Renesas R5F56317DGFB#V0
- Part No.:
- R5F56317DGFB#V0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56317DGFB#V0.pdf
- Description:
- 32BIT MCU RX631
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5F56317DGFB#V0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller in the RX63N Group, featuring on-chip Ethernet MAC (10/100 Mbps), full-speed USB 2.0 host/function/OTG, 3 CAN channels, 12-bit and 10-bit A/D converters (21 + 8 channels), 2-channel 10-bit D/A, hardware AES encryption (DEU), and 128 KB SRAM. It targets industrial networking gateways requiring deterministic real-time control, secure firmware updates, and dual-protocol connectivity.
For engineers reviewing the R5F56317DGFB#V0 datasheet, R5F56317DGFB#V0 pinout, R5F56317DGFB#V0 application, or R5F56317DGFB#V0 equivalent, this MCU delivers verified IEEE 802.3-compliant Ethernet with RMII/MII support, integrated memory protection unit (MPU), IEC60730 safety features including CRC and self-diagnostic A/D, and production-ready low-power modes down to 500 µA/MHz.
Technical Context
The R5F56317DGFB#V0 implements the RXv1 core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated DMA controllers - DMAC (4 ch), EXDMAC (2 ch), and EDMAC (1 ch for Ethernet) - to offload data movement from CPU cycles while maintaining deterministic latency for time-critical peripherals like MTU2 and TPU timers.
Its clock system supports independent domain scaling: ICLK up to 100 MHz for CPU execution, PCLK up to 50 MHz for peripherals, FCLK/BCLK at 50 MHz for flash and external bus, and IWDT-dedicated 125 kHz LOCO oscillator. The device includes dual A/D subsystems - S12ADa (12-bit, 1.0 µs conversion @50 MHz PCLK) and ADb (10-bit, same timing) - each supporting software, timer-triggered, or external-event-started conversions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC Harvard, 100 MHz max, 165 DMIPS, IEEE-754 single-precision FPU |
| Memory | 768 KB flash (no wait states @100 MHz), 128 KB SRAM, 32 KB data flash (100k write cycles) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), USB 2.0 full-speed host/function/OTG, 3× CAN (ISO11898-1), 4× I²C (1 Mbps), 13× SCI, 3× RSPI |
| Analog Peripherals | 21-channel 12-bit A/D (S12ADa), 8-channel 10-bit A/D (ADb), 2-channel 10-bit D/A, on-die temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256 (ECB/CBC), CRC calculator, MPU, IEC60730 compliance functions (oscillation detection, A/D self-diagnostic) |
| Power & Temp | 2.7–3.6 V supply, -40 to +85°C (D version), 500 µA/MHz active current, 4 low-power modes including deep software standby |
| Package | LQFP-144 (PLQP0144KA-A), 20 × 20 mm, 0.5 mm pitch, 111 general-purpose I/O pins (18× 5-V tolerant) |
Pinout & Package
Package: PLQP0144KA-A - 144-pin LQFP, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad. Designed for industrial PCB assembly with standard reflow profiles and mechanical robustness under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual 2.7–3.6 V domains (core/analog/USB); decoupling required per Renesas layout guidelines |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 4–16 MHz crystals; enables PLL lock for 100 MHz ICLK generation |
| MD0 / MD1 | Mode selection inputs | Configure boot source (on-chip ROM vs. external memory) and debug interface (JTAG/FINE) |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register access and configuration |
| RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLK | Reduced Media Independent Interface signals | 6-pin RMII interface for 10/100 Mbps Ethernet PHY connection; eliminates need for full MII 16-pin bus |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 physical layer | Full-speed (12 Mbps) transceiver with internal termination; VBUS sensing enables host/device role negotiation |
| CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX / CAN2_TX / CAN2_RX | CAN protocol physical layer | Three independent ISO11898-1 compliant CAN controllers with 32 mailboxes each; supports standard/extended frames |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC with RMII/MII | Enables compact, low-pin-count 10/100 Mbps connectivity without external PHY glue logic |
| Dual A/D subsystems | S12ADa (21 ch, 12-bit) and ADb (8 ch, 10-bit) support simultaneous sampling and trigger-synchronized acquisition for motor control feedback |
| Hardware AES engine (DEU) | Offloads cryptographic operations from CPU; supports ECB/CBC modes with 128/192/256-bit keys for secure OTA firmware updates |
| IEC60730 safety suite | Includes oscillation-stop detection, CRC calculation, IWDT, and A/D self-test - certified for Class B functional safety compliance |
| Flexible clock domain control | Independent ICLK/PCLK/FCLK/BCLK dividers allow precise power/performance tuning across CPU, peripherals, flash, and external bus |
Applications
| Industrial Ethernet Gateway | Secure PLC Communication Module |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic between field devices and cloud SCADA systems. IC Role / Device Role / Timing Role: Primary network controller executing real-time protocol stacks with hardware-accelerated Ethernet frame handling and deterministic interrupt latency. Use Value: Integrated RMII reduces BOM cost and board space vs. external PHY solutions; 128 KB SRAM buffers concurrent protocol sessions without external memory. |
Use Scenario: Field-deployed module enabling encrypted firmware updates and secure remote diagnostics for programmable logic controllers. IC Role / Device Role / Timing Role: Trusted execution environment managing key storage, AES decryption, and signed firmware validation before loading into protected flash sectors. Use Value: On-chip DEU performs AES-256-CBC decryption in <100 µs per 16-byte block; MPU prevents unauthorized access to crypto keys and critical registers. |
| Motor Drive Control Unit | Smart Energy Meter Hub |
|
Use Scenario: Closed-loop servo control with position feedback from encoders and current sensing via shunt resistors. IC Role / Device Role / Timing Role: Real-time executor of FOC algorithms using MTU2 PWM outputs, TPU encoder capture, and synchronized S12ADa sampling. Use Value: 1.0 µs A/D conversion time at 50 MHz PCLK ensures sub-microsecond current loop response; phase-counting mode supports 2x quadrature resolution. |
Use Scenario: Multi-tariff electricity meter aggregating consumption data from CT/PT sensors and transmitting via Ethernet or CAN to utility concentrators. IC Role / Device Role / Timing Role: Data concentrator with RTC calendar, temperature-compensated A/D, and tamper-detection logic using GPIO interrupts and CRC checksums. Use Value: On-die ±1°C temperature sensor feeds calibration algorithm for A/D reference voltage drift compensation; battery-backed RTC maintains time during mains failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NEDDFB | Same RX63N Group, identical 144-pin LQFP package, 2 MB flash (vs. 768 KB), 256 KB SRAM (vs. 128 KB) | Higher memory capacity supports larger protocol stacks (e.g., full TCP/IP + TLS) and extended data logging | Select when application requires >1 MB flash for dual-bank firmware updates or complex HMI assets |
| R5F56317DGFV#V0 | Same die, identical specs, but in 176-pin LQFP (PLQP0176KB-A) with 133 I/O pins and 256 KB SRAM | Additional I/O and SRAM enable expansion to multi-axis motion control or parallel sensor interfaces | Choose for designs needing >111 GPIOs or deeper buffer memory for high-throughput Ethernet streaming |
Compared with R5F56317DGFB#V0, R5F563NEDDFB offers scalable memory for feature-rich firmware, while R5F56317DGFV#V0 provides pin-compatible I/O headroom - both retain identical peripheral sets, Ethernet/USB/CAN functionality, and safety features without architectural trade-offs.
Availability
R5F56317DGFB#V0 is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and embedded networking applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56317DGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX63N Group, including R5F56317DGFB#V0, was engineered for deterministic real-time control in networked industrial equipment - integrating Ethernet, USB, CAN, and safety-certified peripherals on a single chip to reduce system complexity and certification effort.
FAQ
What is the maximum operating frequency and core architecture of the R5F56317DGFB#V0?
The R5F56317DGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for industrial control loops and protocol stack processing in the R5F56317DGFB#V0.
Does the R5F56317DGFB#V0 support Ethernet connectivity, and what interface options are available?
Yes, the R5F56317DGFB#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It provides MII (16-pin) and RMII (6-pin) interface options, with RMII selected by default in the 144-pin LQFP package to minimize pin count and PCB area. The dedicated EDMAC controller handles descriptor-based packet transfers, reducing CPU overhead for the R5F56317DGFB#V0's network stack.
What are the memory resources available on the R5F56317DGFB#V0?
The R5F56317DGFB#V0 includes 768 KB of on-chip flash memory (executed at 100 MHz with zero wait states), 128 KB of SRAM (also zero-wait), and 32 KB of data flash rated for 100,000 write/erase cycles. Flash supports on-board programming via SWD/JTAG or off-board parallel programming. These memory resources are optimized for real-time firmware execution, protocol buffering, and non-volatile parameter storage in the R5F56317DGFB#V0's target applications.
How does the R5F56317DGFB#V0 support functional safety standards like IEC60730?
The R5F56317DGFB#V0 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection for main/sub clocks, built-in CRC calculator with three polynomial options, independent watchdog timer (IWDT) with dedicated 125 kHz oscillator, and self-diagnostic capability for the 10-bit A/D converter. These features are documented in Renesas' safety manual and enable certified safe operation in the R5F56317DGFB#V0 without external monitoring circuitry.
What is the package type and thermal specification for the R5F56317DGFB#V0?
The R5F56317DGFB#V0 is housed in a PLQP0144KA-A package: a 144-pin LQFP with 20 × 20 mm body size, 0.5 mm pin pitch, and exposed thermal pad. It is rated for industrial temperature range (-40°C to +85°C) and operates from a single 2.7–3.6 V supply. Thermal design must follow Renesas' recommended copper pour and via patterns under the thermal pad to maintain junction temperature within limits for sustained 100 MHz operation in the R5F56317DGFB#V0.
R5F56317DGFB#V0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56317DGFB#V0 FAQ
1.How can I place an order for R5F56317DGFB#V0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56317DGFB#V0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56317DGFB#V0 reliable?
The price and inventory of R5F56317DGFB#V0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56317DGFB#V0 is usually 5 days.
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Once your R5F56317DGFB#V0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56317DGFB#V0?
For technical support, including R5F56317DGFB#V0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56317DGFB#V0 requirements.
6.How does Aetrix verify that R5F56317DGFB#V0 is sourced from the original manufacturer or authorized distributors?
All R5F56317DGFB#V0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56317DGFB#V0 meets industry standards.
7.What is the process for return or replacement of R5F56317DGFB#V0?
All R5F56317DGFB#V0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56317DGFB#V0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56317DGFB#V0 part is unused and in its original packaging.
Return procedure for R5F56317DGFB#V0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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