Renesas R5F56318DDBG#G0

Overview

R5F56318DDBG#G0 from Renesas is a 100-MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision IEEE-754 FPU, 165 DMIPS performance, 1.5 Mbytes of on-chip flash memory, and 128 Kbytes of SRAM. It operates from a 2.7–3.6 V supply, supports -40 to +105°C industrial temperature range (G version), and integrates USB 2.0 host/function/OTG, CAN, 12-bit A/D converter (21 channels), and AES encryption (DEU). It targets industrial networking gateways requiring deterministic real-time control and secure wired connectivity.

For engineers reviewing the R5F56318DDBG#G0 datasheet, R5F56318DDBG#G0 pinout, R5F56318DDBG#G0 application, or R5F56318DDBG#G0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), 100 MHz CPU clock with FPU, 1.5 Mbyte flash capacity, G-grade temperature rating, and LFBGA-176 package compatibility with industrial PCB layout constraints.

Technical Context

The R5F56318DDBG#G0 implements the 32-bit RX CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and 165 DMIPS at 100 MHz. It includes a dedicated Ethernet DMA controller (EDMAC) with 2-Kbyte TX/RX FIFOs and supports IEEE 802.3 10/100 Mbps full/half-duplex operation via MII or RMII interface.

Its peripheral set includes three CAN modules (ISO 11898-1 compliant, 32 mailboxes each), four I²C interfaces (one FM+ capable of 1 Mbps), and dual A/D converters: a 12-bit unit (21 channels, 1 µs conversion time at 50 MHz PCLK) and a 10-bit unit (8 channels). The device also features a data encryption unit (DEU) supporting AES-128/192/256 in ECB/CBC modes.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 × 13 mm, 0.8-mm pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56318DDBG#G0, R5F563NEDDBG#G0 offers higher flash density for complex protocol stacks, while R5F56317DDBG#G0 removes Ethernet functionality entirely-making it unsuitable for gateway or edge-node roles requiring native 10/100 Mbps connectivity.

Availability

R5F56318DDBG#G0 is available at Aetrix Electronics and suitable for industrial automation gateways, secure PLC communication modules, HMI controllers, and networked motor drive interfaces requiring stable component supply, long-term lifecycle assurance, and G-grade thermal reliability.

Supply support for R5F56318DDBG#G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX63N Group, including R5F56318DDBG#G0, was designed for high-performance industrial networking applications-integrating Ethernet, USB, CAN, and security features into a single chip to reduce system BOM and simplify certification for IEC 60730 and IEC 62443.

FAQ

What is the maximum operating frequency and CPU performance of the R5F56318DDBG#G0?

The R5F56318DDBG#G0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance using its 32-bit RX CPU core. Its single-precision IEEE-754 floating-point unit enables efficient real-time math operations, and the 5-stage pipeline with variable-length instructions ensures high code density and deterministic interrupt response-critical for industrial control loops executed within strict timing budgets.

Does the R5F56318DDBG#G0 include an Ethernet MAC, and what interface standards does it support?

Yes, the R5F56318DDBG#G0 includes a fully integrated IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It supports Media Independent Interface (MII) and Reduced MII (RMII), includes Magic Packet™ wake-on-LAN detection, and features a dedicated Ethernet DMA controller (EDMAC) with 2-Kbyte transmit and receive FIFOs to minimize CPU intervention during frame processing.

What are the flash and RAM capacities of the R5F56318DDBG#G0, and how are they accessed?

The R5F56318DDBG#G0 contains 1.5 Mbytes of on-chip main flash memory and 128 Kbytes of SRAM, both accessible at zero wait states up to 100 MHz. Flash supports on-board programming via SWD/FINE or off-board parallel programming (for ≥100-pin packages), while SRAM is unified for instructions and data and retains content during deep software standby mode when backed by VBATT.

How does the R5F56318DDBG#G0 support functional safety and security-critical applications?

The R5F56318DDBG#G0 supports IEC 60730 Class B compliance through oscillation-stoppage detection, CRC calculator (with three selectable polynomials), independent watchdog timer (IWDT), self-diagnostic A/D functions, and memory protection unit (MPU) for runtime privilege enforcement. Its Data Encryption Unit (DEU) provides hardware-accelerated AES-128/192/256 encryption/decryption in ECB/CBC modes-essential for secure boot, encrypted data logging, and authenticated firmware updates.

What package type and pin count does the R5F56318DDBG#G0 use, and what are its thermal specifications?

The R5F56318DDBG#G0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 × 13 mm with 0.8-mm pitch. It is rated for industrial operation from -40 to +105°C (G version), includes battery-backed RTC operation down to 2.3 V on VBATT, and supports four low-power modes-including deep software standby with SRAM retention-to meet energy-constrained edge deployment requirements.