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Renesas R5F52318BDFM#10

Part No.:
R5F52318BDFM#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixR5F52318BDFM#10.pdf
Description:
IC MCU 32BIT 512KB FLASH 64LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,409

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Product details

Overview

R5F52318BDFM#10 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite with AES-128/256). It targets industrial HMI, smart sensor nodes, and USB-connected embedded control systems requiring real-time responsiveness, secure firmware updates, and low-power operation across −40°C to +85°C.

For engineers reviewing the R5F52318BDFM#10 datasheet, R5F52318BDFM#10 pinout, R5F52318BDFM#10 application, or R5F52318BDFM#10 equivalent, this MCU delivers verified USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit ADC (0.83 µs conversion), dual 12-bit DAC, capacitive touch sensing (24 keys), RTC with battery backup, and ELC-driven event-triggered peripheral coordination - all in a 64-pin LFQFP (10 × 10 mm, 0.5 mm pitch) package.

Technical Context

The R5F52318BDFM#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions, enabling ultra-compact code and deterministic interrupt latency. Its memory subsystem includes no-wait 54 MHz SRAM access, flash accelerator for zero-wait execution above 32 MHz, and background operation (BGO) for 8 KB data flash programming during active code execution.

Peripherals are coordinated via the Event Link Controller (ELC), which enables direct module-to-module triggering without CPU intervention - e.g., MTU2 timer events initiating A/D conversions or SCI transmission completion triggering DMA transfers. Clock management supports independent domain control: ICLK (54 MHz system clock), PCLKA (54 MHz for MTU2), PCLKD (54 MHz for S12AD), and BCLK (32 MHz external bus).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit, 54 MHz max, 88.56 DMIPS, IEEE 754 FPU, MPU, fast interrupt
Memory 512 KB flash (no-wait ≤32 MHz, accelerated >32 MHz), 64 KB SRAM (no-wait @54 MHz), 8 KB data flash (1M erase/program cycles, BGO)
Analog Peripherals 24-channel 12-bit ADC (0.83 µs min conversion, per-channel sampling time control), 2× 12-bit DAC (0.4–AVCC0−0.5 V output), 2× comparator units (4 channels total)
Communication USB 2.0 FS host/function/OTG (12 Mbps, BC1.2, internal VBUS supply), CAN 2.0B (1 Mbps, 16 message boxes), 7× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI (1-/4-bit SD/SDIO)
Timers & Power 6× MTU2 + 6× TPU (PWM, input capture, phase counting), 4× CMT, LPT (sub-clock driven), IWDT (dedicated 15 kHz oscillator), 3 low-power modes (sleep/deep sleep/software standby)
Security & Interface TSIP-Lite: AES-128/256 (GCM/ECB/CBC), true RNG, key protection; 5-V tolerant I/O; FINE debug interface; 64-pin LFQFP (PLQP0064KB-C, 10 × 10 mm, 0.5 mm pitch)

Pinout & Package

Package: PLQP0064KB-C - 64-pin Low-Profile Quad Flat Package, 10 × 10 mm body, 0.5 mm pitch, exposed thermal pad, RoHS compliant.

Pin/Terminal Circuit Role Design Meaning
VCC, VSS Power supply and ground Dual 1.8–5.5 V supply domains; separate analog/digital VCC pins enable noise isolation for ADC/DAC operation
XTAL, EXTAL Main clock oscillator terminals Supports 1–20 MHz crystal; required for high-accuracy timing and USB PLL lock; oscillation stop detection enabled
RTC_XTAL, RTC_EXTAL Sub-clock oscillator terminals 32.768 kHz crystal input for RTC and LPT; enables calendar/timekeeping and low-power timer operation during software standby
USB_VBUS, USB_DP, USB_DM USB transceiver interface Full-speed USB 2.0 physical layer; VBUS sensing supported; internal regulator supplies VCC_USB when VCC = 4.0–5.5 V
TXD0/RXD0, TXD1/RXD1 SCI0/SCI1 asynchronous serial I/O UART-capable channels with programmable baud rate, LSB/MSB-first transfer, and start-bit edge/level detection
CTX0–CTX23 Capacitive touch sensing inputs 24 dedicated CTSU channels supporting self-capacitance (24 keys) or mutual-capacitance matrix (up to 144 keys)

Key Features

Feature Design Value
Event Link Controller (ELC) Enables 61 types of event signals to trigger peripheral operations (e.g., timer overflow → ADC start) without CPU or interrupt overhead, reducing latency and power in sleep states
Background Operation (BGO) Allows simultaneous execution of application code and 8 KB data flash programming/erasing, eliminating blocking delays during firmware updates or parameter storage
USB Battery Charging (BC1.2) Hardware-assisted detection of downstream charging ports (SDP/CDP/DCP), enabling automatic current negotiation and safe high-current charging in portable embedded devices
IEC 60730 Safety Support Integrated self-test functions for A/D converter, clock accuracy measurement (CAC), IWDT, RAM (via DOC), and analog input disconnection detection - simplifying Class B compliance certification
Capacitive Touch Sensing Unit (CTSU) Hardware-accelerated touch acquisition with built-in noise cancellation, supporting both self- and mutual-capacitance methods without external components or CPU polling

Applications

Industrial HMI Panel Smart Sensor Gateway

Use Scenario: Standalone touch-enabled control panel for PLC monitoring, with local data logging and USB-based configuration.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving capacitive touch overlay, managing USB device-mode configuration uploads, and coordinating CAN bus communication with field devices.

Use Value: Integrated CTSU eliminates external touch controller IC; USB OTG enables plug-and-play PC configuration; 54 MHz RXv2 core ensures responsive GUI rendering and real-time CAN message handling.

Use Scenario: Edge node aggregating temperature, humidity, and vibration sensor data, then forwarding via CAN or USB to central controller.

IC Role / Device Role / Timing Role: Sensor fusion hub performing ADC acquisition (24 channels), temperature compensation (via on-die TEMPSA), and time-stamped data packaging before transmission.

Use Value: 0.83 µs ADC conversion enables high-sample-rate vibration analysis; RTC with battery backup maintains accurate timestamps across power cycles; TSIP-Lite secures OTA firmware updates.

USB-Capable Industrial Controller Secure Firmware Update Module

Use Scenario: Programmable logic controller (PLC) I/O module with USB host capability for firmware loading and diagnostics via thumb drive.

IC Role / Device Role / Timing Role: System controller managing SDHI for local storage, USB host for FAT32 file access, and CAN for fieldbus communication - all synchronized via ELC-triggered DMA transfers.

Use Value: USB host mode supports mass storage class (MSC) without external PHY; 512 KB flash accommodates dual-bank firmware images; 64 KB SRAM enables real-time buffer management for high-throughput CAN/USB bridging.

Use Scenario: Dedicated security co-processor for validating and decrypting signed firmware images before flashing into main application MCU.

IC Role / Device Role / Timing Role: Secure boot loader executing cryptographic verification (AES-GCM, SHA) using TSIP-Lite engine, then writing authenticated code to external flash via SPI or internal flash via BGO.

Use Value: Hardware AES-256 and true RNG prevent key extraction; protected key storage blocks unauthorized access to encryption engine; 8 KB data flash stores secure counters and audit logs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F52318ADFM#30 No CAN or SDHI modules; identical CPU, memory, ADC/DAC, USB, and CTSU specs Suitable where CAN bus connectivity and SD card interfacing are unnecessary - e.g., pure HMI or USB-peripheral designs Select R5F52318ADFM#30 to reduce BOM cost and simplify layout when CAN/SDHI are unused; same pinout and software compatibility
R5F52317BDFM#30 384 KB flash, 32 KB SRAM, same peripherals including CAN, SDHI, USB, CTSU, and TSIP-Lite Targeted at cost-sensitive applications with smaller firmware footprints and lower RAM requirements - e.g., basic sensor nodes or simple controllers Choose R5F52317BDFM#30 when firmware size stays under 384 KB and 32 KB RAM suffices; retains full peripheral feature set and pin compatibility

Compared with R5F52318BDFM#10, R5F52318ADFM#30 removes CAN and SDHI while preserving all other capabilities and footprint, offering cost savings where those interfaces are unused; R5F52317BDFM#30 reduces flash and RAM capacity but retains identical peripheral functionality and pinout, enabling scalable design reuse across product tiers.

Availability

R5F52318BDFM#10 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor gateways, and USB-CAN bridge applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for R5F52318BDFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group - including R5F52318BDFM#10 - was designed for high-integration industrial control applications demanding real-time performance, functional safety support (IEC 60730), secure firmware execution, and rich connectivity (USB, CAN, SDHI, CTSU) in compact packages.

FAQ

What is the maximum operating frequency and core architecture of the R5F52318BDFM#10?

The R5F52318BDFM#10 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core, delivering 88.56 DMIPS. It features a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, on-chip FPU (IEEE 754 single-precision), and memory protection unit (MPU). This architecture enables deterministic real-time response and efficient code density for industrial firmware.

Does the R5F52318BDFM#10 support USB host functionality and what are its power requirements?

Yes, the R5F52318BDFM#10 integrates a full-featured USB 2.0 host/function/OTG module supporting full-speed (12 Mbps) and low-speed (1.5 Mbps) operation. When VCC is between 4.0 V and 5.5 V, the internal USB regulator powers VCC_USB, eliminating the need for an external 3.3 V supply. The module also supports BC1.2 battery charging detection for compatible downstream ports.

What analog peripherals are included in the R5F52318BDFM#10 and how are they configured?

The R5F52318BDFM#10 includes a 24-channel 12-bit A/D converter (S12ADE) with 0.83 µs minimum conversion time at 54 MHz ADCLK, two 12-bit D/A converters (R12DAA), two analog comparator units (four total channels), and an on-die temperature sensor (TEMPSA). Sampling time is configurable per ADC channel, and DAC outputs range from 0.4 V to AVCC0 − 0.5 V.

How does the Event Link Controller (ELC) enhance real-time performance in the R5F52318BDFM#10?

The ELC in the R5F52318BDFM#10 allows 61 types of hardware events (e.g., timer overflow, SCI transmission complete) to directly trigger peripheral actions (e.g., ADC conversion start, DMA transfer) without CPU involvement or interrupt latency. This enables deterministic, low-jitter coordination between modules - such as synchronizing PWM output with ADC sampling - even while the CPU is in deep sleep mode.

Is the R5F52318BDFM#10 qualified for industrial temperature range and what safety features does it offer?

Yes, the R5F52318BDFM#10 is rated for −40°C to +85°C (D version) and includes multiple IEC 60730 Class B compliance aids: self-diagnostic A/D converter, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), RAM test assistance via Data Operation Circuit (DOC), and analog input disconnection detection - all documented in Renesas' functional safety manual.

R5F52318BDFM#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
RX231
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F52318BDFM#10 FAQ

1.How can I place an order for R5F52318BDFM#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F52318BDFM#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F52318BDFM#10 reliable?

The price and inventory of R5F52318BDFM#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52318BDFM#10 is usually 5 days.

3.What payment methods are accepted for R5F52318BDFM#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52318BDFM#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F52318BDFM#10?

R5F52318BDFM#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F52318BDFM#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F52318BDFM#10?

For technical support, including R5F52318BDFM#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52318BDFM#10 requirements.

6.How does Aetrix verify that R5F52318BDFM#10 is sourced from the original manufacturer or authorized distributors?

All R5F52318BDFM#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52318BDFM#10 meets industry standards.

7.What is the process for return or replacement of R5F52318BDFM#10?

All R5F52318BDFM#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52318BDFM#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F52318BDFM#10 part is unused and in its original packaging.

Return procedure for R5F52318BDFM#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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