Renesas R5F52317BDNE#20

Overview

R5F52317BDNE#20 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 384 KB on-chip flash memory, 32 KB SRAM, and integrated FPU compliant with IEEE 754 single-precision floating-point standard. It features a 12-bit A/D converter (24 channels), 12-bit D/A converter (2 channels), capacitive touch sensing unit (CTSU) supporting up to 24 keys, USB 2.0 full-speed host/function/OTG, CAN interface, and TSIP-Lite encryption engine for AES-128/256. It targets industrial HMI and smart sensor nodes requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F52317BDNE#20 datasheet, R5F52317BDNE#20 pinout, R5F52317BDNE#20 application, or R5F52317BDNE#20 equivalent, key selection considerations include its 48-pin HWQFN package (7 × 7 mm, 0.5 mm pitch), −40 to +85°C temperature grade (D version), absence of SDHI and CAN modules per package-specific configuration, and support for ELC-driven event-triggered peripheral operation without CPU intervention.

Technical Context

The R5F52317BDNE#20 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling 88.56 DMIPS at 54 MHz. It integrates an on-chip FPU, memory protection unit (MPU), and dual-clock domain architecture-ICLK at 54 MHz for CPU/system, PCLKA at 54 MHz for MTU2a, and PCLKD at 54 MHz for S12AD-enabling precise timing-critical analog acquisition.

Its low-power design includes three operational modes (sleep, deep sleep, software standby), a low-power timer (LPT) running on sub-clock or IWDT oscillator, and module stop control. The device supports background operation (BGO) for 8 KB data flash and uses the Event Link Controller (ELC) to trigger 61 types of peripheral events-including A/D conversion start and PWM output-while the CPU remains in sleep state.

Key Specifications

Pinout & Package

Package: 48-pin HWQFN (PWQN0048KB-A), 7 × 7 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F52317BDNE#20, R5F52317ADNE#U0 removes security and touch features to reduce cost, while R5F52318BDNE#U0 expands memory and adds SDHI-both maintain identical pinout and thermal footprint for drop-in compatibility in space-constrained designs.

Availability

R5F52317BDNE#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, USB test fixtures, and secure firmware gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F52317BDNE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group, which includes R5F52317BDNE#20, was designed for cost-optimized industrial and consumer applications demanding real-time performance, low-power operation, and integrated security-without requiring external memory or complex power management.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52317BDNE#20?

The R5F52317BDNE#20 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 88.56 DMIPS and includes an IEEE 754-compliant floating-point unit, memory protection unit (MPU), and on-chip debugging circuit-making it suitable for deterministic real-time control tasks in industrial applications.

Does the R5F52317BDNE#20 support USB device, host, and OTG functionality?

Yes, the R5F52317BDNE#20 integrates a USB 2.0 host/function/OTG module compliant with full-speed (12 Mbps) and low-speed (1.5 Mbps) operation. It supports isochronous transfers, BC1.2 battery charging detection, and internal USB power regulation-allowing bus-powered operation when VCC is 4.0–5.5 V. This eliminates the need for external USB PHY or power-switching circuitry in compact designs.

What analog peripherals are integrated into the R5F52317BDNE#20?

The R5F52317BDNE#20 includes a 12-bit S12ADE A/D converter with 24 input channels and 0.83 µs minimum conversion time, a 12-bit R12DAA D/A converter with two output channels, a temperature sensor (TEMPSA), and a 2-channel analog comparator (CMPBa). It also features a capacitive touch sensing unit (CTSU) supporting up to 24 self-capacitance keys-enabling integrated HMI without external components.

Is the R5F52317BDNE#20 compatible with the Renesas E2 studio IDE and Flash Programmer tools?

Yes, the R5F52317BDNE#20 is fully supported by Renesas e2 studio IDE, CS+ development environment, and Flash Programmer 2 tool. It works with the E2 Lite and E2 emulator debug interfaces via the FINE port. These tools provide full C/C++ debugging, flash programming, and real-time trace capabilities-ensuring rapid firmware development and validation for the R5F52317BDNE#20.

What is the operating temperature range and package type of the R5F52317BDNE#20?

The R5F52317BDNE#20 is rated for −40 to +85°C operation (D-grade) and housed in a 48-pin HWQFN package (PWQN0048KB-A) measuring 7 × 7 mm with 0.5 mm pitch and an exposed thermal pad. This compact, thermally efficient package supports high-density PCB layouts and meets industrial reliability requirements without requiring external heat sinking.