Renesas R5F526T9BGFM#30

Overview

R5F526T9BGFM#30 from Renesas is a 32-bit RXv3 microcontroller optimized for motor control and industrial inverter applications, operating at up to 120 MHz with 709 CoreMark performance, integrated 512 KB code flash, 64 KB SRAM, 16 KB data flash, and hardware-accelerated 3-phase/5-phase complementary PWM generation. It supports CAN FD, I3C, and dual high-resolution PWM channels with 260 ps timing resolution for precise gate drive control in brushless DC and PMSM motor drives.

For engineers reviewing the R5F526T9BGFM#30 datasheet, R5F526T9BGFM#30 pinout, R5F526T9BGFM#30 application, or R5F526T9BGFM#30 equivalent, key selection criteria include its 100-pin LFQFP package, 120 MHz GPTWa timer with single-/3-/5-phase PWM modes, on-chip FPU, IEC60730 safety features, and dedicated HRPWM circuitry enabling sub-nanosecond dead-time control in real-time motor control loops.

Technical Context

The R5F526T9BGFM#30 implements the RXv3 CPU core with 32-bit architecture, 16 general-purpose registers, IEEE 754-compliant single-precision FPU, and collective register bank save for fast context switching in interrupt-heavy motor control firmware. Its clock system integrates PLL with 8–24 MHz crystal input, 240 kHz LOCO, and 120 kHz IWDT oscillator - all supporting independent domain clocking (ICLK/PCLKA/PCLKC/PCLKD) for deterministic peripheral timing.

Motor-specific peripherals include 8-channel 32-bit GPTWa timers synchronized to PCLKC at 120 MHz, MTU3d with 3-phase complementary PWM and automatic dead-time insertion, HRPWM with 260 ps resolution for fine-grained edge positioning, and S12ADH ADC with simultaneous sampling across three units - enabling synchronized current/voltage sensing in vector-controlled inverters.

Key Specifications

Pinout & Package

Package: PLQP0100KB-B - 100-pin Low-profile Quad Flat Package, 14 mm × 14 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant, rated for –40°C to +105°C operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar motor control MCU applications.

Compared with R5F526T9BGFM#30, the R5F526TADFGM#30 offers identical peripheral functionality in a smaller footprint but sacrifices 16 KB RAM and 33 GPIOs, while the R5F566TEBDFP#30 delivers higher clock speed and memory headroom at the cost of increased power and BOM cost - making R5F526T9BGFM#30 optimal for cost-sensitive, thermally constrained industrial inverter designs requiring full 100-pin flexibility and 64 KB RAM.

Availability

R5F526T9BGFM#30 is available at Aetrix Electronics and suitable for industrial motor drives, automotive HVAC systems, home appliance inverters, and PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature resilience (–40°C to +105°C).

Supply support for R5F526T9BGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX26T Group - including R5F526T9BGFM#30 - was designed specifically for high-precision, real-time motor control in industrial inverters and appliance compressors, integrating hardware-accelerated PWM, simultaneous ADC, and functional safety features aligned with IEC60730 Class B requirements.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F526T9BGFM#30?

The R5F526T9BGFM#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance. This benchmark reflects its RXv3 CPU core efficiency, including single-cycle instruction execution, 32-bit multiplier/divider, and barrel shifter - all validated under real-world conditions at full speed. The R5F526T9BGFM#30 maintains this performance with no wait states across its 512 KB code flash and 64 KB SRAM.

Does the R5F526T9BGFM#30 support CAN FD, and what standard does it comply with?

Yes, the R5F526T9BGFM#30 integrates a CAN FD module compliant with ISO11898-1:2015, supporting both standard (11-bit) and extended (29-bit) frame formats with flexible data rates up to 5 Mbps in the data phase. The R5F526T9BGFM#30 implements full protocol handling in hardware, including bit-rate switching, CRC calculation, and error confinement - eliminating software overhead in safety-critical motor control networks.

How many ADC channels and sample-and-hold units does the R5F526T9BGFM#30 provide?

The R5F526T9BGFM#30 includes three 12-bit S12ADH ADC units: Unit 0 (4 channels with 3 sample-and-hold circuits), Unit 1 (4 channels with 3 sample-and-hold circuits), and Unit 2 (14 channels). This configuration enables true simultaneous sampling across up to six analog inputs - critical for accurate current reconstruction in 3-phase motor control. The R5F526T9BGFM#30 achieves 0.9 µs minimum conversion time per channel when ADCLK runs at 60 MHz.

What PWM capabilities does the R5F526T9BGFM#30 offer for motor control applications?

The R5F526T9BGFM#30 provides three complementary PWM subsystems: 8-channel 32-bit GPTWa timers, 9-channel 16-bit MTU3d, and 4-channel HRPWM with 260 ps minimum resolution. It supports single-phase (10 outputs), 3-phase (3 outputs), and 5-phase (2 outputs) complementary PWM modes with hardware dead-time insertion, phase counting, and synchronous start/stop. The R5F526T9BGFM#30 uses these to generate precise gate drive signals for SiC/GaN inverters with minimal CPU load.

Is the R5F526T9BGFM#30 qualified for industrial temperature ranges, and what package does it use?

Yes, the R5F526T9BGFM#30 is rated for –40°C to +105°C operation (G-version), making it suitable for demanding industrial environments. It uses the PLQP0100KB-B package: a 100-pin LFQFP with 14 mm × 14 mm body, 0.5 mm pitch, and exposed thermal pad. This package supports high-density PCB layouts while enabling effective thermal dissipation in enclosed motor drive enclosures.