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Renesas R5F52318BGNE#00
- Part No.:
- R5F52318BGNE#00
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R5F52318BGNE#00.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 48WFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,750
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Product details
Overview
R5F52318BGNE#00 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), USB 2.0 full-speed host/function/OTG, CAN, SD host interface, and capacitive touch sensing - deployed in industrial HMI and smart sensor edge nodes requiring real-time control and secure connectivity.
For engineers reviewing the R5F52318BGNE#00 datasheet, R5F52318BGNE#00 pinout, R5F52318BGNE#00 application, or R5F52318BGNE#00 equivalent, this page delivers verified package mapping (PWQN0048KB-A, 48-pin HWQFN, 7 × 7 mm), confirmed peripheral count (24-channel 12-bit ADC, 2-channel 12-bit DAC, 16-bit MTU/TPU timers), functional validation of TSIP-Lite encryption and RTC with battery backup, and two rigorously cross-referenced alternative parts for design continuity.
Technical Context
The R5F52318BGNE#00 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, enabling deterministic 54 MHz operation with 1-cycle minimum instruction execution. It integrates dual clock domains: ICLK at 54 MHz for CPU/system, PCLKA at 54 MHz for MTU2a, and PCLKD at 54 MHz for S12AD - while peripheral modules like RIIC and SCI operate at up to 32 MHz on PCLKB.
Its peripheral subsystem includes ELC for interrupt-free event-driven operation, DTC for chain-transfer-capable data movement, and MPC for flexible pin function assignment. The device supports software standby mode with active LPT and RTC on sub-clock (32.768 kHz), and features TSIP-Lite with AES-128/256, GCM/ECB/CBC modes, and true random number generation for IEC60730-compliant safety functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 88.56 DMIPS @ 54 MHz |
| Max Operating Frequency | 54 MHz system clock (ICLK), enabling real-time deterministic execution |
| Memory | 512 KB flash (no wait states ≤32 MHz), 64 KB SRAM, 8 KB data flash (1M erase cycles) |
| Analog Peripherals | 24-channel 12-bit ADC (0.83 µs conversion), 2-channel 12-bit DAC (0.4–AVCC0−0.5 V output) |
| Communication | USB 2.0 FS host/function/OTG, CAN 2.0B (1 Mbps), 7× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI |
| Security & Safety | TSIP-Lite with AES-128/256, GCM/ECB/CBC, TRNG, and IEC60730 self-test assistance |
| Package | PWQN0048KB-A: 48-pin HWQFN, 7 × 7 mm, 0.5 mm pitch, −40 to +105°C |
Pinout & Package
PWQN0048KB-A is a 48-pin wettable flank QFN package (7 × 7 mm, 0.5 mm pitch) with exposed thermal pad, optimized for compact industrial PCB layouts and automated optical inspection. Pin numbering follows standard QFN convention, with VCC, VSS, and AVCC pins distributed for low-noise analog/digital separation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 1.8–5.5 V digital supply rails; separate AVCC/AVSS for analog domain isolation |
| XTAL/EXTAL | Main clock oscillator input/output | Supports 1–20 MHz crystal or external clock for precise system timing |
| RTC_VCC, RTC_VSS | Battery backup power domain | Enables RTC operation during main power loss using coin-cell or supercapacitor |
| USB_DP/USB_DM | USB 2.0 differential data pair | Full-speed (12 Mbps) transceiver with internal termination; no external PHY required |
| TXD0/RXD0 | SCI0 asynchronous serial interface | Configurable baud rate generator supports RS-232/RS-485 level-shifting interfaces |
| CTSU00–CTSU23 | Capacitive touch sensing inputs | Supports mutual capacitance matrix (up to 144 keys) or self-capacitance (24 keys) |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | IEEE 754-compliant 32-bit single-precision arithmetic enables real-time motor control and sensor fusion without software emulation |
| Event Link Controller (ELC) | Direct hardware linking of 61 event sources eliminates CPU polling and ISR overhead for timer-triggered ADC conversions |
| TSIP-Lite encryption engine | Hardware-accelerated AES-GCM with key protection prevents firmware cloning and ensures secure OTA updates |
| Low-power timer (LPT) | 16-bit counter running on sub-clock or IWDT oscillator maintains timekeeping in software standby mode with <1 µA current draw |
| SD Host Interface (SDHI) | Compliant with SD Physical Layer Spec v3.01 (1-/4-bit bus), supporting logging, firmware storage, and field-upgradable configurations |
Applications
| Industrial HMI Panel | Smart Sensor Node |
|---|---|
Use Scenario: Touch-enabled local display and control unit for PLC-connected machinery with real-time status feedback. IC Role / Device Role / Timing Role: Main controller executing UI rendering, capacitive touch scanning, CAN bus communication with actuators, and USB OTG for configuration updates. Use Value: Integrated CTSU supports 24-key self-capacitance layout; 54 MHz RXv2 core handles graphics refresh and protocol stack concurrently without external co-processor. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data for cloud transmission. IC Role / Device Role / Timing Role: System-on-chip managing sensor ADC sampling, SD card logging, USB/SDHI-based data offload, and low-power wake-up via LPT-triggered RTC alarm. Use Value: 8 KB data flash enables robust firmware parameter storage; TSIP-Lite secures sensor calibration data against tampering. |
| Medical Diagnostic Device | Automated Test Equipment (ATE) |
Use Scenario: Portable point-of-care analyzer performing analog signal conditioning, waveform capture, and encrypted report generation. IC Role / Device Role / Timing Role: Real-time acquisition controller interfacing with 12-bit ADC channels, driving serial sound interface for audio alerts, and executing AES-CBC on diagnostic results. Use Value: 0.83 µs ADC conversion time captures fast transients; FPU accelerates FFT-based spectral analysis in firmware. |
Use Scenario: Rack-mounted test instrument requiring precise timing, multi-protocol I/O, and high-reliability data logging. IC Role / Device Role / Timing Role: Central sequencer coordinating SPI-controlled DUT interfaces, USB-hosted PC communication, and SDHI-based test result archiving. Use Value: Dual 16-bit timer units (MTU2a/TPU) generate synchronized PWM waveforms and capture timing-critical response edges with nanosecond resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52318AGNE#U0 | Same package (PWQN0048KB-A), identical peripherals, but D-version (-40 to +85°C) instead of G-version (-40 to +105°C) | Suitable for commercial/industrial ambient environments without extended thermal stress | Select when operating temperature does not exceed +85°C and cost optimization is prioritized over extended thermal margin |
| R5F52317BGNE#U0 | Same package and temperature grade, but reduced memory: 384 KB flash, 64 KB SRAM, no SDHI module | Lacks SD host interface; appropriate for designs omitting removable media or firmware update via SD card | Choose when SDHI functionality is unnecessary and lower BOM cost justifies reduced code space |
Compared with R5F52318BGNE#00, R5F52318AGNE#U0 offers identical feature set at lower thermal rating, while R5F52317BGNE#U0 removes SDHI and reduces flash - both require no PCB changes but differ in thermal qualification and storage capability.
Availability
R5F52318BGNE#00 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, medical diagnostic devices, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F52318BGNE#00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.
The RX231 Group - including R5F52318BGNE#00 - was designed for high-integration, safety-aware embedded applications demanding real-time performance, cryptographic security, and extended temperature resilience in resource-constrained edge systems.
FAQ
What is the maximum operating frequency and CPU performance of the R5F52318BGNE#00?
The R5F52318BGNE#00 operates at a maximum system clock frequency of 54 MHz using its RXv2 32-bit CPU core, delivering 88.56 DMIPS of processing performance. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables one-cycle minimum instruction execution, making it suitable for deterministic real-time tasks such as motor control and sensor fusion where latency predictability is critical. The R5F52318BGNE#00 achieves this performance while maintaining compatibility with Renesas' RX ecosystem toolchain and debug infrastructure.
Does the R5F52318BGNE#00 support USB 2.0 host and device functionality simultaneously?
Yes, the R5F52318BGNE#00 integrates a USB 2.0 host/function module compliant with USB Specification 2.0, supporting full-speed (12 Mbps) and low-speed (1.5 Mbps) operation, OTG (On-The-Go), isochronous transfers, and BC1.2 battery charging detection. It includes an internal USB transceiver and power supply circuitry that allows operation without external VCC_USB input when VCC is between 4.0 V and 5.5 V. This dual-role capability enables the R5F52318BGNE#00 to act as either a USB host (e.g., for SD card readers) or a USB device (e.g., for PC communication) within the same hardware design.
What are the memory resources available on the R5F52318BGNE#00?
The R5F52318BGNE#00 provides 512 KB of on-chip flash memory for program storage, 64 KB of SRAM with zero-wait-state access at 54 MHz, and 8 KB of data flash rated for 1,000,000 program/erase cycles. The flash supports background operation (BGO), allowing code execution during reprogramming. All memory blocks are accessible via the 4-Gbyte linear address space of the RXv2 core. These resources enable complex firmware with real-time OS, secure boot, and field-upgradeable features - all implemented directly on the R5F52318BGNE#00 without external memory expansion.
How does the R5F52318BGNE#00 support functional safety compliance per IEC60730?
The R5F52318BGNE#00 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic functions for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the Data Operation Circuit (DOC). It also provides voltage monitoring circuits (LVD) with configurable thresholds and multiple reset sources. These capabilities allow developers to implement systematic safety checks without significant software overhead - a key requirement for household appliances and industrial controls certified under IEC60730. The R5F52318BGNE#00 leverages these features to reduce certification effort while maintaining full peripheral functionality.
What is the package type and thermal specification of the R5F52318BGNE#00?
The R5F52318BGNE#00 is packaged in the PWQN0048KB-A: a 48-pin HWQFN (wettable flank quad flat no-lead) measuring 7 × 7 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for operation from −40°C to +105°C (G version), making it suitable for extended-temperature industrial and automotive under-hood applications. The wettable flank design supports automated optical inspection (AOI) of solder joints, improving manufacturing yield. This package matches footprint-compatible variants like R5F52318AGNE#U0 (D version) and R5F52317BGNE#U0, enabling thermal or memory-based design scaling without layout revision.
R5F52318BGNE#00 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RX231
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 30
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52318BGNE#00 FAQ
1.How can I place an order for R5F52318BGNE#00 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52318BGNE#00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52318BGNE#00 reliable?
The price and inventory of R5F52318BGNE#00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52318BGNE#00 is usually 5 days.
3.What payment methods are accepted for R5F52318BGNE#00?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52318BGNE#00 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52318BGNE#00?
R5F52318BGNE#00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52318BGNE#00 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52318BGNE#00?
For technical support, including R5F52318BGNE#00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52318BGNE#00 requirements.
6.How does Aetrix verify that R5F52318BGNE#00 is sourced from the original manufacturer or authorized distributors?
All R5F52318BGNE#00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52318BGNE#00 meets industry standards.
7.What is the process for return or replacement of R5F52318BGNE#00?
All R5F52318BGNE#00 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52318BGNE#00, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52318BGNE#00 part is unused and in its original packaging.
Return procedure for R5F52318BGNE#00:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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