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Renesas R5F56317DGFB#V0

Part No.:
R5F56317DGFB#V0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F56317DGFB#V0.pdf
Description:
32BIT MCU RX631
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,919

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Product details

Overview

R5F56317DGFB#V0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller in the RX63N Group, featuring on-chip Ethernet MAC (10/100 Mbps), full-speed USB 2.0 host/function/OTG, 3 CAN channels, 12-bit and 10-bit A/D converters (21 + 8 channels), 2-channel 10-bit D/A, hardware AES encryption (DEU), and 128 KB SRAM. It targets industrial networking gateways requiring deterministic real-time control, secure firmware updates, and dual-protocol connectivity.

For engineers reviewing the R5F56317DGFB#V0 datasheet, R5F56317DGFB#V0 pinout, R5F56317DGFB#V0 application, or R5F56317DGFB#V0 equivalent, this MCU delivers verified IEEE 802.3-compliant Ethernet with RMII/MII support, integrated memory protection unit (MPU), IEC60730 safety features including CRC and self-diagnostic A/D, and production-ready low-power modes down to 500 µA/MHz.

Technical Context

The R5F56317DGFB#V0 implements the RXv1 core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated DMA controllers - DMAC (4 ch), EXDMAC (2 ch), and EDMAC (1 ch for Ethernet) - to offload data movement from CPU cycles while maintaining deterministic latency for time-critical peripherals like MTU2 and TPU timers.

Its clock system supports independent domain scaling: ICLK up to 100 MHz for CPU execution, PCLK up to 50 MHz for peripherals, FCLK/BCLK at 50 MHz for flash and external bus, and IWDT-dedicated 125 kHz LOCO oscillator. The device includes dual A/D subsystems - S12ADa (12-bit, 1.0 µs conversion @50 MHz PCLK) and ADb (10-bit, same timing) - each supporting software, timer-triggered, or external-event-started conversions.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv1 32-bit CISC Harvard, 100 MHz max, 165 DMIPS, IEEE-754 single-precision FPU
Memory 768 KB flash (no wait states @100 MHz), 128 KB SRAM, 32 KB data flash (100k write cycles)
Connectivity Ethernet MAC (10/100 Mbps, MII/RMII), USB 2.0 full-speed host/function/OTG, 3× CAN (ISO11898-1), 4× I²C (1 Mbps), 13× SCI, 3× RSPI
Analog Peripherals 21-channel 12-bit A/D (S12ADa), 8-channel 10-bit A/D (ADb), 2-channel 10-bit D/A, on-die temperature sensor (±1°C)
Security & Safety AES-128/192/256 (ECB/CBC), CRC calculator, MPU, IEC60730 compliance functions (oscillation detection, A/D self-diagnostic)
Power & Temp 2.7–3.6 V supply, -40 to +85°C (D version), 500 µA/MHz active current, 4 low-power modes including deep software standby
Package LQFP-144 (PLQP0144KA-A), 20 × 20 mm, 0.5 mm pitch, 111 general-purpose I/O pins (18× 5-V tolerant)

Pinout & Package

Package: PLQP0144KA-A - 144-pin LQFP, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad. Designed for industrial PCB assembly with standard reflow profiles and mechanical robustness under thermal cycling.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual 2.7–3.6 V domains (core/analog/USB); decoupling required per Renesas layout guidelines
XTAL / EXTAL Main crystal oscillator input/output Supports 4–16 MHz crystals; enables PLL lock for 100 MHz ICLK generation
MD0 / MD1 Mode selection inputs Configure boot source (on-chip ROM vs. external memory) and debug interface (JTAG/FINE)
ETH_MDC / ETH_MDIO Ethernet management interface IEEE 802.3-compliant MDIO bus for PHY register access and configuration
RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLK Reduced Media Independent Interface signals 6-pin RMII interface for 10/100 Mbps Ethernet PHY connection; eliminates need for full MII 16-pin bus
USB_VBUS / USB_DP / USB_DM USB 2.0 physical layer Full-speed (12 Mbps) transceiver with internal termination; VBUS sensing enables host/device role negotiation
CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX / CAN2_TX / CAN2_RX CAN protocol physical layer Three independent ISO11898-1 compliant CAN controllers with 32 mailboxes each; supports standard/extended frames

Key Features

Feature Design Value
Ethernet MAC with RMII/MII Enables compact, low-pin-count 10/100 Mbps connectivity without external PHY glue logic
Dual A/D subsystems S12ADa (21 ch, 12-bit) and ADb (8 ch, 10-bit) support simultaneous sampling and trigger-synchronized acquisition for motor control feedback
Hardware AES engine (DEU) Offloads cryptographic operations from CPU; supports ECB/CBC modes with 128/192/256-bit keys for secure OTA firmware updates
IEC60730 safety suite Includes oscillation-stop detection, CRC calculation, IWDT, and A/D self-test - certified for Class B functional safety compliance
Flexible clock domain control Independent ICLK/PCLK/FCLK/BCLK dividers allow precise power/performance tuning across CPU, peripherals, flash, and external bus

Applications

Industrial Ethernet Gateway Secure PLC Communication Module

Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic between field devices and cloud SCADA systems.

IC Role / Device Role / Timing Role: Primary network controller executing real-time protocol stacks with hardware-accelerated Ethernet frame handling and deterministic interrupt latency.

Use Value: Integrated RMII reduces BOM cost and board space vs. external PHY solutions; 128 KB SRAM buffers concurrent protocol sessions without external memory.

Use Scenario: Field-deployed module enabling encrypted firmware updates and secure remote diagnostics for programmable logic controllers.

IC Role / Device Role / Timing Role: Trusted execution environment managing key storage, AES decryption, and signed firmware validation before loading into protected flash sectors.

Use Value: On-chip DEU performs AES-256-CBC decryption in <100 µs per 16-byte block; MPU prevents unauthorized access to crypto keys and critical registers.

Motor Drive Control Unit Smart Energy Meter Hub

Use Scenario: Closed-loop servo control with position feedback from encoders and current sensing via shunt resistors.

IC Role / Device Role / Timing Role: Real-time executor of FOC algorithms using MTU2 PWM outputs, TPU encoder capture, and synchronized S12ADa sampling.

Use Value: 1.0 µs A/D conversion time at 50 MHz PCLK ensures sub-microsecond current loop response; phase-counting mode supports 2x quadrature resolution.

Use Scenario: Multi-tariff electricity meter aggregating consumption data from CT/PT sensors and transmitting via Ethernet or CAN to utility concentrators.

IC Role / Device Role / Timing Role: Data concentrator with RTC calendar, temperature-compensated A/D, and tamper-detection logic using GPIO interrupts and CRC checksums.

Use Value: On-die ±1°C temperature sensor feeds calibration algorithm for A/D reference voltage drift compensation; battery-backed RTC maintains time during mains failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F563NEDDFB Same RX63N Group, identical 144-pin LQFP package, 2 MB flash (vs. 768 KB), 256 KB SRAM (vs. 128 KB) Higher memory capacity supports larger protocol stacks (e.g., full TCP/IP + TLS) and extended data logging Select when application requires >1 MB flash for dual-bank firmware updates or complex HMI assets
R5F56317DGFV#V0 Same die, identical specs, but in 176-pin LQFP (PLQP0176KB-A) with 133 I/O pins and 256 KB SRAM Additional I/O and SRAM enable expansion to multi-axis motion control or parallel sensor interfaces Choose for designs needing >111 GPIOs or deeper buffer memory for high-throughput Ethernet streaming

Compared with R5F56317DGFB#V0, R5F563NEDDFB offers scalable memory for feature-rich firmware, while R5F56317DGFV#V0 provides pin-compatible I/O headroom - both retain identical peripheral sets, Ethernet/USB/CAN functionality, and safety features without architectural trade-offs.

Availability

R5F56317DGFB#V0 is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and embedded networking applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56317DGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group, including R5F56317DGFB#V0, was engineered for deterministic real-time control in networked industrial equipment - integrating Ethernet, USB, CAN, and safety-certified peripherals on a single chip to reduce system complexity and certification effort.

FAQ

What is the maximum operating frequency and core architecture of the R5F56317DGFB#V0?

The R5F56317DGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for industrial control loops and protocol stack processing in the R5F56317DGFB#V0.

Does the R5F56317DGFB#V0 support Ethernet connectivity, and what interface options are available?

Yes, the R5F56317DGFB#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It provides MII (16-pin) and RMII (6-pin) interface options, with RMII selected by default in the 144-pin LQFP package to minimize pin count and PCB area. The dedicated EDMAC controller handles descriptor-based packet transfers, reducing CPU overhead for the R5F56317DGFB#V0's network stack.

What are the memory resources available on the R5F56317DGFB#V0?

The R5F56317DGFB#V0 includes 768 KB of on-chip flash memory (executed at 100 MHz with zero wait states), 128 KB of SRAM (also zero-wait), and 32 KB of data flash rated for 100,000 write/erase cycles. Flash supports on-board programming via SWD/JTAG or off-board parallel programming. These memory resources are optimized for real-time firmware execution, protocol buffering, and non-volatile parameter storage in the R5F56317DGFB#V0's target applications.

How does the R5F56317DGFB#V0 support functional safety standards like IEC60730?

The R5F56317DGFB#V0 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection for main/sub clocks, built-in CRC calculator with three polynomial options, independent watchdog timer (IWDT) with dedicated 125 kHz oscillator, and self-diagnostic capability for the 10-bit A/D converter. These features are documented in Renesas' safety manual and enable certified safe operation in the R5F56317DGFB#V0 without external monitoring circuitry.

What is the package type and thermal specification for the R5F56317DGFB#V0?

The R5F56317DGFB#V0 is housed in a PLQP0144KA-A package: a 144-pin LQFP with 20 × 20 mm body size, 0.5 mm pin pitch, and exposed thermal pad. It is rated for industrial temperature range (-40°C to +85°C) and operates from a single 2.7–3.6 V supply. Thermal design must follow Renesas' recommended copper pour and via patterns under the thermal pad to maintain junction temperature within limits for sustained 100 MHz operation in the R5F56317DGFB#V0.

R5F56317DGFB#V0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RX
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b, 21x12b; D/A 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56317DGFB#V0 FAQ

1.How can I place an order for R5F56317DGFB#V0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56317DGFB#V0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56317DGFB#V0 reliable?

The price and inventory of R5F56317DGFB#V0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56317DGFB#V0 is usually 5 days.

3.What payment methods are accepted for R5F56317DGFB#V0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56317DGFB#V0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56317DGFB#V0?

R5F56317DGFB#V0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56317DGFB#V0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56317DGFB#V0?

For technical support, including R5F56317DGFB#V0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56317DGFB#V0 requirements.

6.How does Aetrix verify that R5F56317DGFB#V0 is sourced from the original manufacturer or authorized distributors?

All R5F56317DGFB#V0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56317DGFB#V0 meets industry standards.

7.What is the process for return or replacement of R5F56317DGFB#V0?

All R5F56317DGFB#V0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56317DGFB#V0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56317DGFB#V0 part is unused and in its original packaging.

Return procedure for R5F56317DGFB#V0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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