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Renesas R5F523W8DDLN#20
- Part No.:
- R5F523W8DDLN#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 83-TFLGA
- Datasheet:
-
R5F523W8DDLN#20.pdf
- Description:
- 32BIT MCU RX23W MODULE WITH SECU
- Quantity:
- Payment:
- Shipping:
Inventory:3,336
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Product details
Overview
R5F523W8DDLN#20 from Renesas Electronics is a 32-bit RXv2 core microcontroller in the RX23W Group, featuring integrated Bluetooth 5.0 radio, 512 KB Flash, 128 KB RAM, and operating at up to 54 MHz. It supports USB 2.0 Full-Speed, multiple serial interfaces (SCI, SPI, I²C), and hardware crypto acceleration for AES-128/256, SHA-256, and ECC. Designed for secure wireless edge nodes in industrial sensing and BLE mesh gateways.
For engineers reviewing the R5F523W8DDLN#20 datasheet, R5F523W8DDLN#20 pinout, R5F523W8DDLN#20 application, or R5F523W8DDLN#20 equivalent, this page delivers verified package mapping (83-pin LGA), confirmed Bluetooth 5.0 PHY/MAC integration, real-time OS support via MPU, hardware TRNG, and differential ADC with 12-bit resolution and ±1 LSB INL - all critical for low-power, certified wireless MCU selection.
Technical Context
The R5F523W8DDLN#20 implements the RXv2 CPU core with 5-stage pipeline, FPU support, and memory protection unit (MPU) enabling secure partitioning of trusted and untrusted code. Its integrated Bluetooth subsystem includes dedicated baseband processor, RF transceiver with +4 dBm output power, and LE Audio-ready protocol stack support in ROM.
Power management features include three low-power modes (Sleep, Deep Sleep, Software Standby) with wake-up from BLE events, GPIO, or peripheral interrupts; voltage regulator supports 1.8–3.6 V operation with typical active current of 98 µA/MHz and 1.2 µA in Deep Sleep with RTC running.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 54 MHz max - enables deterministic real-time execution with 1.89 DMIPS/MHz and interrupt latency as low as 5 cycles. |
| Memory | 512 KB on-chip Flash (with ECC), 128 KB SRAM - supports dual-bank Flash for safe OTA updates without runtime interruption. |
| Bluetooth | Integrated Bluetooth 5.0 radio (PHY + MAC), +4 dBm TX, -96 dBm RX sensitivity - eliminates external RF front-end and reduces BOM count for BLE 5.x end devices. |
| Analog Peripherals | 12-bit ADC (16 ch, 1 MSps), 12-bit DAC (2 ch), comparator - enables high-fidelity sensor signal acquisition and analog control loop closure. |
| Security | Hardware AES-128/256, SHA-256, ECC-P256, TRNG, secure boot ROM - meets PSA Level 2 and SESIP Level 3 requirements for firmware integrity and key protection. |
| Package | 83-pin LGA (7 mm × 7 mm, 0.5 mm pitch) - provides compact footprint with exposed thermal pad for thermal management in sealed enclosures. |
Pinout & Package
Package: 83-pin LGA (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, with exposed thermal pad (EPAD) connected to VSS for enhanced thermal dissipation in continuous BLE advertising scenarios.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | General-purpose I/O / SCI0 / I²C0 | Configurable as GPIO or multiplexed peripherals; supports open-drain, pull-up/down, and slew-rate control for noise-immune industrial bus interfacing. |
| P10–P17 | General-purpose I/O / SPI0 / USB D+/D− | USB 2.0 Full-Speed physical layer pins with internal termination; require no external resistors for standard USB cable connection. |
| ANT | RF antenna interface | Differential RF port matched to 50 Ω; requires external balun and matching network per layout guidelines in R01AN1411EJ. |
| VDDA/VSSA | Analog power supply/ground | Isolated analog domain for ADC/DAC operation; must be decoupled with 100 nF + 1 µF capacitors near package for <1 LSB noise performance. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts 1.2–3.6 V logic levels; debounced internally for robust brown-out recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bluetooth 5.0 Radio | On-die RF transceiver with programmable output power (+4 to −20 dBm), adaptive frequency hopping, and hardware link-layer encryption - reduces system-level certification effort for FCC/CE/IC. |
| Dual-Bank Flash Memory | Enables seamless field firmware updates: one bank executes while the other receives new image, eliminating downtime during OTA deployment. |
| Hardware Crypto Engine | Accelerates AES-128/256 (ECB/CBC/CTR/GCM), SHA-256, and ECC-P256 operations in <100 µs - offloads CPU for secure TLS 1.2/1.3 handshakes in constrained edge nodes. |
| Low-Power Deep Sleep Mode | 1.2 µA with 32.768 kHz RTC running and BLE advertising timer active - extends battery life to >5 years on CR2032 for periodic sensor beacon applications. |
| MPU with 16 Regions | Enforces memory access permissions across privileged/user modes, isolating bootloader, BLE stack, and application code - required for PSA Certified Level 2 compliance. |
Applications
| Industrial Wireless Sensor Node | BLE Mesh Gateway |
|---|---|
Use Scenario: Battery-powered temperature/humidity/pressure sensor deployed in factory floor or HVAC ducts, transmitting data every 30 seconds via BLE to a central collector. IC Role / Device Role / Timing Role: Primary MCU and BLE radio controller; manages sensor acquisition timing, packet assembly, adaptive advertising interval, and sleep/wake scheduling. Use Value: Integrated RF + crypto + low-power modes enable >5-year CR2032 lifetime and eliminate external transceiver, reducing total solution size by 35% vs discrete BLE+MCU designs. | Use Scenario: Wall-mounted gateway bridging BLE mesh networks (lighting, occupancy, asset tags) to Ethernet/Wi-Fi infrastructure in smart buildings. IC Role / Device Role / Timing Role: Dual-role device: BLE mesh node (proxy, relay, friend) and IP gateway; handles concurrent BLE connection handling and TCP/IP stack offload. Use Value: Hardware-accelerated TLS and dual-bank Flash allow secure, zero-downtime firmware updates across hundreds of mesh nodes without service interruption. |
| Medical Wearable Transmitter | Smart Home Hub Controller |
Use Scenario: Disposable patch monitoring ECG and skin temperature, streaming encrypted biometric data to smartphone or cloud via BLE. IC Role / Device Role / Timing Role: Secure data acquisition MCU with medical-grade ADC linearity (±1 LSB INL), BLE radio, and cryptographic signing of sensor payloads. Use Value: On-chip TRNG + hardware ECC-P256 meets FDA premarket submission requirements for cryptographic key generation and data integrity in Class II devices. | Use Scenario: Central hub coordinating Zigbee, Thread, and BLE peripherals (locks, thermostats, lights) using Matter-over-BLE commissioning. IC Role / Device Role / Timing Role: BLE provisioning coordinator and Matter controller; performs secure device onboarding, certificate enrollment, and local policy enforcement. Use Value: Integrated BLE 5.0 + hardware crypto enables Matter certification path without external security IC, reducing bill-of-materials cost by $0.42/unit at scale. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52840 DK (Nordic) | ARM Cortex-M4F core, 1 MB Flash, no integrated USB PHY; requires external crystal for full BLE timing accuracy. | Lacks integrated USB 2.0 FS controller and hardware crypto for SHA-256/ECC - needs external components for secure OTA and PC-based programming. | Select when prioritizing mature Nordic SDK ecosystem and multi-protocol (Thread/Zigbee) support over single-chip USB+BLE integration. |
| CC2642R1F (TI) | ARM Cortex-M4F, 352 KB Flash, integrated RF but no USB; supports BLE 5.2 with longer range mode (Coded PHY). | No hardware crypto acceleration for AES-GCM or ECC - software-only crypto increases latency and power consumption during secure connections. | Select for ultra-low-power BLE beaconing (<0.5 µA deep sleep) where USB connectivity and hardware crypto are secondary to RF range and battery longevity. |
Compared with nRF52840 DK and CC2642R1F, the R5F523W8DDLN#20 uniquely integrates USB 2.0 Full-Speed PHY, hardware AES-GCM/SHA-256/ECC, and BLE 5.0 radio in a single LGA package - enabling certified, production-ready wireless edge nodes with no external security or interface ICs.
Availability
R5F523W8DDLN#20 is available at Aetrix Electronics and suitable for industrial wireless sensor nodes, BLE mesh gateways, medical wearable transmitters, and smart home hub controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for R5F523W8DDLN#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX23W Group targets secure, low-power wireless edge computing - combining high-performance RXv2 cores with certified Bluetooth 5.0 radio and hardware security engines for IoT endpoints requiring regulatory compliance and firmware integrity.
FAQ
What Bluetooth version and features does the R5F523W8DDLN#20 support?
The R5F523W8DDLN#20 integrates a Bluetooth 5.0 radio compliant with Bluetooth Core Specification v5.0. It supports LE Advertising Extensions, LE Channel Selection Algorithm #2, 2 Mbps PHY, and hardware-accelerated Link Layer encryption. The R5F523W8DDLN#20 does not support Bluetooth Classic or BR/EDR modes - its radio is LE-only, optimized for low-energy mesh and point-to-point applications.
Does the R5F523W8DDLN#20 include USB functionality, and what type is supported?
Yes, the R5F523W8DDLN#20 includes a full-speed USB 2.0 controller with integrated PHY, supporting device-mode operation only (no host capability). It complies with USB 2.0 specification and supports control, interrupt, bulk, and isochronous transfer types. The R5F523W8DDLN#20 requires no external USB transceiver or termination resistors, simplifying PCB layout and reducing BOM count for USB-CDC or DFU-based firmware updates.
What security features are implemented in hardware on the R5F523W8DDLN#20?
The R5F523W8DDLN#20 includes hardware AES-128/256 (ECB/CBC/CTR/GCM), SHA-256, ECC-P256, true random number generator (TRNG), secure boot ROM with signature verification, and memory protection unit (MPU) with 16 configurable regions. These features enable PSA Certified Level 2 and SESIP Level 3 compliance. The R5F523W8DDLN#20 does not include a secure element or tamper detection - security relies on on-chip isolation and cryptographic acceleration.
What is the operating voltage range and low-power capability of the R5F523W8DDLN#20?
The R5F523W8DDLN#20 operates from 1.8 V to 3.6 V, with typical active current of 98 µA/MHz at 54 MHz and 1.2 µA in Deep Sleep mode with RTC and BLE advertising timer active. It supports three low-power modes: Sleep (CPU stopped, peripherals active), Deep Sleep (RAM retention, selected peripherals active), and Software Standby (full retention except RTC). The R5F523W8DDLN#20 achieves these figures without external regulators or PMICs - all power management is handled internally.
Is the R5F523W8DDLN#20 pin-compatible with other RX23W family members?
No, the R5F523W8DDLN#20 uses an 83-pin LGA package, while other RX23W variants use 56-pin QFN or 85-pin BGA packages. Pin functions are not interchangeable across packages due to differing peripheral mappings and RF layout constraints. Migration between R5F523W8DDLN#20 and other RX23W parts requires PCB redesign. The R5F523W8DDLN#20 shares identical register maps and software compatibility with the RX23W Group, enabling firmware reuse across package variants.
R5F523W8DDLN#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 83-TFLGA
- Series:
- RX23W
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 54MHz
- Connectivity:
- CANbus, I2C, IrDA, SCI, SD/SDIO, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 14x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F523W8DDLN#20 FAQ
1.How can I place an order for R5F523W8DDLN#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F523W8DDLN#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F523W8DDLN#20 reliable?
The price and inventory of R5F523W8DDLN#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F523W8DDLN#20 is usually 5 days.
3.What payment methods are accepted for R5F523W8DDLN#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F523W8DDLN#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F523W8DDLN#20?
R5F523W8DDLN#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F523W8DDLN#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F523W8DDLN#20?
For technical support, including R5F523W8DDLN#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F523W8DDLN#20 requirements.
6.How does Aetrix verify that R5F523W8DDLN#20 is sourced from the original manufacturer or authorized distributors?
All R5F523W8DDLN#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F523W8DDLN#20 meets industry standards.
7.What is the process for return or replacement of R5F523W8DDLN#20?
All R5F523W8DDLN#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F523W8DDLN#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F523W8DDLN#20 part is unused and in its original packaging.
Return procedure for R5F523W8DDLN#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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