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Renesas R5F52317BDND#00
- Part No.:
- R5F52317BDND#00
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-WFQFN Exposed Pad
- Datasheet:
-
R5F52317BDND#00.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64WFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,474
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Product details
Overview
R5F52317BDND#00 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 384 KB on-chip flash, 32 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite AES-128/256). It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit ADC (0.83 µs conversion), dual 12-bit DAC, RTC with battery backup, and capacitive touch sensing (24 keys) - deployed in industrial HMI and smart sensor edge nodes.
For engineers reviewing the R5F52317BDND#00 datasheet, R5F52317BDND#00 pinout, R5F52317BDND#00 application, or R5F52317BDND#00 equivalent, key selection considerations include its 64-pin HWQFN (9 × 9 mm, 0.5 mm pitch) package, D-version −40 to +85°C rating, absence of SDHI and CAN (per Table 1.3), and presence of USB, SCI×5, I²C, RSPI, SSI, CTSU, and TSIP-Lite security - critical for secure, low-power embedded control with mixed-signal interface requirements.
Technical Context
The R5F52317BDND#00 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, enabling deterministic real-time execution at 54 MHz. Its memory subsystem includes 384 KB flash (no wait states ≤32 MHz, accelerator-assisted up to 54 MHz), 32 KB SRAM (no wait states at full speed), and 8 KB data flash rated for 1M program/erase cycles with background operation (BGO).
Peripheral integration centers on event-driven operation via the Event Link Controller (ELC), supporting timer-triggered ADC conversions and module chaining without CPU intervention. Clock management includes independent domain clocks (ICLK/PCLKA/PCLKB/PCLKD/BCLK/FCLK), sub-clock RTC support, USB-dedicated PLL (48 MHz), and IWDT with dedicated 15-kHz oscillator - enabling precise power/performance trade-offs across sleep modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 88.56 DMIPS @ 54 MHz, IEEE 754 FPU, MPU, and fast interrupt response |
| Memory | 384 KB flash (programmable at 1.8 V), 32 KB SRAM (no wait states @ 54 MHz), 8 KB data flash (1M cycles, BGO) |
| ADC/DAC | 24-channel 12-bit S12ADE ADC (0.83 µs min conversion time, per-channel sampling time control); two 12-bit R12DAA DAC channels (0.4–AVCC0−0.5 V output) |
| Communication | USB 2.0 FS host/function/OTG (12 Mbps), 5× SCI (asynchronous/smart card/IrDA), 1× I²C (400 kbps), 1× RSPI (16 Mbps), 1× SSI, no SDHI or CAN (confirmed per Table 1.3) |
| Security & Timing | TSIP-Lite with AES-128/256 (ECB/CBC/GCM), true RNG, CRC calculator; RTC with calendar mode, time capture, and battery backup support |
| Package & Temp | 64-pin HWQFN (PWQN0064KC-A), 9 × 9 mm, 0.5 mm pitch; operating temperature −40 to +85°C (D version) |
Pinout & Package
Package: 64-pin HWQFN (PWQN0064KC-A), 9 × 9 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 1.8–5.5 V supply domains; VCC powers digital/analog circuits, VSS provides reference return path for all I/O and analog blocks |
| XTAL/EXTAL | Main clock oscillator input/output | Connects to 1–20 MHz crystal; enables high-accuracy system clock generation and PLL input source |
| OSCSEL | Oscillator selection control | Configures clock source: external crystal (XTAL/EXTAL), external clock, or internal oscillators (HOCO/LOCO) |
| USB_VBUS, USB_DP, USB_DM | USB transceiver interface | VBUS detection input; DP/DM differential pair for full-speed USB 2.0 communication with internal transceiver and 3.3 V regulator |
| AD0–AD23 | Analog input channels | 24 dedicated pins for 12-bit S12ADE ADC; each supports programmable sampling time and disconnection detection |
| DA0, DA1 | Digital-to-analog outputs | Two buffered 12-bit DAC outputs (R12DAA), voltage range 0.4 V to AVCC0 − 0.5 V, usable for sensor calibration or analog actuation |
| CTSU0–CTSU23 | Capacitive touch sense inputs | 24 pins configurable for self-capacitance touch sensing (up to 24 keys) or mutual capacitance matrix (up to 144 keys) |
| SCI5_TXD, SCI5_RXD, SCI5_SCK | IrDA-capable serial interface | SCI5 channel supports IrDA 1.0 encoding/decoding when paired with external IR LED/detector; enables contactless HMI |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | Hardware IEEE 754 single-precision engine enables real-time signal processing (e.g., motor control algorithms or sensor fusion) without software emulation overhead |
| Event Link Controller (ELC) | Direct hardware linking of 61 event sources (e.g., timer overflow, GPIO edge) to peripherals like ADC or PWM - eliminates CPU polling and ISR latency in deterministic systems |
| Trusted Secure IP (TSIP-Lite) | AES-128/256 acceleration with key protection, true RNG, and tamper-resistant key storage - meets IEC 60730 Class B security requirements for firmware integrity |
| Low-power timer (LPT) | 16-bit counter running on sub-clock (32.768 kHz) or IWDT oscillator during software standby mode - enables wake-up at precise intervals without full MCU restart |
| Capacitive touch sensing unit (CTSU) | Self-capacitance mode supports 24 independent touch keys with built-in noise rejection; requires no external components, reducing BOM and PCB area for HMI interfaces |
Applications
| Industrial HMI Panel | Smart Sensor Node |
|---|---|
Use Scenario: Touch-enabled local control panel for HVAC or PLC interface with display backlight dimming and status LEDs. IC Role / Device Role / Timing Role: Main controller executing UI logic, driving capacitive touch overlay, managing USB CDC for configuration, and generating PWM for LED dimming via MTU2a. Use Value: Integrated CTSU eliminates external touch controller; TSIP-Lite secures firmware updates over USB; 54 MHz CPU handles real-time graphics rendering and sensor polling simultaneously. |
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality with wireless upload via USB or UART-to-LoRa bridge. IC Role / Device Role / Timing Role: Sensor hub aggregating data from analog sensors (via 12-bit ADC), conditioning signals (FPU-based compensation), and managing low-power sleep/wake cycles using LPT and RTC alarms. Use Value: 8 KB data flash stores calibration coefficients with BGO; 1.8 V operation extends battery life; ELC-triggered ADC sampling reduces active time and power consumption. |
| Secure Firmware Gateway | USB-Capable Industrial Controller |
Use Scenario: Field-deployable gateway authenticating and decrypting firmware images before loading into external flash or FPGA configuration memory. IC Role / Device Role / Timing Role: Cryptographic co-processor verifying AES-GCM signatures and decrypting payloads using TSIP-Lite, with secure key storage and RNG for session keys. Use Value: Hardware-accelerated AES avoids timing side-channel leaks; true RNG prevents predictable IVs; 384 KB flash hosts bootloader and crypto stack without external memory. |
Use Scenario: Programmable logic controller (PLC) module with USB-based configuration, diagnostics, and firmware update capability alongside discrete I/O control. IC Role / Device Role / Timing Role: System-on-module controller handling USB device enumeration (CDC/DFU), real-time I/O scanning via GPIO and TPU timers, and watchdog supervision (WDT + IWDT). Use Value: Dual watchdogs (WDTA + IWDTa) satisfy functional safety requirements; USB transceiver with internal regulator removes need for external VBUS switch or LDO; 5-V-tolerant GPIO simplifies interfacing with legacy industrial sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52317ADND#U0 | Same package and pinout; differs only in security function - lacks TSIP-Lite encryption engine and true RNG | Suitable for cost-sensitive non-secure applications where firmware signing or encrypted comms are not required | Select R5F52317ADND#U0 if cryptographic acceleration and secure key storage are unnecessary; retains identical peripheral set and performance |
| R5F52318BDND#U0 | Same package and pinout; adds 128 KB more flash (512 KB total) and 32 KB more RAM (64 KB), but no SDHI or CAN | Better suited for applications requiring larger firmware image size or complex data buffering (e.g., protocol stacks or logging buffers) | Choose R5F52318BDND#U0 when additional code space or runtime memory is needed; maintains identical peripheral complement and security features |
Compared with R5F52317BDND#00, R5F52317ADND#U0 removes hardware crypto to reduce cost and power, while R5F52318BDND#U0 increases memory capacity without altering peripheral functionality - both retain identical USB, SCI, CTSU, ADC/DAC, and low-power capabilities in the same 64-pin HWQFN footprint.
Availability
R5F52317BDND#00 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, secure firmware gateways, and USB-capable industrial controllers requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for R5F52317BDND#00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX231 Group - including R5F52317BDND#00 - was designed for secure, low-power embedded control in industrial human-machine interfaces and sensor edge devices, emphasizing real-time responsiveness, integrated analog/mixed-signal capability, and hardware-based security.
FAQ
What is the maximum operating frequency and CPU performance of the R5F52317BDND#00?
The R5F52317BDND#00 operates at a maximum frequency of 54 MHz and delivers 88.56 DMIPS using the RXv2 32-bit CPU core. Its performance includes hardware floating-point (IEEE 754 single-precision), 32-bit multiply-accumulate, and fast interrupt response - enabling deterministic real-time execution for motor control, sensor fusion, and UI rendering tasks within the R5F52317BDND#00's resource constraints.
Does the R5F52317BDND#00 support CAN or SD host interface?
No, the R5F52317BDND#00 does not support CAN or SD host interface (SDHI). Per Table 1.3 in the official datasheet R01DS0261EJ0120, this part number is explicitly marked "Not available" for both CAN and SDHI functions. These modules are present in higher-pin-count variants (e.g., 100-pin RX231 parts) but omitted in the 64-pin R5F52317BDND#00 to optimize cost and package size for HMI and sensor applications.
What security features are included in the R5F52317BDND#00?
The R5F52317BDND#00 integrates TSIP-Lite, Renesas' Trusted Secure IP engine, supporting AES-128/256 in ECB, CBC, GCM, and other modes, along with a true random number generator (TRNG) and secure key management. These features enable firmware authentication, encrypted communication, and tamper-resistant key storage - satisfying IEC 60730 Class B requirements and making the R5F52317BDND#00 suitable for secure boot and OTA update implementations.
What is the package type and thermal specification of the R5F52317BDND#00?
The R5F52317BDND#00 uses a 64-pin HWQFN package (PWQN0064KC-A), measuring 9 × 9 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for industrial temperature range −40 to +85°C (D version), with guaranteed operation across this range under specified VCC (1.8–5.5 V) and load conditions - validated per Renesas qualification standards and documented in the R01DS0261EJ0120 datasheet.
How many ADC and DAC channels does the R5F52317BDND#00 provide?
The R5F52317BDND#00 includes a 24-channel 12-bit successive-approximation ADC (S12ADE) with minimum conversion time of 0.83 µs and per-channel programmable sampling time, plus two independent 12-bit DAC channels (R12DAA) with output voltage range of 0.4 V to AVCC0 − 0.5 V. These analog resources are fully supported in the R5F52317BDND#00 and confirmed in Tables 1.1 and 1.3 of the official datasheet.
R5F52317BDND#00 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-WFQFN Exposed Pad
- Series:
- RX231
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52317BDND#00 FAQ
1.How can I place an order for R5F52317BDND#00 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52317BDND#00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52317BDND#00 reliable?
The price and inventory of R5F52317BDND#00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52317BDND#00 is usually 5 days.
3.What payment methods are accepted for R5F52317BDND#00?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52317BDND#00 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52317BDND#00?
R5F52317BDND#00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52317BDND#00 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52317BDND#00?
For technical support, including R5F52317BDND#00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52317BDND#00 requirements.
6.How does Aetrix verify that R5F52317BDND#00 is sourced from the original manufacturer or authorized distributors?
All R5F52317BDND#00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52317BDND#00 meets industry standards.
7.What is the process for return or replacement of R5F52317BDND#00?
All R5F52317BDND#00 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52317BDND#00, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52317BDND#00 part is unused and in its original packaging.
Return procedure for R5F52317BDND#00:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F52317BDND#00 Tags
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