Renesas R5F5630ADDBG#U0

Overview

R5F5630ADDBG#U0 from Renesas is a 100-MHz 32-bit RX630 Group MCU with on-chip FPU, 768 KB flash, 96 KB SRAM, and 32 KB data flash. It integrates USB 2.0 full-speed, CAN (3 channels), 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and 148 GPIO pins. Designed for industrial motor control and embedded HMI applications requiring deterministic real-time response and IEC 60730 compliance.

For engineers reviewing the R5F5630ADDBG#U0 datasheet, R5F5630ADDBG#U0 pinout, R5F5630ADDBG#U0 application, or R5F5630ADDBG#U0 equivalent, key selection criteria include its LFBGA-176 package, -40 to +85°C temperature grade, integrated CAN/USB dual-interface capability, and support for background operation of data flash programming.

Technical Context

The R5F5630ADDBG#U0 implements the RX CPU core with CISC Harvard architecture, 5-stage pipeline, and IEEE-754 single-precision FPU-enabling 165 DMIPS at 100 MHz. Its memory subsystem includes zero-wait-state 100-MHz flash and SRAM, plus 32 KB reprogrammable data flash supporting background erase/program (BGO).

Peripheral integration centers on deterministic timing: MTU2 (6-channel 16-bit timer with complementary PWM), TPU (12-channel 16-bit timer), and dual 10-bit D/A converters synchronized to timer triggers. Clock management supports independent domain scaling (ICLK up to 100 MHz, PCLK up to 50 MHz) and four low-power modes including deep software standby with RTC backup.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 mm × 13 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630ADDBG#U0, R5F5630ADDFC offers identical functionality in an LQFP package for easier prototyping, while R5F5630BDDBG provides 232 KB additional flash for complex connectivity stacks-both require no firmware modification but differ in physical integration and memory scalability.

Availability

R5F5630ADDBG#U0 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, medical infusion pumps, and smart energy meter interfaces requiring stable component supply across multi-year production cycles.

Supply support for R5F5630ADDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX630 Group targets high-performance industrial embedded applications demanding real-time determinism, functional safety, and rich analog/motor control peripherals-all implemented in a single-chip solution.

FAQ

What is the maximum operating frequency and core performance of the R5F5630ADDBG#U0?

The R5F5630ADDBG#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS using the 32-bit RX CPU core with integrated IEEE-754 single-precision floating-point unit. Its 5-stage pipeline and variable-length instruction set enable ultra-compact code and deterministic interrupt latency critical for real-time motor control loops. The R5F5630ADDBG#U0 achieves this performance with zero-wait-state access to both flash and SRAM.

Does the R5F5630ADDBG#U0 support IEC 60730 functional safety compliance?

Yes, the R5F5630ADDBG#U0 includes multiple hardware features required for IEC 60730 Class B compliance: oscillation-stop detection, hardware CRC calculator, self-diagnostic function for the 10-bit A/D converter, independent watchdog timer (IWDT) with dedicated LOCO clock, and memory protection unit (MPU). These capabilities reduce reliance on external safety monitors and simplify certification for household and industrial appliances. The R5F5630ADDBG#U0 datasheet documents all safety mechanisms in Section 2.3.

What package type and pin count does the R5F5630ADDBG#U0 use?

The R5F5630ADDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 13 mm × 13 mm body size and 0.8 mm ball pitch. This package supports 148 general-purpose I/O pins with 5-V tolerance on 54 pins, open-drain capability, and programmable pull-up resistors. The R5F5630ADDBG#U0's LFBGA footprint enables high-density PCB layouts while maintaining thermal performance for industrial ambient conditions.

How many CAN and USB interfaces does the R5F5630ADDBG#U0 integrate?

The R5F5630ADDBG#U0 integrates three fully compliant ISO 11898-1 CAN 2.0B controllers (each with 32 mailboxes) and one USB 2.0 full-speed function module supporting 12 Mbps transfer rates in self-powered or bus-powered modes. Both interfaces operate concurrently with dedicated DMA channels and on-chip 2 KB USB buffer memory. The R5F5630ADDBG#U0's dual high-speed serial capability eliminates external protocol bridge ICs in gateway and industrial communication designs.

What are the flash and SRAM capacities of the R5F5630ADDBG#U0?

The R5F5630ADDBG#U0 contains 768 KB of on-chip main flash memory and 96 KB of zero-wait-state SRAM, both accessible at 100 MHz. It also includes 32 KB of data flash memory rated for 100,000 write/erase cycles and supporting background operation (BGO) for concurrent program execution and firmware updates. All memory blocks are protected by the integrated memory protection unit (MPU) to enforce secure partitioning in multitask environments. The R5F5630ADDBG#U0's memory architecture eliminates external RAM/flash in cost-sensitive industrial controllers.