Renesas R5F5630BDDFP#V0

Overview

R5F5630BDDFP#V0 from Renesas is a 100-MHz 32-bit RX CPU-based microcontroller with single-precision IEEE-754 FPU, 1 Mbyte on-chip flash, 96 Kbytes SRAM, and integrated USB 2.0 full-speed, CAN, 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and temperature sensor. It targets industrial motor control and embedded gateway applications requiring deterministic real-time response and functional safety support.

For engineers reviewing the R5F5630BDDFP#V0 datasheet, R5F5630BDDFP#V0 pinout, R5F5630BDDFP#V0 application, or R5F5630BDDFP#V0 equivalent, this page delivers verified technical context, package-specific pin definitions, IEC60730-ready peripherals, and validated alternative options for design-in continuity.

Technical Context

The R5F5630BDDFP#V0 implements a CISC Harvard architecture with 5-stage pipeline, supporting 165 DMIPS at 100 MHz and variable-length instructions for ultra-compact code density. Its memory protection unit (MPU) enforces secure execution zones, while dual debugging interfaces (JTAG and FINE) enable non-intrusive trace and real-time analysis.

It integrates three CAN channels compliant with ISO11898-1 (32 mailboxes per channel), USB 2.0 full-speed device controller with 2 Kbyte on-chip buffer, and dual A/D converters - one 12-bit unit (21 channels, 1.0 µs conversion at 50 MHz PCLK) and one 10-bit unit (8 channels). The MCU operates from a single 2.7–3.6 V supply with four low-power modes and battery-backed RTC.

Key Specifications

Pinout & Package

Package: PLQP0100KB-A - 100-pin LQFP, 14 × 14 mm body, 0.5-mm pitch, exposed pad (thermal pad not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630ADDFP#V0, the R5F5630BDDFP#V0 provides 232 Kbytes additional flash for larger firmware or OTA update partitions; compared with R5F5630BDDFB#V0, it trades peripheral count and external bus capability for compact 100-pin footprint and lower PCB routing complexity.

Availability

R5F5630BDDFP#V0 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, and energy metering terminals requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability validation.

Supply support for R5F5630BDDFP#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The RX630 Group, including R5F5630BDDFP#V0, was designed for high-performance embedded applications demanding real-time determinism, functional safety (IEC60730), and rich connectivity in constrained industrial environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F5630BDDFP#V0?

The R5F5630BDDFP#V0 features a 32-bit RX CPU core with CISC Harvard architecture and 5-stage pipeline, operating at a maximum frequency of 100 MHz. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit (FPU) for deterministic math-intensive tasks like motor control algorithms. The R5F5630BDDFP#V0 also supports variable-length instructions to optimize code density and memory usage.

Does the R5F5630BDDFP#V0 support functional safety standards such as IEC60730?

Yes, the R5F5630BDDFP#V0 integrates multiple hardware features for IEC60730 Class B compliance, including oscillation-stop detection, built-in CRC calculator (with three selectable polynomials), self-diagnostic function for the 10-bit A/D converter, independent watchdog timer (IWDT) with dedicated 125-kHz LOCO clock, and frequency measurement capability for main/sub/HOCO/LOCO/PLL clocks. These capabilities are documented in the R5F5630BDDFP#V0 datasheet and user's manual.

What are the memory resources available on the R5F5630BDDFP#V0?

The R5F5630BDDFP#V0 includes 1 Mbyte of on-chip flash memory (operating at 100 MHz with zero wait states), 96 Kbytes of SRAM (also zero wait states), and 32 Kbytes of data flash rated for 100,000 program/erase cycles. The flash supports both on-board and off-board programming, and the data flash enables background operations (BGO) for concurrent read/write during application execution. This memory configuration is fixed for the R5F5630BDDFP#V0 part number.

Which communication interfaces does the R5F5630BDDFP#V0 support, and how many channels are available?

The R5F5630BDDFP#V0 supports USB 2.0 full-speed (1 port), CAN (3 channels, ISO11898-1 compliant, 32 mailboxes each), SCI (10 channels in 100-pin package), I2C (4 channels, one FM+), RSPI (3 channels), and IEBus (1 channel). The exact SCI count is reduced to 10 in the 100-pin LQFP variant versus 13 in larger packages due to pin count constraints - confirmed in Table 1.2 of the R5F5630BDDFP#V0 datasheet.

What is the package type and thermal specification for the R5F5630BDDFP#V0?

The R5F5630BDDFP#V0 uses the PLQP0100KB-A package: a 100-pin LQFP with 14 × 14 mm body size, 0.5-mm lead pitch, and exposed thermal pad. It is rated for industrial temperature range (-40°C to +85°C), designated by the "D" suffix in the part number. The device operates from a single 2.7–3.6 V supply and supports battery-backed RTC via VBATT pin.