Renesas R5F52317BDLA#20

Overview

R5F52317BDLA#20 from Renesas is a 32-bit RXv2 microcontroller with 384 KB on-chip flash, 64 KB SRAM, and 8 KB data flash, operating at up to 54 MHz (88.56 DMIPS). It integrates a single-precision FPU (IEEE 754), 24-channel 12-bit A/D converter (0.83 µs conversion), USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), and TSIP-Lite encryption engine. It targets industrial HMI and smart sensor nodes requiring real-time control, secure firmware updates, and mixed-signal interfacing.

For engineers reviewing the R5F52317BDLA#20 datasheet, R5F52317BDLA#20 pinout, R5F52317BDLA#20 application, or R5F52317BDLA#20 equivalent, this page delivers verified specifications, package mapping to PTLG0100KA-A (5.5 × 5.5 mm TFLGA), validated peripheral configurations (including CAN, USB, CTSU, RTC), and two confirmed alternative parts for design flexibility.

Technical Context

The R5F52317BDLA#20 belongs to the RX231 Group and implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It supports little-endian data arrangement and includes an MPU, on-chip divider (2-cycle min), and fast interrupt response.

Its clock system features a main oscillator (1–20 MHz), sub-clock (32.768 kHz), PLL (4–12.5 MHz input), USB-dedicated PLL (4/6/8/12 MHz), and CAC for frequency accuracy measurement. System clock (ICLK) runs at 54 MHz; peripheral clocks (PCLKA/B/D) are independently configurable up to 54/32/54 MHz respectively.

Key Specifications

Pinout & Package

Package: PTLG0100KA-A - 100-pin TFLGA, 5.5 × 5.5 mm, 0.5 mm pitch, 5-V tolerant I/O, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52318BDLA#20, R5F52317BDLA#20 trades 128 KB flash and SDHI for lower cost and identical CAN/USB/CTSU capability; versus R5F52306ADLA#20, it adds essential industrial connectivity (CAN, USB) and doubles RAM-making it the minimal viable RX231 option for connected edge devices.

Availability

R5F52317BDLA#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, secure gateway modules, and motor control subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F52317BDLA#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX231 Group, including R5F52317BDLA#20, was designed for cost-effective, secure, and feature-rich industrial edge devices requiring real-time performance, mixed-signal integration, and functional safety support (IEC60730).

FAQ

What is the maximum operating frequency and core architecture of the R5F52317BDLA#20?

The R5F52317BDLA#20 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core. This core implements a CISC Harvard architecture with a 5-stage pipeline, variable-length instructions, and ultra-compact code density. It delivers 88.56 DMIPS and includes a single-precision floating-point unit compliant with IEEE 754, making R5F52317BDLA#20 suitable for computationally intensive real-time tasks such as motor control and sensor fusion.

Does the R5F52317BDLA#20 support CAN and USB interfaces, and what are their specifications?

Yes, the R5F52317BDLA#20 integrates one CAN 2.0B module compliant with ISO11898-1, supporting data rates up to 1 Mbps, and one USB 2.0 full-speed host/function/OTG module supporting 12 Mbps transfers, isochronous mode, and BC1.2 battery charging. Both interfaces are fully implemented in silicon with dedicated PHY and controller logic, and R5F52317BDLA#20 includes internal USB voltage regulation eliminating the need for external VCC_USB supply when VCC is 4.0–5.5 V.

What package type and pin count does the R5F52317BDLA#20 use, and is it RoHS compliant?

The R5F52317BDLA#20 uses the PTLG0100KA-A package: a 100-pin TFLGA (Thin Fine-Pitch Land Grid Array) measuring 5.5 × 5.5 mm with 0.5 mm pitch and an exposed thermal pad. This package is lead-free and RoHS compliant, qualified for industrial temperature range (−40 to +85°C), and supports 5-V tolerant I/O for direct interfacing with legacy peripherals. The compact footprint makes R5F52317BDLA#20 ideal for space-constrained industrial modules.

How much on-chip memory does the R5F52317BDLA#20 include, and what are its endurance characteristics?

The R5F52317BDLA#20 includes 384 KB of on-chip flash memory for program code and constants, 64 KB of SRAM for runtime variables (no wait states at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles (typical). The flash supports background operation (BGO) for concurrent read-while-write, and both flash and data flash are programmable at 1.8 V. These memory resources make R5F52317BDLA#20 well-suited for field-upgradable firmware and persistent data logging.

What security and functional safety features are integrated into the R5F52317BDLA#20?

The R5F52317BDLA#20 integrates TSIP-Lite-a hardware cryptographic engine supporting AES-128/256 in GCM, ECB, CBC, and other modes-along with a true random number generator and secure key management. For functional safety, it includes IEC60730-compliant self-test features: A/D converter diagnostic, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the DOC unit. These capabilities enable R5F52317BDLA#20 to meet Class B safety requirements in industrial control applications.