Renesas R5F56317SDBG#U0

Overview

R5F56317SDBG#U0 from Renesas is a 100-MHz 32-bit RX63N Group MCU with integrated Ethernet MAC, single-precision IEEE-754 FPU, 165 DMIPS performance, 768 KB on-chip flash memory, and 128 KB SRAM. It supports USB 2.0 host/function/OTG, CAN (3 channels), 12-bit/10-bit A/D converters (21/8 channels), and operates from 2.7–3.6 V across –40 to +85°C. Used in industrial gateways requiring deterministic real-time control and network connectivity.

For engineers reviewing the R5F56317SDBG#U0 datasheet, R5F56317SDBG#U0 pinout, R5F56317SDBG#U0 application, or R5F56317SDBG#U0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 176-pin LFBGA package compatibility, 768 KB flash/128 KB RAM configuration, IEC60730 safety features, and DEU-based AES-128/192/256 encryption capability.

Technical Context

The R5F56317SDBG#U0 implements the CISC Harvard-architecture RX CPU core with 5-stage pipeline, variable-length instructions, and MPU support. It integrates dedicated hardware accelerators including a 32-bit multiplier (1-cycle execution), divider (2-cycle), and data encryption unit (AES-ECB/CBC).

Its clock system combines external crystal oscillator (4–16 MHz), internal HOCO (50 MHz) and LOCO (125 kHz), with independent frequency division for ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (up to 50 MHz), and BCLK (up to 50 MHz). The device includes Ethernet controller (MII/RMII), USB 2.0 transceiver, and three CAN modules compliant with ISO11898-1.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56317SDBG#U0, R5F56318SDBG#U0 offers higher flash density for complex networking stacks, while R5F56307SDBG#U0 reduces memory cost for simpler edge-node implementations - all maintain identical peripheral sets, clock architecture, and safety features.

Availability

R5F56317SDBG#U0 is available at Aetrix Electronics and suitable for industrial gateways, building automation controllers, and energy metering hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F56317SDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The RX63N Group, including R5F56317SDBG#U0, was designed for high-performance, safety-certifiable embedded applications requiring integrated Ethernet, USB, CAN, and cryptographic acceleration in resource-constrained environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F56317SDBG#U0?

The R5F56317SDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core - a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU support. Its 165 DMIPS performance and single-cycle 32-bit multiplier enable deterministic real-time execution critical for industrial control loops and communication stacks.

Does the R5F56317SDBG#U0 include an Ethernet MAC, and what interfaces does it support?

Yes, the R5F56317SDBG#U0 includes a fully integrated IEEE 802.3-compliant Ethernet MAC supporting both MII and RMII physical layer interfaces. It operates at 10/100 Mbps in full- or half-duplex mode, includes flow control per IEEE 802.3x, and supports Magic Packet™ wake-on-LAN - eliminating the need for external MAC/PHY bridging components in networked embedded systems.

What memory resources are integrated into the R5F56317SDBG#U0?

The R5F56317SDBG#U0 integrates 768 KB of on-chip flash memory (no wait states at 100 MHz), 128 KB of SRAM (no wait states), and 32 KB of reprogrammable data flash (rated for 100,000 erase/write cycles). This configuration supports robust firmware storage, real-time data buffering, and non-volatile parameter retention - essential for field-upgradable industrial devices.

How does the R5F56317SDBG#U0 support functional safety standards like IEC60730?

The R5F56317SDBG#U0 includes hardware-level IEC60730 Class B support features: oscillation-stop detection for clock monitoring, CRC calculator for data integrity, independent watchdog timer (IWDT) with dedicated LOCO clock, and self-diagnostic functions for the 10-bit A/D converter. These capabilities reduce software validation effort and accelerate certification for household and industrial appliances.

What is the package type and thermal specification of the R5F56317SDBG#U0?

The R5F56317SDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8 mm ball pitch. It is rated for industrial temperature operation from –40°C to +85°C (D version), with thermal design enabling conduction-cooled mounting in enclosed control cabinets.