Renesas R5F563NBDDBG#G0

Overview

R5F563NBDDBG#G0 from Renesas is a 100 MHz 32-bit RX CPU-based microcontroller with integrated Ethernet MAC, 1 MB on-chip flash, 128 KB SRAM, 32 KB data flash, single-precision IEEE-754 FPU, and hardware AES encryption. It operates from a 2.7–3.6 V supply and supports -40 to +85°C industrial temperature range. This MCU targets networked industrial controllers requiring deterministic real-time response, secure firmware updates, and dual-role USB connectivity.

For engineers reviewing the R5F563NBDDBG#G0 datasheet, R5F563NBDDBG#G0 pinout, R5F563NBDDBG#G0 application, or R5F563NBDDBG#G0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), 32-channel CAN mailbox count, 12-bit A/D converter scan timing at 1 µs/channel, 100-MHz instruction throughput (165 DMIPS), and PLBG0176GA-A 176-pin LFBGA package compatibility with high-density PCB layouts.

Technical Context

The R5F563NBDDBG#G0 belongs to the RX63N Group, distinguished from RX631 by inclusion of an IEEE 802.3-compliant Ethernet controller with MII/RMII interface, dedicated EDMAC (2 KB TX/RX FIFO), and wake-on-LAN capability. It implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for safety-critical applications.

Its clock system integrates PLL, 125-kHz LOCO, and 50-MHz HOCO oscillators, enabling independent scaling of ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (up to 50 MHz), and BCLK (up to 50 MHz). The MCU supports four low-power modes and battery-backed RTC operation down to 2.0 V on VBATT.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 × 13 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free solder compatible.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NBDDBG#G0, R5F563NECDBG#G0 provides double flash capacity without altering real-time behavior or package footprint, while R5F563NBCDFC#G0 trades Ethernet integration for LQFP manufacturability and lower unit cost in standalone control applications.

Availability

R5F563NBDDBG#G0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLCs, networked energy meters, and USB-enabled HMIs requiring stable component supply across multi-year production cycles.

Supply support for R5F563NBDDBG#G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX63N Group was designed for deterministic real-time industrial networking applications, integrating Ethernet, USB, CAN, and hardware security to replace multi-chip solutions in programmable controllers and gateway devices.

FAQ

What is the maximum operating frequency and DMIPS rating of the R5F563NBDDBG#G0?

The R5F563NBDDBG#G0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance. This metric is measured under standard conditions using the EEMBC CoreMark benchmark and reflects the real-world throughput achievable with its 32-bit RX CPU core, 5-stage pipeline, and zero-wait-state flash execution. The R5F563NBDDBG#G0 maintains this performance across its full industrial temperature range (-40 to +85°C) with proper power supply decoupling and thermal management.

Does the R5F563NBDDBG#G0 support Ethernet connectivity, and what interfaces are available?

Yes, the R5F563NBDDBG#G0 includes a fully integrated IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation. It provides MII (Media Independent Interface) and RMII (Reduced Media Independent Interface) physical layer options, along with dedicated EDMAC hardware, 2 KB transmit and receive FIFOs, and Magic Packet™ wake-on-LAN capability. These features enable direct connection to external PHYs without requiring additional glue logic or external DMA controllers.

What are the memory resources available on the R5F563NBDDBG#G0?

The R5F563NBDDBG#G0 integrates 1 MB of on-chip flash memory (executed at 100 MHz with zero wait states), 128 KB of SRAM (also zero wait states), and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. The flash supports on-board programming via JTAG/FINE and off-board parallel programming for production. All memory blocks are protected by the MPU and support secure boot verification using the integrated AES engine.

Which package type is used for the R5F563NBDDBG#G0, and what are its key mechanical characteristics?

The R5F563NBDDBG#G0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 13 × 13 mm body size and 0.8 mm ball pitch. It features a thermally enhanced construction suitable for industrial convection cooling, RoHS compliance, and lead-free solder compatibility. This BGA package supports high I/O density (133 GPIOs) and signal integrity for high-speed interfaces including Ethernet MII and USB 2.0.

What analog peripherals does the R5F563NBDDBG#G0 include, and what are their key specifications?

The R5F563NBDDBG#G0 includes a 21-channel 12-bit A/D converter (S12ADa) with 1.0 µs conversion time at 50 MHz PCLK, an 8-channel 10-bit A/D converter (ADb), two 10-bit D/A channels (DAa), and an on-die temperature sensor with ±1°C accuracy. Both A/D units support software, timer-triggered, and external-event-triggered conversions, and the 12-bit unit includes sample-and-hold and result addition functions for noise reduction in motor control applications.