Renesas R5F56308DDLA#U0

Overview

R5F56308DDLA#U0 from Renesas is a 100-MHz 32-bit RX CPU core microcontroller with single-precision IEEE-754 FPU, 512 KB on-chip flash, 64 KB SRAM, and integrated 12-bit A/D (21 ch), 10-bit D/A (2 ch), USB 2.0 full-speed, CAN (1 channel), and RTC - deployed in industrial motor control and embedded HMI systems.

For engineers reviewing the R5F56308DDLA#U0 datasheet, R5F56308DDLA#U0 pinout, R5F56308DDLA#U0 application, or R5F56308DDLA#U0 equivalent, key selection criteria include its 100 MHz operation, TFLGA-100 package with 5-V-tolerant I/O, -40 to +85°C temperature grade, and support for IEC60730-compliant safety functions including CRC, IWDT, and A/D self-diagnosis.

Technical Context

The R5F56308DDLA#U0 implements the RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual clock domains: ICLK up to 100 MHz for CPU execution and PCLK up to 50 MHz for peripherals, with independent division/multiplication settings per domain.

Its peripheral set includes MTU2 (6-channel 16-bit timer with complementary PWM), TPU (12-channel 16-bit timer), 13 SCI channels (including LIN-capable SCId), 4 RIIC interfaces (1 × FM+), and 3 RSPI units - all accessible via dedicated interrupt sources (180 total) and DMA/DTC controllers supporting background transfers without CPU intervention.

Key Specifications

Pinout & Package

Package: TFLGA-100 (PTLG0100KA-A), 5.5 × 5.5 mm, 0.5-mm pitch, 100-terminal fine-pitch land grid array with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56308DDLA#U0, R5F56308DDFP#V0 offers identical functionality in a more manufacturable LQFP package but increases board area by ~3.5×; R5F56307DDLA#U0 reduces flash capacity by 25% while maintaining full peripheral compatibility, making it optimal for legacy code migration with minimal requalification.

Availability

R5F56308DDLA#U0 is available at Aetrix Electronics and suitable for industrial motor control, embedded HMI, smart energy metering, and safety-critical PLC modules requiring stable component supply across multi-year production cycles.

Supply support for R5F56308DDLA#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX630 Group targets high-performance industrial applications demanding real-time determinism, functional safety, and rich analog/peripheral integration - with R5F56308DDLA#U0 optimized for space-constrained, thermally demanding environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F56308DDLA#U0?

The R5F56308DDLA#U0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution essential for motor control and safety-critical applications where the R5F56308DDLA#U0 is commonly deployed.

Does the R5F56308DDLA#U0 support IEC60730 functional safety compliance?

Yes, the R5F56308DDLA#U0 includes multiple hardware features for IEC60730 compliance: oscillation-stop detection, dedicated independent watchdog timer (IWDT) with LOCO clock source, CRC calculator supporting three polynomials, and self-diagnostic capability for the 10-bit A/D converter. These features are documented in the R01DS0060EJ0160 datasheet and allow developers to implement Class B safety routines without external components - a key design value of the R5F56308DDLA#U0 in industrial control systems.

What package type and pin count does the R5F56308DDLA#U0 use?

The R5F56308DDLA#U0 uses a 100-terminal TFLGA (Thin Fine-Pitch Land Grid Array) package designated PTLG0100KA-A, measuring 5.5 × 5.5 mm with 0.5-mm pitch. This fine-pitch package provides high I/O density and thermal performance in compact industrial designs. Its 5-V-tolerant GPIO pins simplify interface with legacy 5 V peripherals, and the exposed thermal pad enhances heat dissipation - critical for sustained 100 MHz operation in the R5F56308DDLA#U0.

How much on-chip memory does the R5F56308DDLA#U0 integrate?

The R5F56308DDLA#U0 integrates 512 KB of on-chip flash memory (executed at 100 MHz with zero wait states), 64 KB of SRAM (also zero wait states), and 32 KB of data flash rated for 100,000 write/erase cycles. The flash supports both on-board and off-board programming, and the data flash enables background operations (BGO) for EEPROM-like functionality. This memory configuration balances code size, runtime performance, and field-upgrade capability in the R5F56308DDLA#U0's target applications.

Which communication interfaces are available on the R5F56308DDLA#U0?

The R5F56308DDLA#U0 provides USB 2.0 full-speed (12 Mbps), CAN v2.0B (1 channel, 32 mailboxes), 13 serial communications interface (SCI) channels (including LIN-capable SCId), 4 I2C bus interfaces (1 × FM+), 3 RSPI units, and 1 IEBus controller. These interfaces support simultaneous high-speed data acquisition, fieldbus connectivity, and human-machine interaction - making the R5F56308DDLA#U0 suitable for complex embedded systems requiring multi-protocol interoperability.