN are unnecessary and PCB layout must accommodate 64-pin footprint |
Compared with R5F52317BDFP#30, R5F52318BDFP#30 provides higher memory headroom and SDHI for data-intensive edge nodes, while R5F52306ADFP#30 trades connectivity and memory for lower BOM cost and smaller form factor-neither is pin-compatible due to differing pin counts and peripheral mappings.
Availability
R5F52317BDFP#30 is available at Aetrix Electronics and suitable for industrial HMI, secure IoT gateways, automotive body controllers, and medical handheld devices requiring stable component supply and long-term lifecycle assurance.
Supply support for R5F52317BDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX231 Group-including R5F52317BDFP#30-is designed for robust, secure, real-time embedded control in harsh environments, emphasizing functional safety, cryptographic acceleration, and mixed-signal integration.
FAQ
What is the maximum operating frequency and core type of the R5F52317BDFP#30?
The R5F52317BDFP#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS performance. Its Harvard architecture includes a 5-stage pipeline, variable-length instruction set, and on-chip FPU compliant with IEEE754 single-precision standards. This enables deterministic execution for real-time control tasks in the R5F52317BDFP#30.
Does the R5F52317BDFP#30 support USB and CAN interfaces?
Yes, the R5F52317BDFP#30 integrates a USB 2.0 full-speed host/function/OTG module supporting 12 Mbps transfers and BC1.2 battery charging, plus a single-channel CAN module compliant with ISO11898-1 up to 1 Mbps. These interfaces are fully implemented in silicon and require no external transceivers for basic operation-both are confirmed in the RX231 Group datasheet R01DS0261EJ0120.
What memory resources does the R5F52317BDFP#30 include?
The R5F52317BDFP#30 includes 384 KB of on-chip flash memory (with no-wait access up to 32 MHz), 32 KB of SRAM (no-wait at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles. All memory is accessible via the 4-Gbyte linear address space of the RXv2 core, and the R5F52317BDFP#30 supports background operation (BGO) for concurrent code execution and data flash programming.
Is the R5F52317BDFP#30 qualified for industrial temperature range and safety standards?
Yes, the R5F52317BDFP#30 is rated for −40 to +85°C (D version) and includes built-in features supporting IEC60730 Class B compliance-including self-diagnostic routines for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the DOC. These capabilities are documented in the R5F52317BDFP#30 datasheet section "Useful functions for IEC60730 compliance".
What package type and pin count does the R5F52317BDFP#30 use?
The R5F52317BDFP#30 uses the PLQP0100KB-B package: a 100-pin Low-Profile Quad Flat Package with 14 × 14 mm body size, 0.5 mm pitch, and exposed thermal pad. It provides 79 general-purpose I/O pins, 5-V tolerant inputs, and 58 open-drain outputs-matching the RX231 Group's largest pin-count variant as specified in Table 1.2 of R01DS0261EJ0120.
R5F52317BDFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX231
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52317BDFP#30 FAQ
1.How can I place an order for R5F52317BDFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52317BDFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52317BDFP#30 reliable?
The price and inventory of R5F52317BDFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52317BDFP#30 is usually 5 days.
3.What payment methods are accepted for R5F52317BDFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52317BDFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52317BDFP#30?
R5F52317BDFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52317BDFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52317BDFP#30?
For technical support, including R5F52317BDFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52317BDFP#30 requirements.
6.How does Aetrix verify that R5F52317BDFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F52317BDFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52317BDFP#30 meets industry standards.
7.What is the process for return or replacement of R5F52317BDFP#30?
All R5F52317BDFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52317BDFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52317BDFP#30 part is unused and in its original packaging.
Return procedure for R5F52317BDFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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