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Renesas R5F52317BGNE#20

Part No.:
R5F52317BGNE#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-WFQFN Exposed Pad
Datasheet:
AetrixR5F52317BGNE#20.pdf
Description:
IC MCU 32BIT 384KB FLASH 48HWQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:416

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Product details

Overview

R5F52317BGNE#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 384 KB on-chip flash, 32 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite AES-128/256). It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit ADC (0.83 µs conversion), dual 12-bit DAC, RTC with battery backup, and capacitive touch sensing (24 keys) - deployed in industrial HMI and smart sensor edge nodes.

For engineers reviewing the R5F52317BGNE#20 datasheet, R5F52317BGNE#20 pinout, R5F52317BGNE#20 application, or R5F52317BGNE#20 equivalent, key selection criteria include its 48-pin HWQFN (7 × 7 mm, 0.5 mm pitch) package, −40 to +105°C extended temperature rating (G version), CAN + USB coexistence, and TSIP-Lite security for firmware integrity in connected industrial devices.

Technical Context

The R5F52317BGNE#20 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions, enabling ultra-compact code and fast interrupt response. Its clock system integrates main (1–20 MHz), sub (32.768 kHz), and on-chip oscillators, plus PLLs for 54 MHz system clock and 48 MHz USB clock - all managed via independent ICLK, PCLKA/B/D, BCLK, and FCLK domains.

Peripheral integration includes ELC for event-driven module triggering without CPU intervention, DTC for interrupt-triggered transfers, and MPC for flexible pin function assignment. The device supports software standby mode with active low-power timer (LPT) and RTC operation on VBAT, meeting IEC60730 functional safety requirements via built-in self-test aids for ADC, IWDT, clock accuracy (CAC), and RAM.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit, 54 MHz max, 88.56 DMIPS, IEEE 754 FPU, MPU, and DSP instructions
Memory 384 KB flash (no-wait ≤32 MHz), 32 KB SRAM (no-wait @54 MHz), 8 KB data flash (1M erase cycles)
Analog Peripherals 24-channel 12-bit ADC (0.83 µs min conversion), 2×12-bit DAC (0.4–AVCC0−0.5 V), 2× comparator units
Communication USB 2.0 FS host/function/OTG (12 Mbps), CAN 2.0B (1 Mbps), 6× SCI, 1× I2C, 1× RSPI, 1× SSI, 1× SDHI
Security & Timing TSIP-Lite AES-128/256 (GCM/ECB/CBC), true RNG, RTC with calendar mode, LVD with 14-level detection
Package & Environment 48-pin HWQFN (PWQN0048KB-A), 7 × 7 mm, 0.5 mm pitch, −40 to +105°C operating range

Pinout & Package

Package: 48-pin HWQFN (PWQN0048KB-A), 7 × 7 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VCC, VSS Power supply and ground Core/analog/digital power rails (1.8–5.5 V); multiple VSS pins ensure low-noise grounding
XTAL, EXTAL Main crystal oscillator interface Supports 1–20 MHz external crystal for precise system clock generation
RTC_XT1, RTC_XT2 Sub-clock oscillator interface Connects 32.768 kHz crystal for battery-backed RTC operation
USB_VBUS, USB_DP, USB_DM USB 2.0 physical layer Full-speed USB transceiver with internal regulator; VBUS sensing enables host/device role detection
TXD0, RXD0 SCI0 asynchronous serial interface Dedicated UART pins for debug console or peripheral communication (3.3 V logic, 5 V tolerant)
CTX0–CTX23 Capacitive touch sensing inputs 24 dedicated CTSU channels supporting self- or mutual-capacitance key scanning

Key Features

Feature Design Value
Floating-point unit (FPU) IEEE 754-compliant 32-bit single-precision arithmetic accelerates motor control and sensor fusion math
Event Link Controller (ELC) Enables 61-event-triggered peripheral operation (e.g., ADC start on timer match) without CPU wake-up
TSIP-Lite encryption engine Hardware AES-128/256 with GCM/ECB/CBC modes and secure key management prevents firmware cloning
Capacitive Touch Sensing Unit (CTSU) Supports 24-key self-capacitance or 144-key matrix scan with noise immunity for industrial HMI panels
IEC60730 compliance support Built-in diagnostics for ADC, IWDT, CAC, and RAM reduce certification effort for Class B safety applications

Applications

Industrial HMI Panel Smart Sensor Node

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time status display and parameter adjustment.

IC Role / Device Role / Timing Role: Main controller executing UI logic, managing capacitive touch input, driving display via SPI/SSI, and communicating over CAN/USB to host systems.

Use Value: Integrated CTSU eliminates external touch controller; 54 MHz CPU + FPU enables responsive graphics rendering and local analytics.

Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and vibration in factory settings.

IC Role / Device Role / Timing Role: System-on-chip handling analog sensor acquisition (ADC), signal conditioning (DAC), secure OTA updates (TSIP-Lite), and low-power wireless gateway interfacing (USB/CAN).

Use Value: Software standby mode with active LPT and RTC enables multi-year battery life; −40 to +105°C rating ensures reliability in uncontrolled enclosures.

USB-CAN Bridge Device Secure Firmware Updater

Use Scenario: Field-deployable adapter converting USB commands from PC tools into CAN bus messages for automotive ECUs.

IC Role / Device Role / Timing Role: Dual-role USB device (CDC class) and ISO11898-1 CAN controller with synchronized timestamping via ELC-linked timers.

Use Value: On-chip USB PHY and CAN transceiver interface reduce BOM cost; 54 MHz CPU handles protocol translation with minimal latency.

Use Scenario: Trusted bootloader module verifying signed firmware images before flashing in medical or industrial equipment.

IC Role / Device Role / Timing Role: Secure root-of-trust executing authenticated boot, AES-GCM decryption of encrypted firmware, and tamper-resistant key storage.

Use Value: TSIP-Lite prevents unauthorized firmware modification; hardware RNG and secure key isolation meet IEC62443-3-3 SL2 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F52317ADNE#U0 D-version (−40 to +85°C); same 384 KB flash, 32 KB RAM, but lacks CAN module and SDHI Suitable for non-automotive/non-industrial environments where extended temperature and CAN are unnecessary Select when cost sensitivity outweighs extended temp/CAN requirement and ambient stays within commercial range
R5F52318BGNE#U0 G-version with 512 KB flash, 64 KB RAM, identical peripherals and package; higher memory density only Preferred for future-proofing firmware growth or adding complex protocol stacks (e.g., USB CDC + CAN FD) Choose when additional flash/RAM headroom is needed for field upgrades or feature expansion without layout change

Compared with R5F52317BGNE#20, R5F52317ADNE#U0 trades extended temperature and CAN for lower cost in benign environments, while R5F52318BGNE#U0 provides scalable memory headroom within identical thermal and interface constraints - enabling seamless migration paths without PCB redesign.

Availability

R5F52317BGNE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, USB-CAN bridge devices, and secure firmware updater modules requiring stable component supply across extended temperature ranges.

Supply support for R5F52317BGNE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group - including R5F52317BGNE#20 - is engineered for high-integration industrial control and human-machine interface applications demanding real-time performance, security, and extended temperature resilience.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52317BGNE#20?

The R5F52317BGNE#20 operates at a maximum frequency of 54 MHz and delivers 88.56 DMIPS using the 32-bit RXv2 CPU core. Its performance is enhanced by an integrated IEEE 754-compliant floating-point unit, 5-stage pipeline, and variable-length instruction set - enabling deterministic real-time execution for industrial control algorithms. This performance level is sustained across its full −40 to +105°C operating range.

Does the R5F52317BGNE#20 support CAN communication, and what standard does it comply with?

Yes, the R5F52317BGNE#20 includes a CAN module compliant with ISO11898-1, supporting both standard and extended frames at up to 1 Mbps. It features 16 message boxes and is enabled in the G-version package variants like R5F52317BGNE#20. This makes the R5F52317BGNE#20 suitable for industrial automation networks and diagnostic interfaces where robust, deterministic messaging is required.

What security features does the R5F52317BGNE#20 provide for firmware protection?

The R5F52317BGNE#20 integrates TSIP-Lite - a hardware encryption engine supporting AES-128/256 in ECB, CBC, GCM, and other modes, plus a true random number generator and secure key management. These features prevent unauthorized access, firmware cloning, and tampering, directly supporting IEC62443-3-3 and IEC60730 Class B compliance for secure boot and OTA update validation in the R5F52317BGNE#20.

What is the package type and pin count of the R5F52317BGNE#20?

The R5F52317BGNE#20 uses a 48-pin HWQFN package (part number PWQN0048KB-A), measuring 7 × 7 mm with 0.5 mm pitch and an exposed thermal pad. This compact, surface-mount package supports high-density PCB layouts and provides thermal efficiency for extended-temperature operation - a key specification confirmed for the R5F52317BGNE#20 in Renesas' official documentation.

How does the R5F52317BGNE#20 handle low-power operation in battery-backed applications?

The R5F52317BGNE#20 supports three low-power modes - sleep, deep sleep, and software standby - with the RTC and low-power timer (LPT) remaining active during software standby using VBAT or the dedicated IWDT oscillator. This enables years of operation on coin-cell batteries in sensor nodes, with wake-up events triggered by external pins, timers, or communication activity - a verified capability of the R5F52317BGNE#20 per its datasheet.

R5F52317BGNE#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-WFQFN Exposed Pad
Series:
RX231
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F52317BGNE#20 FAQ

1.How can I place an order for R5F52317BGNE#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F52317BGNE#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F52317BGNE#20 reliable?

The price and inventory of R5F52317BGNE#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52317BGNE#20 is usually 5 days.

3.What payment methods are accepted for R5F52317BGNE#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52317BGNE#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F52317BGNE#20?

R5F52317BGNE#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F52317BGNE#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F52317BGNE#20?

For technical support, including R5F52317BGNE#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52317BGNE#20 requirements.

6.How does Aetrix verify that R5F52317BGNE#20 is sourced from the original manufacturer or authorized distributors?

All R5F52317BGNE#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52317BGNE#20 meets industry standards.

7.What is the process for return or replacement of R5F52317BGNE#20?

All R5F52317BGNE#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52317BGNE#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F52317BGNE#20 part is unused and in its original packaging.

Return procedure for R5F52317BGNE#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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