Renesas R5F52318BDFL#30

Overview

R5F52318BDFL#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite AES-128/256). It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit ADC (0.83 µs conversion), dual 12-bit DAC, RTC with battery backup, and capacitive touch sensing (24 keys) - deployed in industrial HMI and smart sensor edge nodes.

For engineers reviewing the R5F52318BDFL#30 datasheet, R5F52318BDFL#30 pinout, R5F52318BDFL#30 application, or R5F52318BDFL#30 equivalent, key selection criteria include its 48-pin LFQFP package (7 × 7 mm, 0.5 mm pitch), −40 to +85°C D-version rating, SDHI support, CAN channel presence, and absence of external bus interface - critical for compact, cost-sensitive embedded control designs requiring mixed-signal integration and secure firmware execution.

Technical Context

The R5F52318BDFL#30 belongs to the RX231 Group and implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It integrates an on-chip FPU compliant with IEEE 754, a 14-bit independent watchdog timer (IWDT) driven by a dedicated low-speed oscillator, and an Event Link Controller (ELC) enabling interrupt-free peripheral coordination during CPU sleep.

Its clock system includes main (1–20 MHz), sub (32.768 kHz), and on-chip oscillators, plus PLL and USB-dedicated PLL supporting simultaneous 54 MHz system clock and 48 MHz USB clock. Memory subsystem comprises 512 KB flash (no wait states ≤32 MHz), 64 KB SRAM (no wait at 54 MHz), and 8 KB data flash rated for 1M program/erase cycles with background operation (BGO).

Key Specifications

Pinout & Package

Package: PLQP0048KB-B - 48-pin Low-Profile Quad Flat Package, 7 × 7 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52318BDFL#30, R5F52318ADFL#30 removes CAN/SDHI to reduce cost while preserving all other capabilities, whereas R5F52317BDFL#30 retains those interfaces but scales flash to 384 KB - both serve distinct cost-performance points in the RX231 family without requiring PCB redesign.

Availability

R5F52318BDFL#30 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, medical handhelds, and home appliance control boards requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F52318BDFL#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group, including R5F52318BDFL#30, is engineered for high-integration embedded control applications demanding real-time performance, security, and mixed-signal capability in compact industrial and consumer equipment.

FAQ

What is the maximum operating frequency and core architecture of the R5F52318BDFL#30?

The R5F52318BDFL#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS. Its architecture includes a 5-stage pipeline, Harvard memory organization, variable-length instructions, and on-chip memory protection unit (MPU). This enables deterministic real-time execution and efficient code density for embedded control applications.

Does the R5F52318BDFL#30 support CAN communication, and what is its compliance level?

Yes, the R5F52318BDFL#30 includes one CAN module compliant with ISO 11898-1, supporting standard and extended frames at up to 1 Mbps. The CAN interface is fully integrated with the RX231 Group's peripheral ecosystem, including ELC-triggered message transmission and hardware filtering - confirmed in Table 1.2 of the R01DS0261EJ0120 datasheet.

What package type and pin count does the R5F52318BDFL#30 use?

The R5F52318BDFL#30 uses the PLQP0048KB-B package: a 48-pin Low-Profile Quad Flat Package with 7 × 7 mm body size, 0.5 mm pitch, and exposed thermal pad. This package is explicitly listed in Table 1.3 (D Version products) and Figure 1.1 of the R01DS0261EJ0120 datasheet for the RX231 Group.

Is the R5F52318BDFL#30 qualified for industrial temperature range, and what is its operating voltage range?

Yes, the R5F52318BDFL#30 is rated for the industrial temperature range of −40 to +85°C (D version). It operates from a single supply voltage of 1.8 V to 5.5 V, with frequency scaling dependent on VCC: 8 MHz at 1.8–2.4 V, 16 MHz at 2.4–2.7 V, and full 54 MHz operation above 2.7 V - as specified in the "Power supply voltages/Operating frequencies" section on page 5 of R01DS0261EJ0120.

Does the R5F52318BDFL#30 include hardware encryption and secure boot features?

Yes, the R5F52318BDFL#30 integrates TSIP-Lite (Trusted Secure IP Lite), providing AES-128/256 encryption/decryption, true random number generation, and secure key management. While it does not implement full secure boot ROM, TSIP-Lite enables authenticated firmware loading and cryptographic operations essential for IEC 62443 and UL 60730 compliance - detailed in the "Encryption functions" section of the datasheet.