Renesas R5F5630ECDBG#U0

Overview

R5F5630ECDBG#U0 from Renesas is a 100-MHz 32-bit RX630 Group MCU with on-chip FPU, 2-Mbyte flash, 128-Kbyte SRAM, and 32-Kbyte data flash. It integrates USB 2.0 full-speed, CAN (3 channels), 12-bit/10-bit A/D converters (21+8 ch), dual 10-bit D/A, RTC, and 148 GPIO pins. Used in industrial motor control, factory automation I/O modules, and embedded gateway devices requiring deterministic real-time response.

For engineers reviewing the R5F5630ECDBG#U0 datasheet, R5F5630ECDBG#U0 pinout, R5F5630ECDBG#U0 application, or R5F5630ECDBG#U0 equivalent, key selection criteria include its LFBGA-176 package with 0.8-mm pitch, -40°C to +85°C operating range, 100-MHz deterministic execution, IEEE-754 FPU support, and integrated CAN/USB for multi-protocol edge node design.

Technical Context

The R5F5630ECDBG#U0 implements the RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports memory protection unit (MPU), fast interrupt handling, and dual multiply-and-accumulate units for DSP-intensive tasks.

Its clock system includes PLL-based 100-MHz ICLK generation, independent PCLK/FCLK/BCLK domains up to 50 MHz, and dedicated IWDT oscillator at 125 kHz. Power management features four low-power modes, module stop control, and battery-backed RTC operation down to 2.3 V.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 mm × 13 mm, 0.8-mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630EDDBG#U0, the R5F5630ECDBG#U0 offers identical functionality at lower cost and qualification risk for commercial-temperature applications; versus R5F5660ADFP#U0, it delivers proven reliability and lower system-level complexity where 100-MHz performance suffices.

Availability

R5F5630ECDBG#U0 is available at Aetrix Electronics and suitable for industrial motor drives, factory automation I/O modules, and embedded edge gateways requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for R5F5630ECDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX630 Group targets high-integrity industrial control applications, combining real-time determinism, functional safety features (IEC 60730), and rich analog/peripheral integration for standalone embedded controllers.

FAQ

What is the maximum operating frequency and core architecture of the R5F5630ECDBG#U0?

The R5F5630ECDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It achieves 165 DMIPS and includes hardware support for IEEE-754 single-precision floating-point operations, making it suitable for computationally intensive real-time control tasks without software emulation overhead. The R5F5630ECDBG#U0's deterministic timing ensures consistent interrupt latency critical for motor control loops.

Does the R5F5630ECDBG#U0 support CAN communication, and how many channels are available?

Yes, the R5F5630ECDBG#U0 integrates three fully compliant ISO 11898-1 CAN channels, each supporting both standard and extended frames with 32 dedicated mailboxes per channel. This enables robust multi-node networking in industrial automation and automotive subsystems. The R5F5630ECDBG#U0's CAN modules operate independently with configurable bit rates and error handling, eliminating need for external CAN controllers in most gateway or node applications.

What package type and pin count does the R5F5630ECDBG#U0 use?

The R5F5630ECDBG#U0 uses the PLBG0176GA-A package: a 176-ball Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8-mm ball pitch. This LFBGA package provides high I/O density, excellent thermal performance, and compatibility with standard SMT assembly processes. The R5F5630ECDBG#U0's pinout supports full external bus expansion, USB, CAN, and multiple serial interfaces simultaneously without signal congestion.

How much on-chip memory does the R5F5630ECDBG#U0 include, and what are its access characteristics?

The R5F5630ECDBG#U0 includes 2 Mbytes of on-chip flash memory, 128 Kbytes of SRAM, and 32 Kbytes of reprogrammable data flash. Flash and SRAM operate at zero wait states up to 100 MHz, enabling deterministic code execution and data access. Data flash supports background programming/erasing (BGO) for seamless firmware updates. The R5F5630ECDBG#U0's memory map is linear (4-Gbyte address space), simplifying software development and memory management.

What safety and reliability features does the R5F5630ECDBG#U0 provide for industrial applications?

The R5F5630ECDBG#U0 includes built-in features for IEC 60730 Class B compliance: oscillation-stop detection, hardware CRC calculator (three polynomials), self-diagnostic A/D converter, independent watchdog timer (IWDT) with dedicated 125-kHz oscillator, and frequency measurement capability. Its memory protection unit (MPU) enforces region-based access control. These features reduce certification effort for industrial control systems. The R5F5630ECDBG#U0 is qualified for -40°C to +85°C operation with 500 µA/MHz active power efficiency.