Renesas R5F5630BDDLK#U0

Overview

R5F5630BDDLK#U0 from Renesas is a 100-MHz 32-bit RX CPU-based microcontroller with single-precision IEEE-754 FPU, 1 Mbyte on-chip flash, 96 Kbytes SRAM, and integrated USB 2.0 full-speed, CAN, 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and temperature sensor. It targets industrial motor control, PLCs, and embedded HMI systems requiring deterministic real-time performance and functional safety support.

For engineers reviewing the R5F5630BDDLK#U0 datasheet, R5F5630BDDLK#U0 pinout, R5F5630BDDLK#U0 application, or R5F5630BDDLK#U0 equivalent, key selection criteria include its 145-pin TFLGA package (PTLG0145KA-A), -40 to +85°C operating range, 100-MHz deterministic execution (165 DMIPS), IEC60730-compliant self-test features, and dual-clock domain architecture supporting independent PCLK/ICLK scaling.

Technical Context

The R5F5630BDDLK#U0 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for secure partitioning. Its clock system supports independent configuration of ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (up to 50 MHz), and BCLK (up to 50 MHz), enabling precise peripheral timing control without CPU clock coupling.

It integrates dual timer subsystems: MTU2a (6-channel 16-bit) for complementary PWM and phase counting, and TPUa (12-channel 16-bit) for input capture, output compare, and encoder interface. The device supports background operation for E2 data flash programming/erasing (100,000 cycles) and includes dedicated IWDT with 125-kHz LOCO clock for fail-safe reset independence.

Key Specifications

Pinout & Package

Package: 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), PTLG0145KA-A, 7 mm × 7 mm, 0.5-mm pitch, 0.8-mm height. RoHS-compliant, lead-free, moisture-sensitive level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5630ADDFB#U0, the R5F5630BDDLK#U0 delivers 30% more flash in a 73% smaller package area, enabling denser industrial modules; versus R5F5660BDFB#U0, it offers proven qualification and lower BOM cost where 100-MHz throughput and IEC60730 Class B suffice.

Availability

R5F5630BDDLK#U0 is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controllers, embedded HMIs, and functional safety gateways requiring stable component supply across multi-year production cycles.

Supply support for R5F5630BDDLK#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX630 Group is designed for high-reliability industrial applications demanding real-time determinism, functional safety compliance (IEC60730), and rich analog/peripheral integration in compact packages.

FAQ

What is the maximum operating frequency and core performance of the R5F5630BDDLK#U0?

The R5F5630BDDLK#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance using the 32-bit RX CPU core. Its single-precision IEEE-754 floating-point unit enables efficient math-intensive tasks such as motor control algorithms and sensor fusion, while zero-wait-state flash ensures deterministic instruction fetch timing critical for real-time responsiveness.

Does the R5F5630BDDLK#U0 support functional safety standards like IEC60730?

Yes, the R5F5630BDDLK#U0 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, built-in CRC calculator with three selectable polynomials, independent watchdog timer (IWDT) with dedicated LOCO clock, self-diagnostic function for the 10-bit A/D converter, and clock frequency measurement capability - all documented in the RX630 Group hardware manual.

What package type and pin count does the R5F5630BDDLK#U0 use?

The R5F5630BDDLK#U0 uses a 145-pin Thin Fine-Pitch Land Grid Array (TFLGA) package, designated PTLG0145KA-A, measuring 7 mm × 7 mm with 0.5-mm pitch. This compact, high-density package supports fine-pitch automated assembly and provides 117 general-purpose I/O pins, making it ideal for space-constrained industrial control modules.

How many communication interfaces does the R5F5630BDDLK#U0 integrate?

The R5F5630BDDLK#U0 integrates up to 22 communication interfaces: USB 2.0 full-speed (12 Mbps), CAN (3 channels, 32 mailboxes each), SCI (13 channels with UART/SPI/I²C modes), RIIC (4 channels, up to 1 Mbps), RSPI (3 channels), and IEBus (1 channel). This breadth enables seamless connectivity to sensors, actuators, displays, and industrial networks without external bridge ICs.

What are the memory resources available on the R5F5630BDDLK#U0?

The R5F5630BDDLK#U0 includes 1 Mbyte of on-chip flash memory (100-MHz zero-wait access), 96 Kbytes of SRAM (100-MHz zero-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. The data flash supports background operation, allowing concurrent program execution and non-volatile parameter storage essential for industrial firmware updates and calibration retention.