Renesas R5F52318BDND#U0

Overview

R5F52318BDND#U0 from Renesas is a 32-bit RXv2 microcontroller featuring a 54 MHz CPU core, 512 KB on-chip flash memory, 64 KB SRAM, and integrated 12-bit A/D (24 channels) and D/A (2 channels) converters. It includes USB 2.0 full-speed host/function/OTG, CAN 2.0B, SD host interface, capacitive touch sensing unit (24 keys), hardware FPU (IEEE 754 single-precision), and TSIP-Lite encryption engine - deployed in industrial HMI and smart sensor edge nodes requiring real-time control and secure connectivity.

For engineers reviewing the R5F52318BDND#U0 datasheet, R5F52318BDND#U0 pinout, R5F52318BDND#U0 application, or R5F52318BDND#U0 equivalent, this page delivers verified specifications, package mapping to PWQN0064KC-A (9 × 9 mm HWQFN-64), functional pinout, real-world use cases, and two validated alternative parts with documented technical and application differences.

Technical Context

The R5F52318BDND#U0 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, supporting 88.56 DMIPS at 54 MHz and ultra-compact variable-length instructions. Its clock system integrates main (1–20 MHz), sub-clock (32.768 kHz), PLL (4–12.5 MHz input), and USB-dedicated PLL for independent 54 MHz ICLK and 48 MHz USBCLK generation.

Peripheral integration includes ELC for interrupt-free inter-module triggering, DTC for chain-transfer-capable data movement, MTU2a/TPU timers with PWM and phase-counting modes, and S12ADE A/D converter with 0.83 µs conversion time at 54 MHz ADCLK - all operating under MPU-protected memory space with on-chip debugging support.

Key Specifications

Pinout & Package

PWQN0064KC-A is a 64-pin wettable flank QFN package (9 × 9 mm, 0.5 mm pitch) with exposed thermal pad, optimized for automated optical inspection and thermal performance in compact industrial modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52318BDND#U0, R5F52318ADND#U0 removes CAN/SDHI to reduce cost and attack surface, while R5F52317BDND#U0 retains all interfaces but scales flash down to 384 KB - both share identical PWQN0064KC-A packaging and software compatibility.

Availability

R5F52318BDND#U0 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, USB-capable test equipment, and secure industrial gateways requiring stable component supply across multi-year production cycles.

Supply support for R5F52318BDND#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group, including R5F52318BDND#U0, is engineered for high-integration industrial control applications demanding real-time responsiveness, functional safety support (IEC 60730), and secure connectivity in compact form factors.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52318BDND#U0?

The R5F52318BDND#U0 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core, delivering 88.56 DMIPS. Its CISC Harvard architecture features a 5-stage pipeline, variable-length instructions, on-chip FPU compliant with IEEE 754, and memory protection unit (MPU) - all confirmed in the official R01DS0261EJ0120 datasheet Rev.1.20. This architecture enables deterministic real-time execution for industrial control tasks within the R5F52318BDND#U0.

Does the R5F52318BDND#U0 include CAN and USB functionality?

Yes, the R5F52318BDND#U0 integrates one CAN 2.0B module compliant with ISO11898-1 (up to 1 Mbps) and a full-featured USB 2.0 host/function/OTG module supporting full-speed (12 Mbps), low-speed (1.5 Mbps), isochronous transfers, and BC1.2 battery charging. These capabilities are explicitly enabled in the BDND variant per Table 1.2 and Table 1.3 of the R01DS0261EJ0120 datasheet, distinguishing it from ADND variants which omit CAN and SDHI.

What package type and pin count does the R5F52318BDND#U0 use?

The R5F52318BDND#U0 uses the PWQN0064KC-A package: a 64-pin wettable flank QFN measuring 9 × 9 mm with 0.5 mm pitch and an exposed thermal pad. This package is confirmed in Table 1.3 of the R01DS0261EJ0120 datasheet and supports reflow soldering, automated optical inspection, and efficient thermal dissipation in space-constrained industrial modules - matching the physical and electrical interface of the R5F52318BDND#U0.

What are the memory resources available on the R5F52318BDND#U0?

The R5F52318BDND#U0 includes 512 KB of on-chip flash memory (with no-wait access up to 32 MHz), 64 KB of SRAM (no-wait at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles. These values are specified in Table 1.1 and Table 1.3 of the R01DS0261EJ0120 datasheet and apply specifically to the BDND variant - confirming its suitability for complex firmware with real-time data logging and field-upgradable code stored in the R5F52318BDND#U0.

Is the R5F52318BDND#U0 supported for IEC 60730 Class B compliance?

Yes, the R5F52318BDND#U0 includes hardware-assisted functions for IEC 60730 Class B compliance, including self-diagnostic routines for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the DOC module. These features are explicitly listed in the "Useful functions for IEC60730 compliance" section of the R01DS0261EJ0120 datasheet, validating the R5F52318BDND#U0 for safety-critical appliance and industrial control applications.