Renesas R5F5630BCDBG#U0

Overview

R5F5630BCDBG#U0 from Renesas is a 100-MHz 32-bit RX CPU-based microcontroller with single-precision IEEE-754 FPU, 1 Mbyte on-chip flash, 96 Kbytes SRAM, and integrated USB 2.0 full-speed, CAN, 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and temperature sensor. It targets industrial motor control and embedded HMI applications requiring deterministic real-time performance and functional safety support.

For engineers reviewing the R5F5630BCDBG#U0 datasheet, R5F5630BCDBG#U0 pinout, R5F5630BCDBG#U0 application, or R5F5630BCDBG#U0 equivalent, key selection criteria include its LFBGA-176 package, -40 to +85°C operating range, 100 MHz max clock, 32-bit FPU for motion algorithm acceleration, and IEC60730-compliant self-test features including CRC, IWDT, and A/D diagnostic.

Technical Context

The R5F5630BCDBG#U0 implements the RXv1 CPU core with 5-stage CISC Harvard pipeline, variable-length instructions, and memory protection unit (MPU). It supports little-endian data and instruction layout, with on-chip 32×32→64-bit multiplier and 32/32→32-bit divider executing in 1 and 2 cycles respectively.

Its clock system integrates PLL, 50-MHz HOCO, 125-kHz LOCO, and 32-kHz sub-clock oscillator, enabling independent domain clocking: ICLK up to 100 MHz (CPU), PCLK up to 50 MHz (peripherals), FCLK up to 50 MHz (FlashIF), and BCLK up to 50 MHz (external bus). The MCU includes dual debugging interfaces: JTAG and two-wire FINE.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8-mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630BCDBG#U0, R5F5630BDDFC offers identical functionality in an LQFP package for simplified layout and hand-soldering, while R5F5630BDDBG shares the same LFBGA footprint but lacks extended temperature qualification-making the original part optimal for thermally demanding deployments requiring guaranteed operation to +85°C.

Availability

R5F5630BCDBG#U0 is available at Aetrix Electronics and suitable for industrial motor control, embedded HMI, smart energy gateway, and functional safety PLC module applications requiring stable component supply and long-term lifecycle assurance.

Supply support for R5F5630BCDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX630 Group, including R5F5630BCDBG#U0, was designed for high-performance embedded applications demanding real-time determinism, functional safety compliance, and rich peripheral integration in space-constrained industrial systems.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F5630BCDBG#U0?

The R5F5630BCDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with 5-stage pipeline, CISC Harvard architecture, and variable-length instructions. It delivers 165 DMIPS and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for motor control and safety-critical tasks in the R5F5630BCDBG#U0.

Does the R5F5630BCDBG#U0 support IEC60730 functional safety compliance?

Yes, the R5F5630BCDBG#U0 includes hardware features required for Class B compliance: oscillation-stop detection, independent watchdog timer (IWDT) with dedicated LOCO clock, CRC calculator, self-diagnostic function for the 10-bit A/D converter, and memory protection unit (MPU). These capabilities reduce external component count and simplify certification efforts for the R5F5630BCDBG#U0 in household appliance and industrial control applications.

What package type and pin count does the R5F5630BCDBG#U0 use?

The R5F5630BCDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8-mm ball pitch. This LFBGA package supports high I/O density and thermal performance in compact industrial modules, distinguishing it from LQFP variants like R5F5630BDDFC. The R5F5630BCDBG#U0's pinout is fully documented in Renesas datasheet R01DS0060EJ0160.

How much on-chip memory does the R5F5630BCDBG#U0 integrate?

The R5F5630BCDBG#U0 integrates 1 Mbyte of on-chip flash memory (executed at 100 MHz with zero wait states), 96 Kbytes of SRAM (also zero-wait), and 32 Kbytes of data flash rated for 100,000 program/erase cycles. The flash supports both on-board and off-board programming, and the data flash allows background operation (BGO) for concurrent read/write. This memory configuration is fixed for the R5F5630BCDBG#U0 and confirmed in Table 1.3 of the official datasheet.

Which communication interfaces are available on the R5F5630BCDBG#U0?

The R5F5630BCDBG#U0 provides USB 2.0 full-speed (12 Mbps), CAN (3 channels, ISO11898-1 compliant, 32 mailboxes each), 13-channel SCI (with UART, SPI, I²C, LIN, and smart-card modes), 4-channel I²C (up to 1 Mbps), 3-channel RSPI, and 1-channel IEBus. These interfaces enable multi-protocol connectivity in industrial gateways and control systems, and all are natively supported by the R5F5630BCDBG#U0 without external transceivers or level shifters.