Renesas R5F52317BGND#40

Overview

R5F52317BGND#40 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 384 KB on-chip flash memory, 8 KB data flash, and 32 KB SRAM. It integrates a single-precision IEEE 754 FPU, 12-bit 24-channel ADC (0.83 µs conversion), dual 12-bit DAC channels, USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), and capacitive touch sensing (24 keys). It targets industrial HMI and smart sensor nodes requiring real-time control, secure firmware, and mixed-signal interfacing.

For engineers reviewing the R5F52317BGND#40 datasheet, R5F52317BGND#40 pinout, R5F52317BGND#40 application, or R5F52317BGND#40 equivalent, key selection criteria include its 64-pin HWQFN (9 × 9 mm) package, −40 to +105°C extended temperature grade, integrated TSIP-Lite encryption engine (AES-128/256, GCM/CBC), and support for ELC-triggered peripheral coordination without CPU wake-up.

Technical Context

The R5F52317BGND#40 belongs to the RX231 Group and implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It supports little-endian or big-endian data arrangement and executes at up to 88.56 DMIPS at 54 MHz, with hardware divider (2-cycle min), 32-bit MAC, and on-chip MPU for memory protection.

Its clock system includes main (1–20 MHz), sub (32.768 kHz), and on-chip oscillators, plus PLL and USB-dedicated PLL - enabling independent 54 MHz ICLK and 48 MHz USBCLK. Power management features three low-power modes, LPT operation during software standby, and voltage detection across three configurable LVD circuits.

Key Specifications

Pinout & Package

Package: PWQN0064KC-A - 64-pin Heat Sink Quad Flat No-lead (HWQFN), 9 × 9 mm body, 0.5 mm pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52317ADND#U0, the R5F52317BGND#40 adds extended temperature support and CAN/SDHI - critical for industrial deployment; versus R5F52318BGND#U0, it trades flash/RAM capacity for tighter BOM cost while retaining identical peripheral set and thermal robustness.

Availability

R5F52317BGND#40 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, automotive body control modules, and medical diagnostic devices requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F52317BGND#40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX231 Group, which includes R5F52317BGND#40, was designed for cost-sensitive industrial and consumer applications demanding high computational throughput, rich analog integration, and hardware security - all within compact QFN packages.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52317BGND#40?

The R5F52317BGND#40 operates at a maximum system clock frequency of 54 MHz using its RXv2 CPU core, delivering 88.56 DMIPS of processing performance. Its hardware floating-point unit (FPU) complies with IEEE 754 single-precision standards, and the on-chip divider achieves minimum instruction execution in two CPU clock cycles - enabling deterministic real-time response for motor control and sensor fusion tasks in the R5F52317BGND#40.

Does the R5F52317BGND#40 support CAN communication, and what protocol versions are implemented?

Yes, the R5F52317BGND#40 integrates a CAN module compliant with ISO 11898-1, supporting both standard (11-bit) and extended (29-bit) frame formats at up to 1 Mbps. It includes 16 message boxes with flexible acceptance filtering and supports error confinement and bus-off recovery - making it suitable for industrial fieldbus and automotive body network applications using the R5F52317BGND#40.

What security features does the R5F52317BGND#40 provide for firmware and data protection?

The R5F52317BGND#40 incorporates TSIP-Lite, a hardware security engine supporting AES-128 and AES-256 in ECB, CBC, GCM, and CMAC modes, plus a true random number generator and secure key management. These features enable secure boot verification, encrypted firmware updates, and protected data logging - directly addressing IEC 60730 Class B compliance requirements in the R5F52317BGND#40.

What is the package type and thermal specification of the R5F52317BGND#40?

The R5F52317BGND#40 uses the PWQN0064KC-A package: a 64-pin HWQFN with 9 × 9 mm body, 0.5 mm pitch, and exposed thermal pad. It is rated for operation from −40 to +105°C (G-grade), making it suitable for under-hood automotive, factory-floor, and outdoor industrial environments where thermal reliability is critical for sustained R5F52317BGND#40 deployment.

How does the R5F52317BGND#40 handle low-power operation in battery-powered applications?

The R5F52317BGND#40 supports three low-power modes - sleep, deep sleep, and software standby - with the Low Power Timer (LPT) continuing operation during software standby using the 32.768 kHz sub-clock or IWDT oscillator. This enables precise wake-up intervals without CPU involvement, significantly extending battery life in portable or remote R5F52317BGND#40-based systems.