Renesas R5F52318BDLA#20

Overview

R5F52318BDLA#20 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 512 KB on-chip flash memory, 64 KB SRAM, and integrated FPU compliant with IEEE 754 single-precision floating-point standard. It features USB 2.0 full-speed host/function/OTG, CAN 2.0B (ISO 11898-1), 24-channel 12-bit A/D converter (0.83 µs conversion time), and operates across −40 to +85°C for industrial HMI and motor control applications.

For engineers reviewing the R5F52318BDLA#20 datasheet, R5F52318BDLA#20 pinout, R5F52318BDLA#20 application, or R5F52318BDLA#20 equivalent, this MCU delivers deterministic real-time performance via ELC event-driven peripheral coordination, hardware-accelerated AES encryption (TSIP-Lite), and low-power operation down to software standby with LPT active - critical for battery-backed industrial gateways and touch-enabled control panels.

Technical Context

The R5F52318BDLA#20 implements the RXv2 CPU core with 5-stage CISC Harvard pipeline, supporting variable-length instructions and ultra-compact code density. Its memory subsystem includes 512 KB flash (no-wait access up to 32 MHz, wait-state managed at 54 MHz), 64 KB zero-wait SRAM, and 8 KB data flash rated for 1M program/erase cycles with background operation (BGO).

Peripherals are orchestrated via the Event Link Controller (ELC), enabling direct module-to-module triggering without CPU intervention - e.g., MTU2 timer events can start A/D conversions or trigger PWM updates. Clocking is fully configurable: main oscillator (1–20 MHz), sub-clock (32.768 kHz), PLL (4–12.5 MHz input), USB-dedicated PLL (4/6/8/12 MHz), and independent IWDT oscillator.

Key Specifications

Pinout & Package

Package: 100-pin TFLGA (PTLG0100KA-A), 5.5 × 5.5 mm body, 0.5 mm pitch, 0.45 mm height, exposed thermal pad (non-electrical). Pinout validated per Renesas R01DS0261EJ0120 Rev.1.20, Table 1.2 and Figure 1.1 - supports full RX231 Group functionality including all 24 A/D channels, USB D+/D−, CANH/CANL, SDIO lines, and capacitive touch sensing (CTSU) inputs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52318BDLA#20, R5F52318ADLA#20 removes CAN and SDHI to lower cost while retaining USB/CTSU/AES, whereas R5F52318BGFP#30 offers identical functionality in a larger LFQFP package rated to +105°C - making the former optimal for cost-sensitive industrial designs and the latter for thermally demanding environments.

Availability

R5F52318BDLA#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart motor drives, energy meter gateways, and medical infusion pump controllers requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F52318BDLA#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX231 Group - including R5F52318BDLA#20 - is engineered for real-time industrial control with integrated security (TSIP-Lite), human-machine interaction (CTSU), and mixed-signal precision (12-bit A/D/D/A), targeting IEC60730-compliant equipment.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52318BDLA#20?

The R5F52318BDLA#20 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core, which features a 5-stage CISC Harvard pipeline, variable-length instructions, and delivers 88.56 DMIPS. Its architecture includes an on-chip FPU compliant with IEEE 754 single-precision standard, 32-bit multiply-accumulate, and memory protection unit (MPU) - all confirmed in Renesas document R01DS0261EJ0120.

Does the R5F52318BDLA#20 include CAN and USB interfaces?

Yes, the R5F52318BDLA#20 integrates one CAN 2.0B channel compliant with ISO 11898-1 (up to 1 Mbps) and a USB 2.0 full-speed host/function/OTG module supporting 12 Mbps, isochronous transfer, and BC1.2 battery charging. These are explicitly listed in Table 1.2 of the R01DS0261EJ0120 datasheet under RX231 Group 100-pin functionality.

What package type and pin count does the R5F52318BDLA#20 use?

The R5F52318BDLA#20 uses a 100-pin TFLGA package (PTLG0100KA-A), measuring 5.5 × 5.5 mm with 0.5 mm pitch and an exposed thermal pad. This is confirmed in Table 1.3 (List of Products: D Version) and Package column of the R01DS0261EJ0120 datasheet, distinguishing it from LFQFP or WFLGA variants in the same family.

How much flash and RAM memory does the R5F52318BDLA#20 have?

The R5F52318BDLA#20 includes 512 KB of on-chip flash memory (with 1.8 V programmability and no-wait access up to 32 MHz), 64 KB of zero-wait SRAM, and 8 KB of data flash rated for 1,000,000 program/erase cycles with background operation (BGO). These values are specified in Table 1.3 and Section 1.1 of R01DS0261EJ0120.

Is the R5F52318BDLA#20 qualified for industrial temperature range?

Yes, the R5F52318BDLA#20 is rated for the industrial temperature range of −40 to +85°C (D version), as stated in Table 1.3 of R01DS0261EJ0120. This qualification applies specifically to the "D" suffix in the part number and is validated across all electrical and timing parameters in the datasheet's operating conditions section.