Renesas R5F5630BDDLC#U0

Overview

R5F5630BDDLC#U0 from Renesas is a 100-MHz 32-bit RX CPU-based microcontroller featuring single-precision IEEE-754 FPU, 1 Mbyte on-chip flash, 96 Kbytes SRAM, USB 2.0 full-speed interface, CAN v2.0B (3 channels), and 21-channel 12-bit A/D converter. It operates from a single 2.7–3.6 V supply and supports industrial temperature range (−40 to +85°C) in a 177-pin TFLGA package.

For engineers reviewing the R5F5630BDDLC#U0 datasheet, R5F5630BDDLC#U0 pinout, R5F5630BDDLC#U0 application, or R5F5630BDDLC#U0 equivalent, key selection criteria include its 100 MHz real-time performance (165 DMIPS), integrated CAN/USB/IEBus interfaces, low-power modes with RTC battery backup, and IEC60730-compliant safety features including CRC, IWDT, and A/D self-diagnosis.

Technical Context

The R5F5630BDDLC#U0 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates dual clock domains: system clock (ICLK) up to 100 MHz and peripheral clock (PCLK) up to 50 MHz, with independent division/multiplication settings for FlashIF (FCLK), external bus (BCLK), and peripheral modules.

Its peripheral subsystem includes MTU2 (6-channel 16-bit timer with complementary PWM), TPU (12-channel 16-bit timer), 4-channel DMA controller (DMACA), data transfer controller (DTC), and dual A/D converters - one 12-bit unit (21 ch, 1 µs conversion @50 MHz PCLK) and one 10-bit unit (8 ch) - both supporting software, timer, and external trigger start modes.

Key Specifications

Pinout & Package

Package: 177-pin Thin Fine-Pitch Land Grid Array (TFLGA), PTLG0177KA-A, 8 × 8 mm body, 0.5-mm pitch, 0.75-mm height, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630BDDLC#U0, the R5F5630BDDFC#U0 offers identical functionality in a larger LQFP package ideal for prototyping and manual assembly, while the R5F5630BDDBG#U0 provides superior thermal performance in a compact BGA form factor - all three share identical register maps, firmware compatibility, and peripheral feature sets.

Availability

R5F5630BDDLC#U0 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, smart metering, and medical device applications requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for R5F5630BDDLC#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX630 Group targets high-performance, safety-aware embedded systems requiring real-time determinism, rich analog integration, and functional safety certification - designed specifically for industrial control, building automation, and automotive ECUs.

FAQ

What is the maximum operating frequency and core architecture of the R5F5630BDDLC#U0?

The R5F5630BDDLC#U0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for motor control and industrial automation applications where the R5F5630BDDLC#U0 is deployed.

Does the R5F5630BDDLC#U0 support IEC60730 functional safety compliance?

Yes, the R5F5630BDDLC#U0 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, built-in CRC calculator with three selectable polynomials, independent watchdog timer (IWDT) with dedicated oscillator, and self-diagnostic functions for the 10-bit A/D converter. These capabilities allow system designers to meet safety requirements without adding external components - a key advantage of the R5F5630BDDLC#U0 in certified appliances and industrial equipment.

What package type and pin count does the R5F5630BDDLC#U0 use?

The R5F5630BDDLC#U0 uses a 177-pin Thin Fine-Pitch Land Grid Array (TFLGA) package, designated PTLG0177KA-A, with 8 × 8 mm body size and 0.5-mm pitch. This compact, surface-mount package supports high I/O density (148 GPIO) with 5-V tolerant pins and open-drain capability. Its small footprint makes the R5F5630BDDLC#U0 ideal for space-constrained designs such as portable medical devices and smart sensors.

How many communication interfaces does the R5F5630BDDLC#U0 integrate?

The R5F5630BDDLC#U0 integrates up to 22 communication interfaces: USB 2.0 full-speed (1 port), CAN v2.0B (3 channels, 32 mailboxes each), SCI (13 channels with asynchronous/clock-synchronous/Smart Card modes), I2C (4 channels, 1 Mbps max), RSPI (3 channels), and IEBus (1 channel). This extensive connectivity enables the R5F5630BDDLC#U0 to serve as a central hub in multi-protocol systems like factory HMIs or automotive gateways without external bridge ICs.

What are the memory resources available on the R5F5630BDDLC#U0?

The R5F5630BDDLC#U0 includes 1 Mbyte of on-chip flash memory (executed at 100 MHz with zero wait states), 96 Kbytes of SRAM (also zero-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. The flash supports on-board programming via JTAG/FINE and off-board parallel programming. These memory resources make the R5F5630BDDLC#U0 suitable for complex firmware with bootloader, application, and parameter storage - all within a single R5F5630BDDLC#U0 die.