Renesas R5F5630EDDLC#U0
- Part No.:
- R5F5630EDDLC#U0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 177-TFLGA
- Datasheet:
-
R5F5630EDDLC#U0.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 177TFLGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,356
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Product details
Overview
R5F5630EDDLC#U0 from Renesas is a 100-MHz 32-bit RX CPU core microcontroller with single-precision IEEE-754 FPU, 2-Mbyte on-chip flash memory, 128-Kbyte SRAM, and integrated USB 2.0 full-speed interface, CAN (3 channels), 21-channel 12-bit A/D converter, and RTC - deployed in industrial motor control and factory automation systems requiring deterministic real-time response and functional safety support.
For engineers reviewing the R5F5630EDDLC#U0 datasheet, R5F5630EDDLC#U0 pinout, R5F5630EDDLC#U0 application, or R5F5630EDDLC#U0 equivalent, key selection criteria include its TFLGA-177 package with 148 GPIOs (54 5-V tolerant), 100-MHz operation at 2.7–3.6 V, IEC60730-compliant self-test features (CRC, IWDT, A/D self-diagnosis), and support for deep software standby with RTC battery backup.
Technical Context
The R5F5630EDDLC#U0 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for secure embedded execution. It integrates dual timer subsystems: MTU2a (6-channel 16-bit) for complementary PWM and phase counting, and TPUa (12-channel 16-bit) for input capture, output compare, and encoder interfacing - both capable of generating A/D conversion triggers.
Its clock system combines external crystal (4–16 MHz), internal HOCO (50 MHz), LOCO (125 kHz), and PLL to generate independent ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (up to 50 MHz), and BCLK (up to 50 MHz) domains. The device supports four low-power modes including deep software standby with RTC and SRAM retention powered from VBATT (2.3–3.6 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RX 32-bit CISC Harvard, 100 MHz max, 165 DMIPS, IEEE-754 single-precision FPU |
| Memory | 2-Mbyte flash (no wait states @100 MHz), 128-Kbyte SRAM (no wait states), 32-Kbyte data flash (100k write cycles) |
| Analog Peripherals | 21-channel 12-bit A/D (1 µs conversion @50 MHz PCLK), 8-channel 10-bit A/D, 2-channel 10-bit D/A, on-die temperature sensor (±1°C) |
| Communication | USB 2.0 full-speed (12 Mbps), CAN 2.0B (3 channels, 32 mailboxes each), 13 SCI, 4 RIIC (1 Mbps), 3 RSPI, 1 IEBus |
| Timers & Control | MTU2a (6×16-bit), TPUa (12×16-bit), 4×8-bit TMR, 4×16-bit CMT, RTC with time-capture, IWDT with dedicated 125-kHz oscillator |
| Power & Environment | 2.7–3.6 V supply, -40 to +85°C operating range (D version), 500 µA/MHz active current, deep software standby with VBATT backup |
| Package & I/O | PTLG0177KA-A 177-pin TFLGA (0.5-mm pitch, 8 × 8 mm), 148 general-purpose I/O pins (54 5-V tolerant, open-drain, pull-up) |
Pinout & Package
Package: PTLG0177KA-A - 177-pin Thin Fine-Pitch Land Grid Array (TFLGA), 8 × 8 mm body, 0.5-mm pitch, 0.8-mm height, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per quadrant; decoupling required with 0.1-µF capacitors placed adjacent to each VCC pin |
| XTAL / EXTAL | Main clock oscillator interface | Supports 4–16 MHz crystal or external clock source; enables PLL-based 100-MHz system clock generation |
| XCOUT / XCIN | Sub-clock oscillator interface | Connects 32.768 kHz crystal for RTC operation; supports battery-backed timekeeping when VBATT is active |
| RES# | Active-low reset input | Asynchronous hardware reset; initiates power-on reset sequence and clears CPU state and peripheral registers |
| VBATT | Backup power supply | Supplies RTC and SRAM retention during main power loss; operates down to 2.3 V for extended battery life |
| MD | Mode select input | Configures single-chip or extended mode at power-up; must remain static during operation to avoid undefined behavior |
| EMLE / BSCANP | Emulator & boundary scan enable | High-level assertion enables JTAG/FINE debugging or IEEE 1149.1 boundary scan; tied low in production |
| TRDATA0–3 / TRCLK / TRSYNC | Trace debug interface | Outputs real-time instruction trace data for performance analysis and code coverage without halting CPU execution |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Safety Support | Oscillation-stop detection, CRC calculator (3 polynomials), IWDT, A/D self-diagnostic, and frequency measurement for clock monitoring |
| Real-Time Determinism | Fast interrupt response (<1 µs), MPU-enforced memory isolation, and deterministic timer trigger paths for A/D and PWM synchronization |
| Low-Power Flexibility | Four distinct low-power modes (Sleep, All-module Stop, Software Standby, Deep Software Standby) with configurable wake sources and retention options |
| Industrial Connectivity | Triple CAN channels with mailbox filtering, USB full-speed device controller with 2-Kbyte buffer, and LIN-capable SCI for automotive subsystem integration |
| Robust I/O Architecture | 148 GPIOs with programmable drive strength, 5-V tolerance on 54 pins, digital filtering on timer input capture pins, and register write protection |
Applications
| Industrial Motor Drive | Factory Automation PLC |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors using space-vector PWM and position feedback from encoders or Hall sensors. IC Role / Device Role / Timing Role: Main controller executing FOC algorithms via RX CPU+FPU, generating synchronized PWM outputs via MTU2a/TPUa, and sampling current/voltage via 12-bit A/D with sample-and-hold. Use Value: 100-MHz deterministic timing ensures <1-µs current loop update; 54 5-V tolerant I/Os interface directly with industrial level sensors and logic. |
Use Scenario: Modular I/O controller handling analog inputs (4–20 mA), digital I/O expansion, and fieldbus communication in distributed control cabinets. IC Role / Device Role / Timing Role: Central processing unit managing cyclic I/O scanning, ladder logic execution, and protocol stacks (CANopen, Modbus RTU over SCI/RSPI). Use Value: Triple CAN + 13 SCI channels enable concurrent multi-protocol fieldbus support; 2-Mbyte flash stores firmware and configuration data with robust data flash logging. |
| Energy Metering Gateway | Building HVAC Controller |
Use Scenario: Smart electricity meter gateway aggregating consumption data from sub-meters and transmitting via USB or CAN to utility concentrators. IC Role / Device Role / Timing Role: Secure data aggregator with CRC-protected communication, RTC timestamping, and tamper detection via voltage monitoring and watchdog supervision. Use Value: IEC60730-certifiable features (IWDT, oscillation detection, A/D self-test) satisfy Class C safety requirements; USB full-speed enables field firmware updates. |
Use Scenario: Embedded controller for rooftop HVAC units managing compressor staging, damper actuation, and environmental sensing (temperature/humidity). IC Role / Device Role / Timing Role: Real-time environmental regulator using on-die temperature sensor, 10-bit D/A for analog valve control, and 12-bit A/D for sensor fusion. Use Value: Integrated temperature sensor ±1°C accuracy eliminates external calibration; deep software standby reduces standby power to <1 µA while maintaining RTC and alarm wake capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5630EDDFC | LQFP-176 package (24 × 24 mm, 0.5-mm pitch); identical memory, peripherals, and electrical specs | Requires PCB redesign due to different footprint and thermal pad; better suited for manual assembly or legacy LQFP tooling | Select when board layout prioritizes ease of rework or compatibility with existing LQFP socket infrastructure |
| R5F5630EDDBG | LFBGA-176 package (13 × 13 mm, 0.8-mm pitch); same core, memory, and peripheral configuration | Higher I/O density and improved thermal dissipation; requires X-ray inspection and fine-pitch reflow process | Choose for space-constrained designs needing superior thermal performance and higher routing density |
Compared with R5F5630EDDLC#U0, R5F5630EDDFC offers identical functionality in a larger LQFP package for simplified prototyping, while R5F5630EDDBG delivers equivalent performance in a compact LFBGA for high-density industrial modules - all three share identical firmware compatibility and safety feature sets.
Availability
R5F5630EDDLC#U0 is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLCs, and energy metering gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical deployments.
Supply support for R5F5630EDDLC#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX630 Group, including R5F5630EDDLC#U0, was designed for high-performance industrial automation applications demanding real-time determinism, functional safety compliance (IEC60730), and rich connectivity - balancing computational throughput with low-power flexibility.
FAQ
What is the maximum operating frequency and core architecture of the R5F5630EDDLC#U0?
The R5F5630EDDLC#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 165 DMIPS and includes a single-precision IEEE-754 floating-point unit (FPU) for efficient mathematical computation in real-time control loops. This performance level is sustained across its full operating voltage range of 2.7–3.6 V.
Does the R5F5630EDDLC#U0 support functional safety standards like IEC60730?
Yes, the R5F5630EDDLC#U0 includes multiple hardware features certified for IEC60730 Class C compliance: oscillation-stop detection, independent watchdog timer (IWDT) with dedicated 125-kHz oscillator, CRC calculator supporting three polynomials, self-diagnostic function for the 10-bit A/D converter, and frequency measurement capability for clock monitoring - all implemented in silicon without software overhead.
What package type and pin count does the R5F5630EDDLC#U0 use?
The R5F5630EDDLC#U0 uses the PTLG0177KA-A package: a 177-pin Thin Fine-Pitch Land Grid Array (TFLGA) with 0.5-mm pitch, 8 × 8 mm body size, and 0.8-mm height. It provides 148 general-purpose I/O pins, of which 54 are 5-V tolerant, along with dedicated power, ground, clock, reset, and debug interface pins - optimized for high-density industrial PCB layouts.
How much on-chip memory does the R5F5630EDDLC#U0 integrate?
The R5F5630EDDLC#U0 integrates 2 Mbytes of on-chip flash memory (executed at 100 MHz with zero wait states), 128 Kbytes of SRAM (also zero-wait-state operation), and 32 Kbytes of data flash memory rated for 100,000 program/erase cycles. The data flash supports background operation (BGO), enabling firmware updates or logging without interrupting real-time application execution.
Which communication interfaces are available on the R5F5630EDDLC#U0?
The R5F5630EDDLC#U0 provides up to 22 communication interfaces: USB 2.0 full-speed (12 Mbps), CAN 2.0B (3 channels, 32 mailboxes each), 13 serial communications interfaces (SCI) supporting asynchronous, SPI, I²C, and LIN modes, 4 I²C bus interfaces (1 Mbps), 3 RSPI channels, and 1 IEBus controller - enabling simultaneous multi-protocol connectivity in complex industrial networks.
R5F5630EDDLC#U0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 177-TFLGA
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 148
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5630EDDLC#U0 FAQ
1.How can I place an order for R5F5630EDDLC#U0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5630EDDLC#U0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5630EDDLC#U0 reliable?
The price and inventory of R5F5630EDDLC#U0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5630EDDLC#U0 is usually 5 days.
3.What payment methods are accepted for R5F5630EDDLC#U0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5630EDDLC#U0 transactions.
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R5F5630EDDLC#U0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5630EDDLC#U0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5630EDDLC#U0?
For technical support, including R5F5630EDDLC#U0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5630EDDLC#U0 requirements.
6.How does Aetrix verify that R5F5630EDDLC#U0 is sourced from the original manufacturer or authorized distributors?
All R5F5630EDDLC#U0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5630EDDLC#U0 meets industry standards.
7.What is the process for return or replacement of R5F5630EDDLC#U0?
All R5F5630EDDLC#U0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5630EDDLC#U0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5630EDDLC#U0 part is unused and in its original packaging.
Return procedure for R5F5630EDDLC#U0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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