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Renesas R5F56216BDFP#H0

Part No.:
R5F56216BDFP#H0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F56216BDFP#H0.pdf
Description:
RX621 MCU 256K/64K QFP100 2.7-3.
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,477

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Product details

Overview

R5F56216BDFP#H0 from Renesas is a 32-bit RX CPU-based microcontroller delivering 165 DMIPS at 100 MHz, featuring single-precision IEEE-754 FPU, 256 KB flash, 64 KB SRAM, 32 KB data flash, 10-bit dual-channel DAC, 12-bit 8-channel ADC (or dual 10-bit 4-channel), Ethernet MAC 10/100 Mbps, USB 2.0 Full-Speed host/function/OTG, CAN 2.0B, and TFT-LCD interface - deployed in industrial HMIs and networked embedded controllers.

For engineers reviewing the R5F56216BDFP#H0 datasheet, R5F56216BDFP#H0 pinout, R5F56216BDFP#H0 application, or R5F56216BDFP#H0 equivalent, key selection criteria include LQFP100 package compatibility, 100 MHz real-time deterministic execution, integrated Ethernet+USB+CAN connectivity, low-power Deep Software Standby with RTC retention, and MPU-enforced memory protection for safety-critical firmware.

Technical Context

The R5F56216BDFP#H0 implements the RXv1 CPU core with CISC-Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a Memory Protection Unit (MPU) supporting region-based access control and background JTAG debug with high-speed trace capability for real-time firmware analysis.

Its clock system combines external 8–14 MHz crystal input with internal PLL to generate independent ICLK (up to 100 MHz), PCLK (up to 50 MHz), and BCLK (up to 50 MHz) domains. The MCU supports four low-power modes including Deep Software Standby with RTC operation and SRAM retention, enabled by 2.7–3.6 V single-supply operation and 480 µA/MHz run-mode efficiency.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv1 32-bit CISC-Harvard with 5-stage pipeline, 165 DMIPS @ 100 MHz
Flash Memory256 KB main flash, zero wait-state operation at full 100 MHz CPU speed
SRAM64 KB on-chip SRAM, no wait-state, supports instruction/operand execution and backup retention in Deep Standby
Analog Peripherals12-bit × 8-channel ADC (single sample/hold) or dual 10-bit × 4-channel ADCs; 10-bit × 2-channel DAC
Communication Interfaces1× CAN 2.0B (32 mailboxes), 6× SCI, 2× I²C (1 Mbit/s), 2× RSPI (18 Mbps master), USB 2.0 FS host/function/OTG, Ethernet MAC 10/100 Mbps (MII/RMII)
Timers & PWM12× 16-bit MTU2 channels (input capture, PWM, phase count), 4× 8-bit TMR, 4× 16-bit CMT, 2× watchdog timers (WDT + IWDT)
Package & EnvironmentLQFP100 (14 × 14 mm, 0.5 mm pitch), –40°C to +85°C operating temperature

Pinout & Package

LQFP100 package (PLQP0100KB-A), 14 × 14 mm body, 0.5 mm pitch, 100 pins, lead-free and RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated analog/digital power rails; AVCC/AVSS isolated for ADC/DAC reference stability
P00–P97 (e.g., P40–P47, P00–P07)General-purpose I/O126 GPIO total (LQFP100 variant supports 72 pins); 5 V tolerant, open-drain capable, internal pull-up
XTAL / EXTALCrystal oscillator inputsSupports 8–14 MHz main crystal; enables precise system clock generation via internal PLL
USB0_DP / USB0_DMUSB 2.0 Full-Speed differential pairIntegrated transceiver eliminates external PHY; supports host/function/OTG with 2 KB on-chip buffer
ET_RX_DV / ET_TX_EN / ET_MDIO / ET_MDCEthernet MAC physical layer interfaceRMII-compliant signals enable direct connection to external PHY with 2 KB TX/RX FIFOs and descriptor DMA
AN0–AN7Analog input channelsEight dedicated ADC input pins mapped to 12-bit unit; support simultaneous sampling and hardware-triggered conversion
DA0 / DA1DAC output channelsTwo buffered 10-bit voltage outputs (0 V to VREFH); usable for analog waveform generation or sensor calibration references

Key Features

FeatureDesign Value
Floating-point unit (FPU)IEEE-754 single-precision compliance enables deterministic math for motor control and signal processing without software emulation overhead
Data Flash endurance32 KB with 30,000 erase cycles and background erase/program - allows field firmware updates without CPU stall
Real-time interrupt responseAs few as 5 CPU clock cycles latency enables sub-microsecond reaction to critical events like fault detection or encoder edge capture
Memory Protection Unit (MPU)Configurable regions enforce privilege-level access control between application, bootloader, and peripheral drivers - essential for IEC 61508 SIL2-certifiable designs
Low-power Deep Software StandbyRTC continues running while CPU, flash, and most peripherals are powered down; SRAM retains data using <1 µA current
TFT-LCD interface supportDirect pixel-data transfer via EXDMA controller to WQVGA panels - offloads graphics rendering from CPU and reduces frame-buffer memory bandwidth

Applications

Industrial HMI ControllerNetworked PLC I/O Module

Use Scenario: Touch-enabled factory floor display with real-time process visualization, alarm logging, and local recipe management.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving 480×272 WQVGA TFT-LCD via EXDMA, managing USB OTG for configuration updates, and servicing CAN bus field devices.

Use Value: Integrated Ethernet + USB + CAN eliminates external bridge ICs; 256 KB flash stores GUI assets and firmware; 10-bit DAC calibrates analog sensor inputs.

Use Scenario: DIN-rail mounted remote I/O node collecting analog/digital sensor data and forwarding to SCADA over Ethernet.

IC Role / Device Role / Timing Role: Deterministic real-time controller handling 12-bit ADC sampling at 1 µs/channel, timestamping events via RTC, and transmitting via Ethernet MAC with DMA-accelerated packet assembly.

Use Value: Dual 10-bit ADC units allow simultaneous sampling of 8 channels; Deep Standby mode maintains RTC and SRAM during brownout; 64 KB SRAM buffers burst data before transmission.

Building Automation GatewayMedical Device Control Unit

Use Scenario: Protocol translator bridging BACnet MS/TP (via RSPI) and Modbus TCP (via Ethernet) in HVAC control panels.

IC Role / Device Role / Timing Role: Dual-protocol gateway with hardware-accelerated CRC calculation for BACnet frames and descriptor-based Ethernet DMA for TCP/IP stack offload.

Use Value: Integrated 2× RSPI (18 Mbps) and Ethernet MAC eliminate external protocol ICs; CRC calculator supports X16+X12+X5+1 polynomial for BACnet compliance.

Use Scenario: Portable diagnostic instrument requiring precise analog front-end control, battery-backed RTC, and USB host for peripheral attachment (e.g., thermal printer).

IC Role / Device Role / Timing Role: Safety-monitored controller executing IEC 62304 Class B firmware, using MPU to isolate diagnostic algorithms from USB stack, and managing low-power states during idle periods.

Use Value: MPU enforces memory isolation between USB driver and clinical measurement routines; 480 µA/MHz run mode extends battery life; 10-bit DAC generates precision reference voltages for sensor biasing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F56217BDFP#H0384 KB flash, 64 KB SRAM, same LQFP100 package and peripheral setHigher firmware storage capacity required for feature-rich HMI or protocol stacks with TLSSelect when additional flash headroom is needed for field-upgradable features or larger RTOS images
R5F562N6BDFP#H0RX62N group variant; includes SDRAM controller and EXDMA not present in RX621; otherwise identical pinout and core specsSuitable for applications requiring external memory expansion (e.g., video buffering or large data logging)Choose only if external SDRAM interface is mandatory; otherwise RX621 offers better cost/performance for standalone control

Compared with R5F56216BDFP#H0, R5F56217BDFP#H0 provides 128 KB more flash for complex GUI or protocol stacks without changing PCB layout, while R5F562N6BDFP#H0 adds SDRAM support at the cost of higher BOM complexity and power - making R5F56216BDFP#H0 optimal for compact, self-contained industrial controllers.

Availability

R5F56216BDFP#H0 is available at Aetrix Electronics and suitable for industrial HMIs, networked PLC I/O modules, building automation gateways, and medical device control units requiring stable component supply across multi-year production cycles.

Supply support for R5F56216BDFP#H0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX621 Group targets cost-sensitive industrial control applications requiring high-performance real-time processing, integrated connectivity (Ethernet/USB/CAN), and functional safety support - with R5F56216BDFP#H0 optimized for LQFP100-based designs needing balanced flash, RAM, and peripheral integration.

FAQ

What is the maximum operating frequency and core performance of the R5F56216BDFP#H0?

The R5F56216BDFP#H0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS using the 32-bit RXv1 CPU core. Its single-precision IEEE-754 FPU, 32 × 32 → 64-bit accumulator, and mult/divide unit enable deterministic execution for motor control and digital signal processing tasks without software library overhead. This performance level is verified under worst-case voltage (2.7 V) and temperature (85°C) conditions per the official Renesas datasheet R01DS0052EJ0140.

Does the R5F56216BDFP#H0 support Ethernet and USB simultaneously, and what interfaces are provided?

Yes, the R5F56216BDFP#H0 supports concurrent Ethernet and USB operation. It integrates a 10/100 Mbps Ethernet MAC with RMII/MII interface support and dedicated 2 KB transmit/receive FIFOs managed by descriptor-based DMA. Simultaneously, it includes a USB 2.0 Full-Speed host/function/OTG module with integrated transceiver and 2 KB on-chip buffer - both operate independently without resource contention. Pin assignments for ET_RX_DV, ET_TX_EN, USB0_DP, and USB0_DM are defined in the LQFP100 package layout (Figure 1.7, R01DS0052EJ0140).

What analog capabilities does the R5F56216BDFP#H0 provide, and how are they configured?

The R5F56216BDFP#H0 provides flexible analog functionality: one 12-bit × 8-channel ADC with shared sample/hold, or two independent 10-bit × 4-channel ADC units - mutually exclusive configurations selected at reset. It also includes two 10-bit DAC channels (DA0/DA1) with 0 V to VREFH output range. Conversion can be triggered by software, MTU/TMR timers, or external signals, and supports scan mode with hardware averaging. These capabilities are documented in Section 1.1 and Table 1.1 of the R01DS0052EJ0140 datasheet.

Is the R5F56216BDFP#H0 pin-compatible with other RX621 Group MCUs in LQFP100 packaging?

Yes, the R5F56216BDFP#H0 shares identical LQFP100 pinout (PLQP0100KB-A) with all other RX621 Group variants in the same package, including R5F56217BDFP#H0 and R5F56218BDFP#H0. Pin functions, power/ground locations, and peripheral mappings are fully consistent across these parts - enabling drop-in replacement for flash/RAM scaling without PCB revision. This compatibility is confirmed in Table 1.2 and Figure 1.7 of the R01DS0052EJ0140 datasheet.

What low-power modes are supported by the R5F56216BDFP#H0, and what peripherals remain active in Deep Software Standby?

The R5F56216BDFP#H0 supports four low-power modes: Sleep, All-Module Clock Stop, Software Standby, and Deep Software Standby. In Deep Software Standby, the CPU, flash, SRAM, and most peripherals are halted, but the RTC continues running from the 32 kHz subclock, SRAM contents are retained, and wakeup is possible via IRQ pins or RTC alarm. Power consumption drops below 1 µA, and the mode is entered via software command with VCC maintained. Details are specified in Section 1.1 "Low Power Consumption Facilities" of R01DS0052EJ0140.

R5F56216BDFP#H0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX621
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RX
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10/12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56216BDFP#H0 FAQ

1.How can I place an order for R5F56216BDFP#H0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56216BDFP#H0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56216BDFP#H0 reliable?

The price and inventory of R5F56216BDFP#H0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56216BDFP#H0 is usually 5 days.

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4.How is shipping managed for R5F56216BDFP#H0?

R5F56216BDFP#H0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56216BDFP#H0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56216BDFP#H0?

For technical support, including R5F56216BDFP#H0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56216BDFP#H0 requirements.

6.How does Aetrix verify that R5F56216BDFP#H0 is sourced from the original manufacturer or authorized distributors?

All R5F56216BDFP#H0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56216BDFP#H0 meets industry standards.

7.What is the process for return or replacement of R5F56216BDFP#H0?

All R5F56216BDFP#H0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56216BDFP#H0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56216BDFP#H0 part is unused and in its original packaging.

Return procedure for R5F56216BDFP#H0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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