Renesas R5F5630ECDLK#U0

Overview

R5F5630ECDLK#U0 from Renesas is a 100-MHz 32-bit RX CPU-based microcontroller with single-precision IEEE-754 FPU, 2-Mbyte on-chip flash, 128-Kbyte SRAM, and integrated USB 2.0 full-speed, CAN (3 channels), 12-bit A/D (21 ch), 10-bit D/A (2 ch), RTC, and temperature sensor. It targets industrial motor control and embedded gateway applications requiring deterministic real-time performance and functional safety support.

For engineers reviewing the R5F5630ECDLK#U0 datasheet, R5F5630ECDLK#U0 pinout, R5F5630ECDLK#U0 application, or R5F5630ECDLK#U0 equivalent, key selection criteria include its TFLGA-145 package, -40 to +85°C operating range, 100-MHz timing-critical peripheral clocking (ICLK/PCLK up to 100/50 MHz), and IEC60730-compliant self-test features including CRC, IWDT, and A/D self-diagnosis.

Technical Context

The R5F5630ECDLK#U0 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for secure partitioning. Its dual-clock domain supports independent system (ICLK), peripheral (PCLK), FlashIF (FCLK), and external bus (BCLK) clocks-each configurable up to 100 MHz, 50 MHz, 50 MHz, and 50 MHz respectively.

It integrates three communication subsystems: USB 2.0 device controller with 2-Kbyte buffer, ISO11898-1-compliant CAN with 32 mailboxes per channel, and 13 SCI channels supporting asynchronous, SPI, I²C, LIN, and smart-card modes. The 12-bit S12ADa ADC achieves 1.0 µs conversion at 50-MHz PCLK with sample-and-hold and temperature-sensor integration.

Key Specifications

Pinout & Package

Package: PTLG0145KA-A - 145-pin Thin Fine-Pitch Land Grid Array, 7 mm × 7 mm body, 0.5-mm pitch, 0.75-mm height, solder-ball termination.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5630ECDLK#U0, R5F5630EDDLK#U0 offers identical functionality at same temperature grade but lacks G-version enhancements, while R5F5630BCDLK#U0 trades memory size and peripheral count for lower unit cost-enabling tiered product variants without PCB redesign.

Availability

R5F5630ECDLK#U0 is available at Aetrix Electronics and suitable for industrial motor control, embedded gateway, smart energy metering, and factory automation I/O modules requiring stable component supply and long-term production continuity.

Supply support for R5F5630ECDLK#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX630 Group is designed for high-performance, safety-aware embedded applications demanding real-time determinism, rich connectivity, and functional safety certification-particularly in motor control, building automation, and industrial gateways.

FAQ

What is the maximum operating frequency and core architecture of the R5F5630ECDLK#U0?

The R5F5630ECDLK#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with 5-stage pipeline, CISC Harvard architecture, and variable-length instruction set. It delivers 165 DMIPS and includes a single-precision IEEE-754 floating-point unit (FPU) for deterministic math-intensive tasks. This performance is sustained across its full voltage range (2.7–3.6 V) and temperature range (-40 to +85°C).

Does the R5F5630ECDLK#U0 support functional safety standards like IEC60730?

Yes, the R5F5630ECDLK#U0 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, clock frequency measurement (MCK), CRC calculator with three polynomials, independent watchdog timer (IWDT) with dedicated oscillator, and self-diagnostic function for the 10-bit A/D converter. These are documented in the R01DS0060EJ0160 datasheet and supported by Renesas' safety manual.

What package type and pin count does the R5F5630ECDLK#U0 use?

The R5F5630ECDLK#U0 uses the PTLG0145KA-A package: a 145-pin Thin Fine-Pitch Land Grid Array with 7 mm × 7 mm body size, 0.5-mm pitch, and 0.75-mm height. This TFLGA package supports high-density PCB layouts and provides 148 general-purpose I/O pins (including 54 with 5-V tolerance), as confirmed in Table 1.2 and Figure 1.1 of the datasheet.

How much on-chip memory does the R5F5630ECDLK#U0 integrate, and what are its access characteristics?

The R5F5630ECDLK#U0 integrates 2-Mbyte on-chip flash memory (no wait states at 100 MHz), 128-Kbyte SRAM (no wait states), and 32-Kbyte data flash rated for 100,000 write/erase cycles. Flash supports on-board and off-board programming; data flash allows background operation (BGO) for concurrent read/write. Memory protection unit (MPU) enforces secure access boundaries between code, data, and peripheral regions.

Which communication interfaces are available on the R5F5630ECDLK#U0, and how many channels does each support?

The R5F5630ECDLK#U0 supports USB 2.0 full-speed (1 port), CAN (3 channels, 32 mailboxes each), SCI (13 channels total: 12 in SCIc + 1 in SCId), I²C (4 channels, one FM+), RSPI (3 channels), IEBus (1 channel), and serial audio (not implemented in this variant). All interfaces are fully integrated with DMA/DTC support and configurable clock sources, enabling concurrent multi-protocol operation without external controllers.