Renesas R5F52317BGFM#10

Overview

R5F52317BGFM#10 from Renesas is a 32-bit RXv2 microcontroller with 384 KB on-chip flash, 32 KB SRAM, and 8 KB data flash, operating at up to 54 MHz (88.56 DMIPS) with integrated FPU, USB 2.0 full-speed host/function/OTG, CAN, 24-channel 12-bit A/D converter, and capacitive touch sensing unit - deployed in industrial HMI and smart sensor nodes requiring real-time control and secure connectivity.

For engineers reviewing the R5F52317BGFM#10 datasheet, R5F52317BGFM#10 pinout, R5F52317BGFM#10 application, or R5F52317BGFM#10 equivalent, this page delivers verified specifications, package mapping to PLQP0064KB-C (10 × 10 mm, 0.5 mm pitch), validated peripheral configuration, and confirmed alternative options for industrial embedded design and IEC60730-compliant systems.

Technical Context

The R5F52317BGFM#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, supporting IEEE 754-compliant single-precision FPU and 32-bit multiply-accumulate operations. It integrates ELC for interrupt-free module linking and DTC for efficient data transfers without CPU intervention.

Its clock system includes main (1–20 MHz), sub-clock (32.768 kHz), and USB-dedicated PLL (4/6/8/12 MHz), enabling independent 54 MHz system clock (ICLK) and 48 MHz USB clock. The MCU supports three low-power modes and operates across 1.8–5.5 V with −40 to +105°C temperature range (G version).

Key Specifications

Pinout & Package

Package: PLQP0064KB-C - 64-pin Low-Profile Quad Flat Package, 10 × 10 mm body, 0.5 mm pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52317ADFM#30, the R5F52317BGFM#10 adds CAN and SDHI while extending temperature range to +105°C; versus R5F52318BGFM#30, it trades 128 KB flash and 32 KB RAM for cost-sensitive deployments where full memory headroom is unnecessary.

Availability

R5F52317BGFM#10 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, medical diagnostic devices, and building automation controllers requiring stable component supply across extended temperature environments.

Supply support for R5F52317BGFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group, including R5F52317BGFM#10, is engineered for real-time industrial control and human-machine interface applications demanding high computational throughput, functional safety support, and rich peripheral integration.

FAQ

What is the maximum operating frequency and core performance of the R5F52317BGFM#10?

The R5F52317BGFM#10 operates at a maximum system clock frequency of 54 MHz using the RXv2 CPU core, delivering 88.56 DMIPS. Its on-chip FPU supports IEEE 754-compliant single-precision floating-point operations, and the 5-stage pipeline enables one-instruction-per-cycle execution for deterministic real-time response. This performance level is sustained across its full 1.8–5.5 V supply range and −40 to +105°C operating temperature.

Does the R5F52317BGFM#10 support CAN communication, and what is its compliance level?

Yes, the R5F52317BGFM#10 integrates a CAN module compliant with ISO 11898-1, supporting standard and extended frames at up to 1 Mbps. It includes 16 message boxes for flexible mailbox configuration and operates independently of CPU load via ELC-triggered transmission/reception. This capability is confirmed in Table 1.2 of the datasheet for the RX231 Group in 64-pin packages like PLQP0064KB-C.

What package type and pin count does the R5F52317BGFM#10 use?

The R5F52317BGFM#10 uses the PLQP0064KB-C package: a 64-pin Low-Profile Quad Flat Package measuring 10 × 10 mm with 0.5 mm pitch and an exposed thermal pad. This package is explicitly listed in Table 1.4 (G-version products) and Table 1.2 (RX231 Group 64-pin support) of the R01DS0261EJ0120 datasheet.

How much on-chip memory does the R5F52317BGFM#10 include, and what are its endurance characteristics?

The R5F52317BGFM#10 includes 384 KB of on-chip flash memory for program storage, 32 KB of SRAM for runtime data, and 8 KB of data flash rated for 1,000,000 program/erase cycles (typical). Flash access is zero-wait-state up to 32 MHz and supported by a ROM accelerator for higher frequencies; data flash supports background operation (BGO) for concurrent read/write execution.

Is the R5F52317BGFM#10 qualified for IEC60730 safety standards, and which hardware features enable compliance?

Yes, the R5F52317BGFM#10 includes hardware-assisted functions for IEC60730 Class B compliance, including self-diagnostic support for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the Data Operation Circuit (DOC). These features reduce software validation effort and are documented in the "Useful functions for IEC60730 compliance" section of the datasheet.