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Renesas R5F52317BGFM#30
- Part No.:
- R5F52317BGFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F52317BGFM#30.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:305
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Product details
Overview
R5F52317BGFM#30 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 384 KB on-chip flash memory, 32 KB SRAM, and integrated 12-bit A/D converter (24 channels), 12-bit D/A converter (2 channels), USB 2.0 full-speed host/function/OTG, CAN interface, capacitive touch sensing unit (24 keys), and TSIP-Lite encryption engine. It operates across −40 to +105°C and targets industrial HMI, motor control, and secure IoT edge nodes.
For engineers reviewing the R5F52317BGFM#30 datasheet, R5F52317BGFM#30 pinout, R5F52317BGFM#30 application, or R5F52317BGFM#30 equivalent, this page delivers verified technical context, package-specific peripheral mapping, real-world use-value analysis, and validated alternative options for thermal-extended industrial designs requiring USB-CAN coexistence, analog signal acquisition, and firmware security.
Technical Context
The R5F52317BGFM#30 implements the RXv2 CPU core with IEEE 754-compliant 32-bit FPU, 88.56 DMIPS performance at 54 MHz, and CISC Harvard architecture with 5-stage pipeline. It integrates dual-clock domain operation: ICLK at 54 MHz for CPU/system, PCLKA at 54 MHz for MTU2a, and PCLKD at 54 MHz for S12ADE ADC - enabling simultaneous high-speed control and precision analog capture.
Its ELC (Event Link Controller) enables 61 event sources to trigger peripheral actions-including A/D conversion start-without CPU intervention, while the TSIP-Lite module supports AES-128/256 in GCM/CBC/ECB modes with true random number generation and key protection, satisfying IEC60730 Class B requirements for self-diagnostic firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 54 MHz max, 88.56 DMIPS, IEEE 754 FPU, 5-stage pipeline - enables deterministic real-time control with floating-point math for sensor fusion or motor algorithms. |
| Memory | 384 KB flash (no-wait ≤32 MHz), 32 KB SRAM (no-wait at 54 MHz), 8 KB data flash (1M erase cycles) - supports field firmware updates and parameter storage without external EEPROM. |
| Analog Peripherals | 24-channel 12-bit S12ADE ADC (0.83 µs conversion), 2-channel 12-bit R12DAA DAC (0.4–AVCC0−0.5 V output), TEMPSA temperature sensor - enables closed-loop analog control with sub-microsecond sampling. |
| Communication | USB 2.0 FS host/function/OTG (12 Mbps), CAN 2.0B (1 Mbps), 7× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI - provides native connectivity for industrial gateways with dual-bus protocol bridging. |
| Security & Safety | TSIP-Lite AES-128/256 (GCM/CBC/ECB), CRC calculator, MPU, IWDT with dedicated 15-kHz oscillator, RAM test assistance - meets IEC60730 self-test requirements for Class B appliance control. |
| Package & Temp | 64-pin LFQFP (PLQP0064KB-C), 10 × 10 mm, 0.5 mm pitch, −40 to +105°C operating range - suitable for convection-cooled industrial enclosures without derating. |
Pinout & Package
64-pin Low-Profile Quad Flat Package (LFQFP), PLQP0064KB-C, 10 × 10 mm body, 0.5 mm pitch, exposed thermal pad (not electrically connected). Pinout conforms to RX231 Group 64-pin configuration per Table 1.2 of R01DS0261EJ0120 Rev.1.20.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 1.8–5.5 V supply pins with decoupling support; VCC_USB internally powered during USB operation when VCC = 4.0–5.5 V. |
| XTAL, EXTAL | Main clock oscillator input/output | Supports 1–20 MHz crystal; required for precise timing in USB/RTC/clock-synchronous peripherals. |
| OSCSEL | Oscillator selection control | Configures main clock source: crystal (XTAL/EXTAL), external clock, or on-chip oscillators - critical for boot mode selection. |
| USB_VBUS, USB_ID, USB_DP, USB_DM | USB physical layer interface | Full-speed USB transceiver pins; USB_ID enables OTG role negotiation; USB_VBUS detection supports BC1.2 battery charging. |
| TXD0/RXD0, TXD1/RXD1 | SCI0/SCI1 serial interface | Asynchronous UART pins with programmable baud rate generator; support hardware flow control and LIN protocol via SCIh. |
| CTX0–CTX23 | Capacitive touch sensing inputs | 24 dedicated CTSU channels; support self-capacitance (24 keys) or mutual-capacitance (up to 144 keys) - enables robust touch HMI without external ICs. |
Key Features
| Feature | Design Value |
|---|---|
| ELC-triggered A/D conversion | Starts S12ADE conversion directly from timer (MTU/TPU) or external event without CPU ISR overhead - reduces jitter in time-critical sampling. |
| TSIP-Lite cryptographic engine | Hardware-accelerated AES-128/256 with GCM authentication, true RNG, and key protection - enables secure OTA updates and device identity binding. |
| Multi-domain clock system | Independent ICLK (54 MHz), PCLKA (54 MHz), PCLKD (54 MHz), and BCLK (32 MHz) domains - allows concurrent high-speed CPU execution and peripheral operation without clock contention. |
| IEC60730 safety assist | Integrated RAM test, ADC self-diagnostic, IWDT disconnection detection, and DOC-based data integrity checks - simplifies Class B certification evidence collection. |
| Low-power timer (LPT) | 16-bit counter running on sub-clock (32.768 kHz) or IWDT oscillator during software standby - enables wake-up at precise intervals without RTC power domain activation. |
Applications
| Industrial HMI Panel | Secure IoT Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with local data logging and USB configuration port. IC Role / Device Role / Timing Role: Main controller executing HMI graphics, managing CTSU touch scan, buffering SDHI logs, and handling USB CDC/DFU communication. Use Value: Integrated 24-key CTSU eliminates external touch controller; USB+CAN coexistence enables simultaneous field service and machine bus monitoring. |
Use Scenario: Edge node aggregating Modbus RTU sensors over RS485 (via SCI) and forwarding encrypted data via USB-to-host or CAN-to-PLC. IC Role / Device Role / Timing Role: Protocol translator and security enforcer - performs AES-GCM encryption on sensor payloads before transmission. Use Value: TSIP-Lite hardware crypto prevents firmware tampering; dual USB/CAN interfaces eliminate need for external bridge ICs. |
| Motor Control Subsystem | Thermal Management Module |
Use Scenario: Closed-loop BLDC motor driver with current sensing, PWM generation, and thermal shutdown monitoring. IC Role / Device Role / Timing Role: Real-time motion controller using MTU2a complementary PWM outputs and S12ADE for shunt current measurement. Use Value: 0.83 µs ADC conversion enables >1 MHz current loop sampling; 54 MHz CPU sustains complex FOC algorithms with floating-point math. |
Use Scenario: HVAC zone controller measuring ambient temperature, humidity (via I2C sensor), and coil surface temp via internal TEMPSA. IC Role / Device Role / Timing Role: Analog acquisition hub - reads TEMPSA, triggers S12ADE for external thermistors, and drives R12DAA for valve actuation. Use Value: On-die temperature sensor calibrated against S12ADE reference channel improves thermal accuracy; 12-bit DAC provides precise 0–10 V actuator control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52317ADFM#30 | D-version (−40 to +85°C), same 384 KB flash/32 KB RAM, but lacks CAN and SDHI modules per Table 1.2. | Suitable for non-automotive/non-industrial environments where extended temperature and CAN bus are unnecessary. | Select when thermal margin is sufficient and CAN/SDHI are unused - lower cost, identical pinout and firmware compatibility. |
| R5F52318BGFM#30 | G-version with 512 KB flash, 64 KB RAM, same package and temperature rating; adds CAN and SDHI support. | Required for designs needing larger firmware image, more RAM for USB stack buffers, or SD card logging capability. | Choose when future firmware expansion, CAN diagnostics, or removable media support are planned - drop-in compatible with no PCB changes. |
Compared with R5F52317BGFM#30, R5F52317ADFM#30 trades extended temperature and CAN for cost savings in benign environments, while R5F52318BGFM#30 adds flash/RAM headroom and CAN/SDHI without altering layout - making it ideal for scalable industrial platforms.
Availability
R5F52317BGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, motor control subsystems, and secure IoT gateway designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F52317BGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX231 Group - including R5F52317BGFM#30 - was designed for thermally demanding industrial control applications requiring integrated USB, CAN, analog precision, and hardware security in compact 64-pin packages.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F52317BGFM#30?
The R5F52317BGFM#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS performance. It includes an IEEE 754-compliant single-precision FPU, 5-stage pipeline, and variable-length instruction set - enabling efficient execution of floating-point-intensive tasks like motor control or sensor fusion without external coprocessors.
Does the R5F52317BGFM#30 support CAN communication, and what is its compliance level?
Yes, the R5F52317BGFM#30 includes one CAN module (RSCAN) compliant with ISO 11898-1, supporting standard and extended frames at up to 1 Mbps. This capability is confirmed in Table 1.2 of the datasheet for the RX231 Group 64-pin variants, making R5F52317BGFM#30 suitable for industrial fieldbus integration and diagnostic messaging.
What analog peripherals are integrated into the R5F52317BGFM#30?
The R5F52317BGFM#30 integrates a 24-channel 12-bit S12ADE A/D converter (0.83 µs conversion time), two 12-bit R12DAA D/A converters (0.4–AVCC0−0.5 V output), and a TEMPSA temperature sensor. These are fully supported in the 64-pin LFQFP package per datasheet Table 1.2, enabling high-fidelity analog I/O for closed-loop control and environmental monitoring.
Is the R5F52317BGFM#30 qualified for extended temperature operation?
Yes, the R5F52317BGFM#30 is rated for −40 to +105°C operation (G-version), validated per Renesas specification R01DS0261EJ0120. Its thermal design includes dedicated low-speed oscillators for IWDT/LPT operation and voltage detection circuits with 14-level LVD settings - ensuring reliable function in industrial enclosures without active cooling.
What security features does the R5F52317BGFM#30 provide for firmware protection?
The R5F52317BGFM#30 incorporates TSIP-Lite, offering hardware-accelerated AES-128/256 encryption (GCM/CBC/ECB), true random number generation, secure key management, and memory protection unit (MPU) enforcement. These features are documented in the datasheet's "Encryption Functions" section and support IEC60730 Class B self-test requirements for secure boot and OTA update integrity.
R5F52317BGFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX231
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52317BGFM#30 FAQ
1.How can I place an order for R5F52317BGFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52317BGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52317BGFM#30 reliable?
The price and inventory of R5F52317BGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52317BGFM#30 is usually 5 days.
3.What payment methods are accepted for R5F52317BGFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52317BGFM#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52317BGFM#30?
R5F52317BGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52317BGFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52317BGFM#30?
For technical support, including R5F52317BGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52317BGFM#30 requirements.
6.How does Aetrix verify that R5F52317BGFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F52317BGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52317BGFM#30 meets industry standards.
7.What is the process for return or replacement of R5F52317BGFM#30?
All R5F52317BGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52317BGFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52317BGFM#30 part is unused and in its original packaging.
Return procedure for R5F52317BGFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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