Renesas R5F5630EDDBG#U0

Overview

R5F5630EDDBG#U0 from Renesas is a 100-MHz 32-bit RX630 Group MCU with on-chip FPU, 2-Mbyte flash, 128-Kbyte SRAM, USB 2.0 full-speed interface, CAN v2.0B (3 channels), and dual 10-bit D/A converters. It operates from a single 2.7–3.6-V supply at -40 to +85°C and targets industrial motor control, PLC I/O modules, and embedded HMI systems requiring deterministic real-time performance and functional safety support.

For engineers reviewing the R5F5630EDDBG#U0 datasheet, R5F5630EDDBG#U0 pinout, R5F5630EDDBG#U0 application, or R5F5630EDDBG#U0 equivalent, key selection criteria include its 176-pin LFBGA (PLBG0176GA-A) package, 100-MHz CPU with 165 DMIPS, integrated 12-bit A/D (21 ch), 10-bit A/D (8 ch), RTC with battery backup, and IEC60730-compliant self-test features including CRC, IWDT, and A/D diagnostic functions.

Technical Context

The R5F5630EDDBG#U0 implements the RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code density. It integrates dual clock domains: system clock (ICLK) up to 100 MHz for CPU execution and peripheral clock (PCLK) up to 50 MHz for timers, ADCs, and communication peripherals.

Its memory subsystem includes zero-wait-state 2-Mbyte flash (100-MHz operation), 128-Kbyte SRAM, and 32-Kbyte data flash rated for 100,000 erase/write cycles. Peripheral integration includes three CAN controllers (ISO11898-1 compliant, 32 mailboxes each), 13 SCI channels supporting UART/I²C/SPI/Smart Card modes, and four RSPI interfaces with 128-bit TX/RX buffers.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 mm × 13 mm, 0.8-mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5630EDDFC and R5F5630BCDBG, the R5F5630EDDBG#U0 provides maximum on-chip memory (2-Mbyte flash/128-Kbyte RAM) in the thermally optimized LFBGA package-making it optimal for feature-rich industrial edge nodes where code size, data buffering, and thermal management are critical.

Availability

R5F5630EDDBG#U0 is available at Aetrix Electronics and suitable for industrial motor control, PLC I/O modules, and embedded HMI applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.

Supply support for R5F5630EDDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The RX630 Group is designed for high-performance, functional-safety-aware industrial automation applications-emphasizing real-time determinism, integrated safety features (IEC60730), and rich connectivity for fieldbus and human-machine interfaces.

FAQ

What is the maximum operating frequency and CPU performance of the R5F5630EDDBG#U0?

The R5F5630EDDBG#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance. Its RX CPU core includes a single-precision floating-point unit compliant with IEEE-754, enabling efficient execution of math-intensive control algorithms without software emulation. This performance level is validated across the full -40°C to +85°C operating range.

Does the R5F5630EDDBG#U0 support functional safety standards like IEC60730?

Yes, the R5F5630EDDBG#U0 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, built-in CRC calculator with three polynomial options, independent watchdog timer (IWDT) with dedicated clock source, and self-diagnostic capability for the 10-bit A/D converter. These features reduce external component count and simplify safety certification for industrial equipment.

What package type and pin count does the R5F5630EDDBG#U0 use?

The R5F5630EDDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8-mm ball pitch. This RoHS-compliant, lead-free package provides superior thermal performance and board-level reliability compared to equivalent LQFP variants, making it suitable for high-density industrial PCB layouts.

How much on-chip memory does the R5F5630EDDBG#U0 integrate?

The R5F5630EDDBG#U0 integrates 2 Mbytes of on-chip flash memory (zero-wait-state at 100 MHz), 128 Kbytes of SRAM (zero-wait-state), and 32 Kbytes of data flash rated for 100,000 erase/write cycles. The flash supports both on-board and off-board programming, and the data flash allows background operation (BGO) for concurrent read/write operations.

Which communication interfaces are supported by the R5F5630EDDBG#U0?

The R5F5630EDDBG#U0 supports up to 22 communication interfaces: 3 CAN channels (ISO11898-1), 13 SCI channels (UART/I²C/SPI/Smart Card), 4 I²C bus interfaces (up to 1 Mbps), 3 RSPI interfaces, 1 USB 2.0 full-speed port, and 1 IEBus channel. All interfaces operate concurrently and support flexible clocking and trigger-based synchronization with timers and A/D converters.