Renesas R5F563NADDBG#U0

Overview

R5F563NADDBG#U0 from Renesas is a 100-MHz 32-bit RX63N Group microcontroller featuring an integrated Ethernet MAC (10/100 Mbps), single-precision IEEE-754 FPU, 768 KB on-chip flash memory, 128 KB SRAM, and 32 KB data flash. It supports USB 2.0 host/function/OTG, CAN (3 channels), 13 SCI interfaces, 4 I²C buses, and operates from a 2.7–3.6 V supply in industrial temperature range (−40 to +85°C). Used in networked industrial controllers requiring deterministic real-time response and secure firmware updates.

For engineers reviewing the R5F563NADDBG#U0 datasheet, R5F563NADDBG#U0 pinout, R5F563NADDBG#U0 application, or R5F563NADDBG#U0 equivalent, key selection criteria include Ethernet MAC integration, 100 MHz deterministic execution with MPU support, dual A/D converters (12-bit ×21 ch / 10-bit ×8 ch), hardware AES encryption (DEU), and LFBGA-176 package compatibility with high-pin-count industrial PCB layouts.

Technical Context

The R5F563NADDBG#U0 implements the 32-bit RX CPU core with 5-stage CISC Harvard pipeline, supporting 165 DMIPS at 100 MHz and variable-length instructions for ultra-compact code density. Its memory subsystem includes zero-wait-state 100-MHz flash and SRAM, plus background-programmable 32 KB data flash with 100,000 write cycles.

Real-time capability is reinforced by 20+ timers-including MTU2 (6-channel), TPU (12-channel), and CMT-plus dedicated DMA controllers (DMAC, EXDMAC, DTC) and an Ethernet-dedicated EDMAC. The device integrates IEC60730-compliant safety features: oscillation-stop detection, CRC calculator, self-diagnostic A/D, and register write protection.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm pitch, RoHS-compliant, designed for high-density industrial PCBs with thermal pad for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F563NADDBG#U0, R5F563NECDBG#U0 provides 125% more flash for complex networking stacks, while R5F563NADDFC#U0 trades Ethernet capability for LQFP manufacturability and lower system-level BOM cost-neither is pin-compatible, but both share identical register mapping and toolchain support.

Availability

R5F563NADDBG#U0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLCs, networked energy meters, and medical device controllers requiring stable component supply across long product lifecycles.

Supply support for R5F563NADDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group, including R5F563NADDBG#U0, was engineered for deterministic real-time industrial connectivity-integrating Ethernet, USB, CAN, and safety features into a single-chip solution for edge controllers and smart sensors.

FAQ

What is the maximum operating frequency and core performance of the R5F563NADDBG#U0?

The R5F563NADDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core, delivering 165 DMIPS of computational performance. Its 5-stage pipeline, single-cycle 32×32 multiplier, and IEEE-754-compliant FPU enable deterministic real-time execution for industrial control algorithms. This performance level is confirmed in Renesas document R01DS0098EJ0180, page 1.

Does the R5F563NADDBG#U0 include an Ethernet MAC, and what standards does it support?

Yes, the R5F563NADDBG#U0 includes a fully integrated IEEE 802.3-compliant Ethernet MAC supporting 10/100 Mbps operation in full- and half-duplex modes. It implements MII and RMII physical layer interfaces and supports Magic Packet™ wake-on-LAN and IEEE 802.3x flow control. This feature distinguishes the RX63N Group from the RX631 Group, which lacks Ethernet functionality.

What memory resources are available on the R5F563NADDBG#U0?

The R5F563NADDBG#U0 integrates 768 KB of on-chip flash memory (zero-wait-state at 100 MHz), 128 KB of SRAM, and 32 KB of reprogrammable data flash rated for 100,000 write/erase cycles. These resources are validated in Table 1.1 of R01DS0098EJ0180 and match the "768 Kbytes" ROM capacity entry for part R5F563NADDBG in Table 1.3 (page 9).

Is hardware encryption supported on the R5F563NADDBG#U0, and what algorithms are implemented?

Yes, the R5F563NADDBG#U0 includes a dedicated Data Encryption Unit (DEU) supporting AES encryption and decryption with 128-, 192-, and 256-bit keys in ECB and CBC modes. This hardware accelerator offloads cryptographic operations from the CPU and is documented in Section 1.1 (Table 1.1) and Figure 1.1 of R01DS0098EJ0180.

What is the package type and pin count of the R5F563NADDBG#U0?

The R5F563NADDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8 mm ball pitch. This package is explicitly listed for R5F563NADDBG in Table 1.3 (page 9) of R01DS0098EJ0180 and supports high I/O density and thermal management in industrial environments.