Renesas R5F56216BDBG#U0

Overview

R5F56216BDBG from Renesas is a 32-bit RX CPU-based microcontroller delivering 165 DMIPS at 100 MHz, featuring single-precision IEEE-754 FPU, 256 KB flash, 64 KB SRAM, 32 KB data flash, Ethernet MAC (10/100 Mbps), USB 2.0 Full-Speed Host/Function/OTG, CAN 2.0B (1 channel, 32 mailboxes), 12-bit ADC (8 ch), dual 10-bit DAC, and TFT-LCD controller - deployed in industrial HMIs and networked embedded gateways.

For engineers reviewing the R5F56216BDBG datasheet, R5F56216BDBG pinout, R5F56216BDBG application, or R5F56216BDBG equivalent, key selection criteria include its LFBGA176 package with 176 pins, 100 MHz operation under 2.7–3.6 V, -40°C to +85°C temperature range, and integrated peripherals enabling single-chip connectivity for real-time control and communication.

Technical Context

The R5F56216BDBG implements the RXv1 CPU core with CISC-Harvard architecture, 5-stage pipeline, and variable-length instructions, supporting memory protection (MPU) and background JTAG debug with high-speed trace. Its clock system integrates PLL with selectable division/multiplication for ICLK (up to 100 MHz), PCLK (up to 50 MHz), and BCLK (up to 50 MHz).

It features four DMA channels, two EXDMA channels, and a Data Transfer Controller (DTC) for peripheral-triggered transfers. Communication subsystems include dual USB ports (176-pin variant), RMII/MII Ethernet interface with dedicated 2-KB TX/RX FIFOs, and SCI (6 ch), RSPI (2 ch), I²C (2 ch), and CAN (1 ch) - all operating independently under separate clock domains.

Key Specifications

Pinout & Package

LFBGA176 package (PLBG0176GA-A), 13 mm × 13 mm, 0.8 mm pitch, 176-ball array with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56216BDBG, R5F562N6BDBG adds SDRAM support but increases complexity and cost, while R5F56217BDBG provides memory headroom without altering peripheral feature set - making it the preferred upgrade path for firmware growth.

Availability

R5F56216BDBG is available at Aetrix Electronics and suitable for industrial HMIs, networked gateways, programmable logic controllers, and medical diagnostic interfaces requiring stable component supply, long-term lifecycle support, and automotive-grade reliability validation.

Supply support for R5F56216BDBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX621 Group, including R5F56216BDBG, was designed for high-performance, real-time embedded systems demanding rich connectivity (Ethernet, USB, CAN), graphics capability, and deterministic low-latency control - targeting industrial automation and human-machine interface platforms.

FAQ

What is the maximum operating frequency and core performance of the R5F56216BDBG?

The R5F56216BDBG operates at a maximum frequency of 100 MHz and delivers 165 DMIPS using the 32-bit RXv1 CPU core. Its single-precision IEEE-754 floating-point unit enables efficient real-time computation for control algorithms. The core supports memory protection (MPU), background JTAG debug, and high-speed trace - all confirmed in the official R01DS0052EJ0140 datasheet for R5F56216BDBG.

Does the R5F56216BDBG support Ethernet and USB simultaneously, and what interfaces are provided?

Yes, the R5F56216BDBG supports simultaneous Ethernet and USB operation. It integrates a 10/100 Mbps Ethernet MAC with RMII/MII interface and dual USB 2.0 Full-Speed ports (USB0 and USB1), each with dedicated 2-KB buffer RAM. The LFBGA176 package exposes all required pins: ET_RX_DV, ET_TX_EN, ET_ERXD[0:1], ET_ETXD[0:3], ET_MDC/MDIO, and USB0/1_DP/DM - verified in Figure 1.3 and Table 1.4 of the R5F56216BDBG datasheet.

What are the memory resources available on the R5F56216BDBG?

The R5F56216BDBG includes 256 KB of on-chip flash memory (zero wait-state at 100 MHz), 64 KB of SRAM (no wait-state, supports instruction/operand execution), and 32 KB of data flash rated for 30,000 erase cycles. Data flash supports background erase/program operations without stalling the CPU - specifications confirmed in Table 1.3 and Section 1.1 of the R5F56216BDBG datasheet.

Which communication peripherals are integrated into the R5F56216BDBG?

The R5F56216BDBG integrates USB 2.0 (2 ports), Ethernet MAC (10/100 Mbps), CAN 2.0B (1 channel, 32 mailboxes), SCI (6 channels), RSPI (2 channels), and I²C (2 channels). It also includes a 12-bit 8-channel ADC, dual 10-bit DACs, and a TFT-LCD controller. All peripherals are accessible via the LFBGA176 pinout and operate under independent clock domains - per functional summary in Table 1.2 and block diagram in Figure 1.2 of the R5F56216BDBG datasheet.

What package type and pin count does the R5F56216BDBG use?

The R5F56216BDBG uses the LFBGA176 package (PLBG0176GA-A), a 13 mm × 13 mm body with 0.8 mm ball pitch and 176 solder balls, including an exposed thermal pad. Pin assignments are fully documented in Figure 1.3 and Table 1.4 of the R5F56216BDBG datasheet, confirming 126 GPIOs, dedicated USB/Ethernet/CAN signals, and power/ground distribution optimized for noise-sensitive mixed-signal operation.