Renesas R5F5630BDDBG#U0

Overview

R5F5630BDDBG#U0 from Renesas is a 100-MHz 32-bit RX CPU core microcontroller with single-precision IEEE-754 FPU, 1 Mbyte on-chip flash, 96 Kbytes SRAM, and integrated USB 2.0 full-speed, CAN (3 channels), 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and temperature sensor - deployed in industrial motor control and embedded HMI systems.

For engineers reviewing the R5F5630BDDBG#U0 datasheet, R5F5630BDDBG#U0 pinout, R5F5630BDDBG#U0 application, or R5F5630BDDBG#U0 equivalent, key selection criteria include its LFBGA-176 package, -40 to +85°C operating range, 100 MHz real-time deterministic execution, and support for IEC60730-compliant safety functions including CRC, IWDT, and A/D self-diagnosis.

Technical Context

The R5F5630BDDBG#U0 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for secure embedded execution. It supports little-endian data and instruction layout, with 16×32-bit general-purpose registers and a 64-bit accumulator.

Its clock system integrates PLL, 50-MHz HOCO, 125-kHz LOCO, and 32-kHz sub-clock oscillator - enabling independent domain clocking: ICLK up to 100 MHz (CPU), PCLK up to 50 MHz (peripherals), FCLK up to 50 MHz (FlashIF), and BCLK up to 50 MHz (external bus).

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 × 13 mm body, 0.8-mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5630BDDFC#U0, the R5F5630BDDBG#U0 offers superior thermal performance and higher I/O density in LFBGA; compared with R5F5630BCDBG#U0, it provides 232 Kbytes additional flash for bootloader redundancy, OTA update partitions, and safety-certified code separation.

Availability

R5F5630BDDBG#U0 is available at Aetrix Electronics and suitable for industrial motor control, factory automation controllers, and medical infusion pumps requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for R5F5630BDDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for industrial, automotive, and IoT markets.

The RX630 Group targets high-performance embedded applications demanding real-time determinism, functional safety, and rich peripheral integration - designed specifically for industrial automation, motor control, and medical devices requiring IEC60730 compliance.

FAQ

What is the maximum operating frequency and core architecture of the R5F5630BDDBG#U0?

The R5F5630BDDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with 5-stage pipeline, CISC Harvard architecture, and variable-length instructions. It achieves 165 DMIPS and includes a single-precision IEEE-754 FPU. This architecture enables deterministic real-time execution critical for motor control and safety-critical applications where the R5F5630BDDBG#U0 is deployed.

Does the R5F5630BDDBG#U0 support IEC60730 functional safety compliance?

Yes, the R5F5630BDDBG#U0 integrates multiple hardware features required for Class C IEC60730 compliance: oscillation-stop detection, dedicated independent watchdog timer (IWDT) with on-chip oscillator, CRC calculator supporting three polynomials, and self-diagnostic capability for the 10-bit A/D converter. These features reduce reliance on external safety monitors and simplify certification efforts for the R5F5630BDDBG#U0 in household and industrial appliances.

What package type and pin count does the R5F5630BDDBG#U0 use?

The R5F5630BDDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 13 × 13 mm body size and 0.8-mm ball pitch. This LFBGA package provides high I/O density, improved thermal dissipation over LQFP alternatives, and compatibility with standard surface-mount assembly processes used for the R5F5630BDDBG#U0 in industrial PCBs.

How much on-chip memory does the R5F5630BDDBG#U0 include?

The R5F5630BDDBG#U0 includes 1 Mbyte of on-chip flash memory (executed at 100 MHz with zero wait states), 96 Kbytes of SRAM (also zero wait states), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. This memory configuration supports complex firmware with USB stack, CAN protocol handlers, and real-time control algorithms - all resident on the R5F5630BDDBG#U0 without external memory.

Which communication interfaces are integrated into the R5F5630BDDBG#U0?

The R5F5630BDDBG#U0 integrates USB 2.0 full-speed (12 Mbps), CAN (3 channels, 32 mailboxes each), 13-channel SCI (with asynchronous, SPI, I²C, LIN, and smart-card modes), 4-channel I²C (RIIC), 3-channel RSPI, and 1-channel IEBus. This comprehensive interface set allows the R5F5630BDDBG#U0 to serve as a central hub connecting motors, sensors, displays, and fieldbuses in industrial equipment without external bridge ICs.