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Renesas R5F52318AGFM#30
- Part No.:
- R5F52318AGFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F52318AGFM#30.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:320
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Product details
Overview
R5F52318AGFM#30 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 512 KB on-chip flash memory, 64 KB SRAM, and integrated FPU compliant with IEEE754 single-precision floating-point standard. It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit A/D converter (0.83 µs conversion time), and capacitive touch sensing unit for up to 24 keys - deployed in industrial HMI and smart sensor edge nodes.
For engineers reviewing the R5F52318AGFM#30 datasheet, R5F52318AGFM#30 pinout, R5F52318AGFM#30 application, or R5F52318AGFM#30 equivalent, key selection criteria include its 64-pin LFQFP package (PLQP0064KB-C), −40 to +105°C extended temperature grade, SDHI interface support, and absence of CAN module per Table 1.4 - critical for thermal-critical embedded control designs requiring USB+touch+RTC integration without external bus expansion.
Technical Context
The R5F52318AGFM#30 belongs to the RX231 Group and implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It integrates TSIP-Lite encryption engine supporting AES-128/256 in GCM/CBC/ECB modes, plus hardware CRC calculator with three polynomials and true random number generator.
Its clock system includes main oscillator (1–20 MHz), sub-clock (32.768 kHz), PLL (4–12.5 MHz input), USB-dedicated PLL (4/6/8/12 MHz), and CAC for frequency accuracy measurement. Real-time clock operates from sub-clock with calendar mode, alarm, and time-capture functions - all functional in the G-version's −40 to +105°C range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 88.56 DMIPS @ 54 MHz |
| Max Operating Frequency | 54 MHz system clock (ICLK); enables real-time signal processing with deterministic interrupt latency |
| Memory | 512 KB flash (no-wait ≤32 MHz), 64 KB SRAM (no-wait @ 54 MHz), 8 KB data flash (1M erase cycles) |
| Analog Peripherals | 24-channel 12-bit S12ADE A/D converter (0.83 µs min conversion), 2-channel 12-bit R12DAA D/A, TEMPSA temperature sensor |
| Communication Interfaces | USB 2.0 FS/LS OTG (12/1.5 Mbps), 7× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI - no CAN or external bus support in this variant |
| Security & Safety | TSIP-Lite with AES-128/256, CMAC, GCM, true RNG; IEC60730 self-test assistance for A/D, IWDT, RAM, clock accuracy |
| Package & Temp Range | 64-pin LFQFP (PLQP0064KB-C), 10 × 10 mm, 0.5 mm pitch; rated for −40 to +105°C (G version) |
Pinout & Package
64-pin Low-Profile Quad Flat Package (LFQFP) with 10 × 10 mm body, 0.5 mm pitch, and exposed thermal pad (PLQP0064KB-C). Pinout conforms to RX231 Group 64-pin mapping per Figure 1.1 and Table 1.2 - supports full GPIO, peripheral function multiplexing via MPC, and 5-V tolerant inputs on designated pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 1.8–5.5 V supply domains; separate analog/digital VCC pins enable noise isolation for A/D and RTC operation |
| XTAL, EXTAL | Main clock oscillator terminals | Support 1–20 MHz crystal; required for high-accuracy timing and USB PLL lock stability |
| OSC32K, OSC32KOUT | Sub-clock oscillator terminals | Drive 32.768 kHz crystal for RTC, LPT, and low-power wake-up; essential for battery-backed timekeeping |
| USB_VBUS, USB_DP, USB_DM | USB transceiver interface | Full-speed USB 2.0 physical layer; internal VCC_USB regulator eliminates need for external USB power rail when VCC ≥ 4.0 V |
| CTSU_Sx, CTSU_SO | Capacitive touch sensing inputs | 24 dedicated CTSU channels; self-capacitance mode enables robust touch button implementation with minimal external components |
| ADxx, AVCC0, AVSS0 | Analog input and reference | 24-channel A/D input pins; AVCC0/AVSS0 define 0.4–(AVCC0−0.5)V D/A output range and A/D reference voltage |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | IEEE754-compliant 32-bit single-precision arithmetic accelerates motor control and sensor fusion algorithms without software emulation overhead |
| Event Link Controller (ELC) | Direct hardware linking of 61 event sources (e.g., timer overflow, GPIO edge) to peripherals - enables ultra-low-latency response without CPU intervention or ISR overhead |
| Background Operation (BGO) | Data flash programming/erasing while CPU executes code from main flash - ensures uninterrupted real-time task execution during firmware updates |
| Low Power Timer (LPT) | 16-bit counter running on sub-clock or IWDT oscillator during software standby mode - provides precise wake-up intervals without exiting low-power state |
| Temperature sensor integration | TEMPSA output routed directly to S12ADE A/D converter - enables system-level thermal monitoring with no external sensor or signal conditioning |
Applications
| Industrial HMI Panel | Smart Sensor Node |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-connected machinery with real-time status display and parameter adjustment. IC Role / Device Role / Timing Role: Main controller executing GUI logic, managing USB CDC communication with host PC, and sampling capacitive touch keys at 100 Hz. Use Value: Integrated CTSU eliminates external touch controller; 54 MHz CPU + FPU handles graphics rendering and floating-point calculations locally. |
Use Scenario: Battery-powered environmental monitor logging temperature, humidity (via I2C sensor), and vibration (via SPI accelerometer) with periodic USB data dump. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, SDHI-based local storage, and USB mass-storage-class data transfer. Use Value: SDHI interface enables direct FAT32 logging; LPT + RTC allow scheduled wake-up every 15 minutes for low-duty-cycle operation. |
| USB-Capable Medical Device | Thermal-Resilient Industrial Gateway |
Use Scenario: Portable diagnostic tool with analog front-end (ECG/EEG), USB HID interface for PC connection, and real-time waveform display. IC Role / Device Role / Timing Role: Signal processor acquiring 24-channel A/D data at 10 kSPS, applying digital filtering, and streaming over USB CDC ACM. Use Value: 0.83 µs A/D conversion time supports >10 kSPS sampling; TSIP-Lite secures patient data during USB transmission. |
Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU data from field devices and forwarding via USB-to-serial bridge to cloud-connected host. IC Role / Device Role / Timing Role: Protocol translator with dual SCI ports (Modbus slave + USB CDC), RTC timestamping, and thermal monitoring via TEMPSA. Use Value: −40 to +105°C rating ensures reliability in uncooled enclosures; ELC synchronizes Modbus frame timing with hardware timers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52318AGFP#30 | Same RX231 Group, 100-pin LFQFP (14×14 mm), adds external bus interface and 4 more SCI channels | Required for systems needing parallel memory expansion or additional UARTs; larger footprint and higher pin count | Select when external NOR/PSRAM or multi-SCI bridging is needed - not drop-in compatible due to package and pinout mismatch |
| R5F52317AGFM#30 | Same 64-pin LFQFP package and temperature grade, but 384 KB flash, 32 KB RAM, and no SDHI interface | Suitable for cost-sensitive designs omitting SD card logging or high-resolution touch UI | Drop-in replacement only if SDHI and extra 128 KB flash are unused - identical pinout and peripheral register map |
Compared with R5F52318AGFM#30, R5F52318AGFP#30 offers external bus and larger package for scalability, while R5F52317AGFM#30 reduces memory and removes SDHI to lower BOM cost - both retain identical G-grade thermal performance and USB/CTSU/A/D feature set.
Availability
R5F52318AGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, USB medical devices, and thermal-resilient gateways requiring stable component supply across extended temperature ranges.
Supply support for R5F52318AGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX231 Group targets thermally demanding embedded applications requiring USB connectivity, capacitive touch, real-time control, and functional safety support - designed specifically for industrial HMI, smart sensors, and portable medical equipment.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F52318AGFM#30?
The R5F52318AGFM#30 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 88.56 DMIPS performance and includes an IEEE754-compliant floating-point unit for real-time computational tasks.
Does the R5F52318AGFM#30 support CAN communication?
No, the R5F52318AGFM#30 does not support CAN. According to Table 1.4 in the datasheet, CAN functionality is explicitly marked "Not available" for all G-version RX231 parts in 64-pin and smaller packages including R5F52318AGFM#30. CAN is only supported in select RX230 Group variants.
What package type and dimensions does the R5F52318AGFM#30 use?
The R5F52318AGFM#30 uses the PLQP0064KB-C package: a 64-pin Low-Profile Quad Flat Package measuring 10 × 10 mm with 0.5 mm pin pitch and an exposed thermal pad. This is confirmed in Table 1.4 and the package dimension table on page 5 of R01DS0261EJ0120.
Is the R5F52318AGFM#30 qualified for extended temperature operation?
Yes, the R5F52318AGFM#30 is the G-version part, rated for operation from −40 to +105°C. This extended temperature grade is specified in Table 1.4 and enables deployment in industrial enclosures, automotive under-hood proximity, and other thermally demanding environments.
Does the R5F52318AGFM#30 include SD host interface support?
Yes, the R5F52318AGFM#30 includes the SD Host Interface (SDHIa) module, supporting 1-bit and 4-bit SD bus modes, MMC/eMMC backward compatibility, and default speed mode up to 8 MB/s. SDHI is explicitly marked "Available" for this part in Table 1.4.
R5F52318AGFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX231
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 12x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52318AGFM#30 FAQ
1.How can I place an order for R5F52318AGFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52318AGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52318AGFM#30 reliable?
The price and inventory of R5F52318AGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52318AGFM#30 is usually 5 days.
3.What payment methods are accepted for R5F52318AGFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52318AGFM#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52318AGFM#30?
R5F52318AGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52318AGFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52318AGFM#30?
For technical support, including R5F52318AGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52318AGFM#30 requirements.
6.How does Aetrix verify that R5F52318AGFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F52318AGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52318AGFM#30 meets industry standards.
7.What is the process for return or replacement of R5F52318AGFM#30?
All R5F52318AGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52318AGFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52318AGFM#30 part is unused and in its original packaging.
Return procedure for R5F52318AGFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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