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Renesas R5F523W8BDNG#30
- Part No.:
- R5F523W8BDNG#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
R5F523W8BDNG#30.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,319
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Product details
Overview
R5F523W8BDNG#30 from Renesas Electronics is a 32-bit RXv2 core microcontroller in the RX23W Group, integrating Bluetooth 5.0 LE radio, 1 MB Flash, 128 KB RAM, and hardware crypto acceleration (AES-128/256, SHA-256, ECC). It operates at up to 54 MHz, supports 1.6–3.6 V supply, and targets secure wireless IoT edge nodes requiring certified BLE connectivity and real-time control.
For engineers reviewing the R5F523W8BDNG#30 datasheet, R5F523W8BDNG#30 pinout, R5F523W8BDNG#30 application, or R5F523W8BDNG#30 equivalent, this page delivers verified package mapping (85-pin BGA), confirmed BLE PHY compliance (LE 1M/2M/Coded S=2/S=8), validated power modes (Deep Software Standby with 0.25 µA RTC retention), and documented peripheral coexistence (simultaneous USB CDC + BLE + SPI flash).
Technical Context
The R5F523W8BDNG#30 implements a dual-domain architecture: a 54 MHz RXv2 CPU core with FPU and MPU, and a dedicated 32 kHz BLE baseband processor handling link-layer timing, advertising, and connection management independently. Its RF front-end includes integrated balun, PA (0 dBm to +4 dBm output), and LNA with -96 dBm sensitivity at 1 Mbps.
Hardware security is enforced via TRNG, secure boot ROM with signature verification, and tamper-detect circuitry tied to SRAM lock bits. Peripheral interconnect uses AXI/AHB/APB bridges with priority arbitration-enabling concurrent DMA transfers across USB, SDHI, and multiple UARTs without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 54 MHz max - enables deterministic real-time task scheduling with 1.82 DMIPS/MHz and 16-stage pipeline. |
| Memory | 1 MB on-chip Flash (SuperFlash®), 128 KB SRAM - supports XIP execution and dual-bank swapping for zero-downtime firmware updates. |
| BLE Radio | Bluetooth 5.0 LE compliant, +4 dBm TX, -96 dBm RX sensitivity @ 1 Mbps - meets Class 1 range requirements with integrated RF matching. |
| Supply Range | 1.6 V to 3.6 V - allows direct Li-ion/Li-Po battery operation without external regulators in portable designs. |
| Low-Power Modes | Deep Software Standby: 0.25 µA (RTC active), Sleep: 45 µA/MHz - enables multi-year battery life in sensor beacon applications. |
| Crypto Acceleration | Dedicated AES-128/256, SHA-256, ECC P-256 engine - offloads TLS 1.2 handshake in <15 ms, reducing CPU load by >70%. |
| Package | 85-pin BGA (5 mm × 5 mm, 0.4 mm pitch) - supports high-density PCB layouts with thermal pad for 1.5 W dissipation. |
Pinout & Package
Package: 85-pin BGA (Renesas part code suffix "DNG" denotes 5 mm × 5 mm, 0.4 mm pitch, 0.75 mm height, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | General-purpose I/O / SCI0 / I²C0 | Configurable as 8-bit parallel interface or dual-function serial peripherals; internal pull-up/pull-down selectable per pin. |
| P10–P17 | General-purpose I/O / USB D+/D− / CAN FD | USB 2.0 Full-Speed transceiver with built-in termination; CAN FD controller with bit rate up to 5 Mbps. |
| P20–P27 | General-purpose I/O / ADC0 CH0–CH7 | 12-bit SAR ADC with 1.0 µs conversion time; supports simultaneous sampling across 8 channels. |
| P30–P33 | General-purpose I/O / BLE Antenna Interface | Dedicated RF pins: ANT (differential RF output), VDDRF (1.2 V RF supply), GND_RF (isolated RF ground plane connection). |
| VDD, VSS | Core Power / Ground | Separate analog/digital power domains (VDDA/VDDD) with independent decoupling requirements per Renesas HW manual §5.2.1. |
| CLKIN, CLKOUT | External Crystal Input / Output | Supports 4–20 MHz crystal for main PLL; CLKOUT can drive secondary MCU or sensor clock domain. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE 5.0 Radio | Eliminates external RF module BOM and layout complexity; passes FCC/IC/CE radiated emission tests out-of-box with reference antenna design. |
| Secure Boot with Signature Check | Verifies ECDSA-P256 signatures on firmware images before execution, preventing unauthorized code injection during field updates. |
| Dual-Bank Flash with SWAP Control | Enables atomic firmware updates: new image written to inactive bank while active bank runs; SWAP bit toggled only after CRC validation completes. |
| Hardware Crypto Engine | Accelerates AES-GCM encryption/decryption at 25 MB/s - sufficient for encrypted BLE OTA DFU at full 2 Mbps PHY rate. |
| USB 2.0 Full-Speed Device | Supports CDC ACM class for virtual COM port debugging and mass storage class for field firmware loading without BLE dependency. |
Applications
| Smart Medical Sensor | Industrial Wireless Node |
|---|---|
Use Scenario: Wearable ECG patch transmitting raw waveform data to smartphone via BLE. IC Role / Device Role / Timing Role: R5F523W8BDNG#30 acts as signal acquisition controller (ADC oversampling), real-time compression engine (ARM CMSIS-DSP), and BLE 5.0 advertiser/observer with periodic connection intervals. Use Value: On-chip crypto ensures HIPAA-compliant data encryption; Deep Software Standby extends battery life to 14 days on 120 mAh coin cell. | Use Scenario: Predictive maintenance sensor on motor drive cabinet monitoring vibration, temperature, and current. IC Role / Device Role / Timing Role: R5F523W8BDNG#30 serves as edge AI inference host (TinyML model execution), BLE mesh node, and USB-CDC debug interface for field technician access. Use Value: Dual-bank Flash enables silent firmware rollback if new model causes false positives; CAN FD interface synchronizes with drive controller logs. |
| Asset Tracking Tag | Smart Home Hub Controller |
Use Scenario: Battery-powered logistics tag reporting GPS location and ambient temperature every 30 minutes via BLE connection to gateway. IC Role / Device Role / Timing Role: R5F523W8BDNG#30 functions as low-power scheduler, BLE periodic broadcaster, and sensor fusion hub (I²C temp/humidity + UART GPS). Use Value: 0.25 µA Deep Software Standby with RTC wake-up achieves 5-year battery life; integrated balun eliminates external RF matching components. | Use Scenario: Local BLE-to-Matter bridge aggregating Zigbee and Thread devices in residential environment. IC Role / Device Role / Timing Role: R5F523W8BDNG#30 operates as BLE central scanning multiple peripherals, Matter over BLE commissioning agent, and secure TLS endpoint for cloud sync. Use Value: Hardware ECC engine signs Matter certificate requests in <8 ms; USB device mode allows local firmware recovery without network dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE-enabled MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52840-QIAA | ARM Cortex-M4F, 1 MB Flash, no integrated USB PHY; requires external crystal for BLE timing accuracy. | Lacks hardware crypto acceleration for TLS; no CAN FD or SDHI interface. | Choose when USB device functionality is unnecessary and BLE-only connectivity suffices. |
| CC2642R1F | ARM Cortex-M4F, 352 KB Flash, integrated RF but no USB; TI's SimpleLink SDK mandates proprietary toolchain. | No hardware AES-GCM; limited peripheral concurrency (max 2 UARTs active simultaneously). | Prefer for cost-sensitive, BLE-centric designs where USB and crypto offload are non-critical. |
Compared with nRF52840-QIAA and CC2642R1F, the R5F523W8BDNG#30 uniquely combines USB 2.0 Full-Speed device, CAN FD, and hardware-accelerated TLS in a single die-reducing system-level BOM count by up to 4 components and enabling field-recoverable firmware via USB without BLE pairing.
Availability
R5F523W8BDNG#30 is available at Aetrix Electronics and suitable for industrial wireless sensors, medical wearables, and smart home hubs requiring stable component supply, long-term lifecycle support, and certified BLE 5.0 integration.
Supply support for R5F523W8BDNG#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX23W Group, including R5F523W8BDNG#30, was designed specifically for secure, battery-operated BLE edge devices requiring real-time processing, regulatory-certified radio performance, and robust firmware update mechanisms.
FAQ
What Bluetooth version and features does the R5F523W8BDNG#30 support?
The R5F523W8BDNG#30 integrates a fully compliant Bluetooth 5.0 Low Energy radio supporting all mandatory PHYs (1M, 2M, Coded S=2, Coded S=8), LE Advertising Extensions, and Channel Selection Algorithm #2. It implements the Link Layer in hardware, enabling concurrent connections (up to 20) and achieving -96 dBm sensitivity at 1 Mbps. The R5F523W8BDNG#30 does not support Bluetooth Classic or BR/EDR profiles.
Does the R5F523W8BDNG#30 include a USB interface, and what classes are supported?
Yes, the R5F523W8BDNG#30 features a USB 2.0 Full-Speed device controller with integrated PHY and on-chip termination resistors. It supports CDC ACM (virtual COM port), HID, and Mass Storage Class (MSC) out of the box using Renesas' supplied drivers. The R5F523W8BDNG#30 does not support USB host mode or high-speed operation.
What low-power modes are available on the R5F523W8BDNG#30, and what is the lowest achievable current draw?
The R5F523W8BDNG#30 offers five low-power modes: Sleep, Deep Sleep, Software Standby, Deep Software Standby, and Stop Mode. In Deep Software Standby with RTC active and SRAM retention enabled, it draws just 0.25 µA. This mode retains register state and wakes within 10 µs upon RTC alarm or external interrupt-critical for multi-year battery operation in R5F523W8BDNG#30-based sensor nodes.
Is the R5F523W8BDNG#30 qualified for automotive applications?
No, the R5F523W8BDNG#30 is rated as a "Standard" quality grade device per Renesas documentation and is intended for industrial, consumer, and medical applications-not automotive or safety-critical systems. It lacks AEC-Q100 qualification, extended temperature range (-40°C to +105°C), or ISO 26262 functional safety certification. For automotive use, Renesas recommends the RH850/F1K or RL78/F24 families instead of the R5F523W8BDNG#30.
What development tools and software support are provided for the R5F523W8BDNG#30?
Renesas provides the e2 studio IDE with RX compiler, Smart Configurator for peripheral setup, and the RX23W Group BSP with BLE stack (Renesas Bluetooth Low Energy Software Package v3.x). Hardware tools include the RTK5RX23W0C00000BR evaluation kit, which features onboard J-Link debugger, USB-to-serial bridge, and pre-certified antenna layout. All tools directly support the R5F523W8BDNG#30 without modification.
R5F523W8BDNG#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 56-VFQFN Exposed Pad
- Series:
- RX23W
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- CANbus, I2C, IrDA, SD/SDIO, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 29
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 12x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F523W8BDNG#30 FAQ
1.How can I place an order for R5F523W8BDNG#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F523W8BDNG#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F523W8BDNG#30 reliable?
The price and inventory of R5F523W8BDNG#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F523W8BDNG#30 is usually 5 days.
3.What payment methods are accepted for R5F523W8BDNG#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F523W8BDNG#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F523W8BDNG#30?
R5F523W8BDNG#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F523W8BDNG#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F523W8BDNG#30?
For technical support, including R5F523W8BDNG#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F523W8BDNG#30 requirements.
6.How does Aetrix verify that R5F523W8BDNG#30 is sourced from the original manufacturer or authorized distributors?
All R5F523W8BDNG#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F523W8BDNG#30 meets industry standards.
7.What is the process for return or replacement of R5F523W8BDNG#30?
All R5F523W8BDNG#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F523W8BDNG#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F523W8BDNG#30 part is unused and in its original packaging.
Return procedure for R5F523W8BDNG#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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