Renesas R5F52318BGFM#10

Overview

R5F52318BGFM#10 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 512 KB on-chip flash, 64 KB SRAM, and 8 KB data flash. It integrates USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit A/D converter (0.83 µs conversion), dual 12-bit D/A outputs, capacitive touch sensing (24 keys), FPU (IEEE 754 single-precision), and TSIP-Lite encryption engine. It targets industrial HMI and smart sensor nodes requiring real-time control, secure connectivity, and low-power operation.

For engineers reviewing the R5F52318BGFM#10 datasheet, R5F52318BGFM#10 pinout, R5F52318BGFM#10 application, or R5F52318BGFM#10 equivalent, this page delivers verified specifications, package mapping to PLQP0064KB-C (10 × 10 mm, 0.5 mm pitch), validated peripheral configurations, and two confirmed alternative parts for design flexibility in industrial embedded systems.

Technical Context

The R5F52318BGFM#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling 88.56 DMIPS at 54 MHz. It supports little- or big-endian data arrangement and includes on-chip MPU, FPU, and divider with 2-cycle latency.

Its clock system features PLL, USB-dedicated PLL (4/6/8/12 MHz), sub-clock oscillator (32.768 kHz), and CAC for accuracy measurement. Peripheral synchronization is segmented: ICLK (54 MHz) for CPU/system, PCLKA (54 MHz) for MTU2a, PCLKD (54 MHz) for S12AD, and PCLKB (32 MHz) for most other modules.

Key Specifications

Pinout & Package

Package: PLQP0064KB-C - 64-pin LFQFP, 10 × 10 mm body, 0.5 mm pitch, exposed pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52318BGFM#10, the D-version alternative offers identical functionality at lower thermal grade, while the R5F52317BGFM#30 reduces memory and peripheral count to cut cost-both retain pin compatibility and software footprint, enabling scalable family-based design.

Availability

R5F52318BGFM#10 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, secure gateways, and motor control interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F52318BGFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group, including R5F52318BGFM#10, was designed for high-integration industrial control applications demanding real-time performance, functional safety support (IEC 60730), and secure connectivity in harsh thermal environments.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52318BGFM#10?

The R5F52318BGFM#10 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core. This core implements a CISC Harvard architecture with a 5-stage pipeline, variable-length instructions, and achieves 88.56 DMIPS. It includes an IEEE 754-compliant single-precision FPU, 32-bit multiplier, and 2-cycle divider-enabling deterministic real-time computation for industrial control tasks within the R5F52318BGFM#10.

Does the R5F52318BGFM#10 support both USB and CAN interfaces simultaneously?

Yes, the R5F52318BGFM#10 integrates a USB 2.0 full-speed host/function/OTG module and a CAN 2.0B controller on-chip. Both operate independently: USB uses its dedicated PLL and transceiver, while CAN complies with ISO 11898-1 at up to 1 Mbps. The R5F52318BGFM#10 supports concurrent use-e.g., USB for firmware updates and CAN for fieldbus communication-without resource conflict or shared clock domain limitations.

What is the operating temperature range and package type of the R5F52318BGFM#10?

The R5F52318BGFM#10 is rated for −40 to +105°C (G-version) and housed in a PLQP0064KB-C package: a 64-pin LFQFP with 10 × 10 mm body, 0.5 mm pitch, and exposed thermal pad. This package supports reflow soldering per JEDEC J-STD-020 and provides mechanical robustness and thermal dissipation suitable for industrial environments where the R5F52318BGFM#10 is deployed.

How does the capacitive touch sensing unit (CTSU) function in the R5F52318BGFM#10?

Within the R5F52318BGFM#10, the CTSU supports self-capacitance mode using up to 24 dedicated pins (CTX0–CTX23) to implement touch keys without external components. It includes built-in noise cancellation, automatic calibration, and scan timing control-enabling reliable touch detection in noisy industrial settings. The R5F52318BGFM#10's CTSU requires no external RC network or dedicated touch ASIC, reducing BOM count and PCB area.

Is the R5F52318BGFM#10 compatible with IEC 60730 Class B safety standards?

Yes, the R5F52318BGFM#10 includes hardware-assisted functions for IEC 60730 compliance: self-diagnostic routines for A/D converter, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), RAM test assistance via DOC, and analog input disconnection detection. These features are documented in Renesas' functional safety manual for the RX231 Group and directly supported by the R5F52318BGFM#10 silicon.