Renesas R5F52318BGND#20

Overview

R5F52318BGND#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 54 MHz (88.56 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, 8 KB data flash, single-precision FPU (IEEE 754), and integrated TSIP-Lite encryption engine. It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit A/D, dual 12-bit D/A, RTC with battery backup, and capacitive touch sensing (24 keys) - deployed in industrial HMI and smart sensor edge nodes.

For engineers reviewing the R5F52318BGND#20 datasheet, R5F52318BGND#20 pinout, R5F52318BGND#20 application, or R5F52318BGND#20 equivalent, key selection criteria include its 64-pin HWQFN (9 × 9 mm) package, −40 to +105°C extended temperature rating, CAN + USB coexistence, hardware-accelerated AES-128/256, and ELC-driven low-power timer operation during software standby.

Technical Context

The R5F52318BGND#20 belongs to the RX231 Group and implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It integrates dual clock domains: ICLK at 54 MHz for CPU/system, PCLKA at 54 MHz for MTU2a, and PCLKD at 54 MHz for S12AD - enabling simultaneous high-speed analog acquisition and real-time control.

Its peripheral set includes one RSCAN CAN controller (16 message boxes, ISO 11898-1 compliant), one USBd module supporting BC1.2 charging and internal VCC_USB power generation, and an Event Link Controller (ELC) that routes 61 event signals directly between modules without CPU intervention - critical for deterministic low-latency response in motor control and safety-critical monitoring.

Key Specifications

Pinout & Package

R5F52318BGND#20 is housed in a 64-pin HWQFN package (PWQN0064KC-A), 9 × 9 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52318BGND#20, R5F52318AGND#U0 trades extended temperature operation for lower cost in benign environments, while R5F52317BGND#U0 reduces memory and removes CAN/SDHI to serve less complex applications - both retain identical pinout and core architecture.

Availability

R5F52318BGND#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, automotive body control modules, and medical diagnostic handhelds requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F52318BGND#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX231 Group - to which R5F52318BGND#20 belongs - was designed for cost-sensitive, high-reliability embedded applications demanding real-time performance, functional safety support (IEC 60730), and rich analog/mixed-signal integration in compact packages.

FAQ

What is the maximum operating frequency and core architecture of the R5F52318BGND#20?

The R5F52318BGND#20 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core, achieving 88.56 DMIPS. Its architecture features a 5-stage pipeline, Harvard memory organization, variable-length instructions, and integrated single-precision floating-point unit compliant with IEEE 754 - enabling deterministic real-time execution and efficient signal processing in the R5F52318BGND#20.

Does the R5F52318BGND#20 support CAN communication, and what are its compliance details?

Yes, the R5F52318BGND#20 integrates one RSCAN CAN module compliant with ISO 11898-1, supporting standard and extended frames at up to 1 Mbps. It provides 16 message boxes with hardware filtering and FIFO functionality, enabling robust automotive and industrial network communication without CPU intervention - a confirmed feature of the R5F52318BGND#20 per its RX231 Group specification.

What security features does the R5F52318BGND#20 include for firmware protection?

The R5F52318BGND#20 incorporates TSIP-Lite, a hardware security engine supporting AES-128/256 (ECB, CBC, GCM, XTS), CMAC, SHA-256, true random number generation, and secure key management. These features enable cryptographic signing, encrypted firmware updates, and tamper-resistant key storage - all verified in the R5F52318BGND#20 datasheet for IEC 60730 Class B compliance.

What is the package type and thermal rating of the R5F52318BGND#20?

The R5F52318BGND#20 uses a 64-pin HWQFN package (PWQN0064KC-A), measuring 9 × 9 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for operation from −40 to +105°C (G-version), making it suitable for extended-temperature industrial and automotive under-hood applications - a confirmed specification for the R5F52318BGND#20 in Table 1.4 of its official datasheet.

Can the R5F52318BGND#20 operate USB and CAN simultaneously, and how is this supported?

Yes, the R5F52318BGND#20 supports concurrent USB 2.0 full-speed host/function/OTG and CAN 2.0B operation. Its dual-clock domain design allocates ICLK (54 MHz) to CPU/system, PCLKA (54 MHz) to MTU2a, and PCLKD (54 MHz) to S12AD - while USBd and RSCAN each have dedicated clock paths and interrupt vectors. This hardware-level isolation ensures deterministic timing for both protocols in the R5F52318BGND#20.