Renesas R5F563NBDDBG#U0
- Part No.:
- R5F563NBDDBG#U0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R5F563NBDDBG#U0.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,192
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Product details
Overview
R5F563NBDDBG#U0 from Renesas is a 100 MHz 32-bit RX CPU-based microcontroller with integrated Ethernet MAC, full-speed USB 2.0 host/function/OTG, three CAN channels, 12-bit and 10-bit A/D converters (21 and 8 channels), dual 10-bit D/A outputs, hardware AES encryption (DEU), and 1 Mbyte on-chip flash memory. It operates from a single 2.7–3.6 V supply and supports industrial temperature range (−40 to +85°C) in a 176-pin LFBGA package (PLBG0176GA-A). This MCU targets networked industrial control and embedded gateway applications requiring real-time processing, secure communication, and mixed-signal interfacing.
For engineers reviewing the R5F563NBDDBG#U0 datasheet, R5F563NBDDBG#U0 pinout, R5F563NBDDBG#U0 application, or R5F563NBDDBG#U0 equivalent, key selection considerations include its Ethernet MAC + RMII/MII support, 13-channel SCI with LIN/IEBus capability, 176-pin LFBGA footprint, 128 Kbytes SRAM, and RX63N Group-specific features such as RTC with battery backup, deep software standby mode, and IEC60730 safety functions.
Technical Context
The R5F563NBDDBG#U0 implements the RXv1 CPU core with Harvard architecture, 5-stage pipeline, and IEEE-754 single-precision FPU delivering 165 DMIPS at 100 MHz. It integrates dedicated DMA controllers-including EXDMAC for TFT LCD transfer and EDMAC for Ethernet-alongside DTC for peripheral-triggered transfers without CPU intervention.
Its clock system combines external crystal (4–16 MHz), internal HOCO (50 MHz), LOCO (125 kHz), and PLL for flexible domain partitioning: ICLK up to 100 MHz (CPU), PCLK up to 50 MHz (peripherals), FCLK/BCLK up to 50 MHz (Flash/external bus). The MPU enforces memory protection, while register write protection safeguards critical configuration registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | RXv1 32-bit CISC Harvard CPU with 5-stage pipeline and variable-length instructions |
| Max Operating Frequency | 100 MHz system clock (ICLK), enabling 165 DMIPS performance and sub-10 ns instruction timing |
| On-chip Memory | 1 Mbyte flash (no wait states at 100 MHz), 128 Kbytes SRAM, 32 Kbytes data flash (100k erase/write cycles) |
| Analog Peripherals | 21-channel 12-bit A/D converter (1.0 μs conversion @ 50 MHz PCLK), 8-channel 10-bit A/D, 2-channel 10-bit D/A |
| Communication Interfaces | Ethernet MAC (10/100 Mbps, MII/RMII), USB 2.0 host/function/OTG, 3× CAN (ISO11898-1), 13× SCI, 4× I2C (1 Mbps), 3× SPI, IEBus |
| Security & Safety | AES-128/192/256 encryption/decryption (ECB/CBC), CRC calculator, oscillation-stop detection, IWDT, self-diagnostic A/D |
| Package & Environment | PLBG0176GA-A: 176-pin LFBGA, 13 × 13 mm, 0.8 mm pitch, −40 to +85°C operating range (D version) |
Pinout & Package
Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 × 13 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | 12 dedicated VCC and 12 VSS balls distributed across perimeter for low-noise power delivery and EMI reduction |
| XTAL / EXTAL | Main clock oscillator input/output | Connects to 4–16 MHz crystal for high-accuracy system timing; supports external clock input |
| MD[3:0] | Mode select pins | Configure boot mode (ROM/flash/serial programming) during reset; latched at power-on |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register access and configuration |
| RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLK | Reduced Media Independent Interface signals | 6-pin RMII interface supporting 10/100 Mbps Ethernet with shared 50 MHz reference clock |
| USB_VBUS / USB_ID / USB_DP / USB_DM | USB 2.0 physical layer interface | Full-speed (12 Mbps) OTG-capable interface with VBUS sensing and ID pin for host/device role negotiation |
| CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX / CAN2_TX / CAN2_RX | CAN transceiver I/O | Three independent ISO11898-1 compliant CAN channels with 32 mailboxes each; require external transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC with RMII/MII | Enables compact, low-pin-count 10/100 Mbps Ethernet connectivity without external PHY clock routing complexity |
| Dual-clock domain DMA (EDMAC + EXDMAC + DTC) | Offloads CPU from high-bandwidth transfers: EDMAC handles Ethernet packet buffering, EXDMAC drives TFT displays directly |
| IEC60730-compliant safety suite | Includes oscillation-stop detection, CRC calculator, IWDT, and A/D self-diagnostic-reducing certification effort for Class B appliances |
| Flexible clock generation & domain isolation | Independent ICLK/PCLK/FCLK/BCLK dividers allow optimized power/performance trade-offs per subsystem (e.g., 100 MHz CPU, 50 MHz peripherals) |
| Hardware AES engine (DEU) | Accelerates secure firmware updates and encrypted communication without CPU overhead or software library dependencies |
| Battery-backed RTC with time capture | Maintains calendar/time across power loss using VBATT; captures timestamps on external event pins for deterministic logging |
Applications
| Industrial Ethernet Gateway | Secure PLC Communication Module |
|---|---|
Use Scenario: Aggregating Modbus RTU/TCP fieldbus data from sensors and actuators into a unified Ethernet backbone for SCADA systems. IC Role / Device Role / Timing Role: Central protocol translator and real-time scheduler executing deterministic Ethernet frame handling and CAN/SCI bridging. Use Value: Integrated Ethernet MAC + 3× CAN + 13× SCI eliminates external bridge ICs; 100 MHz RX core ensures <100 μs latency for time-critical polling cycles. |
Use Scenario: Embedded module in programmable logic controllers performing encrypted firmware updates and secure remote diagnostics over TLS-enabled HTTP. IC Role / Device Role / Timing Role: Trusted execution environment managing cryptographic operations, secure boot verification, and tamper-resistant parameter storage. Use Value: On-die AES-256 engine accelerates TLS handshake by >15× vs. software-only; DEU + CRC + IWDT satisfy IEC61508 SIL2 functional safety requirements. |
| Smart Energy Meter Hub | Automated Test Equipment Controller |
Use Scenario: Multi-interface energy meter concentrator collecting pulse counts, RS485 meter readings, and Zigbee/LoRa wireless telemetry for AMI networks. IC Role / Device Role / Timing Role: Mixed-signal hub synchronizing 12-bit A/D sampling of analog sensor inputs with precise RTC-stamped event logging. Use Value: Integrated 21-channel 12-bit A/D (1.0 μs conversion) and battery-backed RTC enable accurate energy integration and outage timestamping without external components. |
Use Scenario: Rack-mounted test controller coordinating high-speed digital pattern generation, analog stimulus, and measurement acquisition across multiple DUTs. IC Role / Device Role / Timing Role: Real-time sequencer generating synchronized triggers for A/D, D/A, and GPIO via MTU2/TPU timer units. Use Value: 20+ extended-function timers (MTU2, TPU, TMR, CMT) provide nanosecond-accurate waveform synthesis and trigger distribution-eliminating external timing ASICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NECDBG#U0 | 2 Mbyte flash, same 176-pin LFBGA package, identical peripheral set and clock architecture | Supports larger firmware images and bootloader + application separation; no change to PCB or driver stack | Select when firmware size exceeds 1 Mbyte or future-proofing for feature expansion is required |
| R5F563NBDDFC#U0 | 1 Mbyte flash, 176-pin LQFP (PLQP0176KB-A), 256 Kbytes SRAM, same peripheral complement | LQFP simplifies prototyping and rework; higher SRAM enables complex protocol stacks (e.g., MQTT+TLS) | Choose for development boards or cost-sensitive production where thermal performance allows LQFP use |
Compared with R5F563NBDDBG#U0, the R5F563NECDBG#U0 offers double flash capacity without altering pinout or software compatibility, while the R5F563NBDDFC#U0 trades BGA assembly complexity for LQFP manufacturability and +128 Kbytes SRAM-making it preferable for rapid iteration or memory-intensive edge analytics.
Availability
R5F563NBDDBG#U0 is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and embedded gateway designs requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for R5F563NBDDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX63N Group is designed for high-performance, safety-aware embedded applications demanding integrated networking (Ethernet/USB/CAN), real-time determinism, and hardware security-targeting industrial gateways, PLCs, and energy infrastructure.
FAQ
What is the maximum operating frequency and core performance of the R5F563NBDDBG#U0?
The R5F563NBDDBG#U0 operates at a maximum system clock frequency of 100 MHz using the RXv1 32-bit CPU core, achieving 165 DMIPS performance. Its single-precision IEEE-754 floating-point unit, 32-bit multiplier (1-cycle execution), and 5-stage pipeline enable deterministic real-time processing for control and signal analysis tasks within the R5F563NBDDBG#U0's architecture.
Does the R5F563NBDDBG#U0 support Ethernet connectivity, and what interfaces are available?
Yes, the R5F563NBDDBG#U0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 and 100 Mbps operation in full- and half-duplex modes. It provides MII and RMII physical layer interfaces, including dedicated pins for RMII_REF_CLK, RMII_TXD0/1, RMII_RXD0/1, RMII_CRS_DV, and RMII_TX_EN-enabling direct connection to standard Ethernet PHYs without external glue logic in the R5F563NBDDBG#U0 design.
What are the memory resources available on the R5F563NBDDBG#U0?
The R5F563NBDDBG#U0 includes 1 Mbyte of on-chip flash memory (executed at 100 MHz with zero wait states), 128 Kbytes of high-speed SRAM (also zero-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. These memory resources are mapped into a 4-Gbyte linear address space and support background programming/erasing operations-critical for firmware updates and parameter storage in the R5F563NBDDBG#U0 application.
Which communication peripherals are integrated into the R5F563NBDDBG#U0?
The R5F563NBDDBG#U0 integrates Ethernet MAC, USB 2.0 host/function/OTG, three CAN 2.0B modules (32 mailboxes each), 13 serial communication interfaces (SCI) supporting asynchronous, LIN, and IEBus protocols, four I2C buses (one FM+ capable of 1 Mbps), three SPI interfaces, and an IEBus controller. This comprehensive set enables multi-protocol bridging and device consolidation in the R5F563NBDDBG#U0's target applications.
Is the R5F563NBDDBG#U0 suitable for safety-critical applications, and what features support compliance?
Yes, the R5F563NBDDBG#U0 includes hardware features aligned with IEC60730 Class B requirements: oscillation-stop detection, CRC calculator with configurable polynomials, independent watchdog timer (IWDT) with dedicated oscillator, self-diagnostic A/D converter, and memory protection unit (MPU). These capabilities reduce software validation burden and support functional safety certification for appliances and industrial controls built around the R5F563NBDDBG#U0.
R5F563NBDDBG#U0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 133
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NBDDBG#U0 FAQ
1.How can I place an order for R5F563NBDDBG#U0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NBDDBG#U0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NBDDBG#U0 reliable?
The price and inventory of R5F563NBDDBG#U0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NBDDBG#U0 is usually 5 days.
3.What payment methods are accepted for R5F563NBDDBG#U0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NBDDBG#U0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F563NBDDBG#U0?
R5F563NBDDBG#U0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NBDDBG#U0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NBDDBG#U0?
For technical support, including R5F563NBDDBG#U0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NBDDBG#U0 requirements.
6.How does Aetrix verify that R5F563NBDDBG#U0 is sourced from the original manufacturer or authorized distributors?
All R5F563NBDDBG#U0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NBDDBG#U0 meets industry standards.
7.What is the process for return or replacement of R5F563NBDDBG#U0?
All R5F563NBDDBG#U0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NBDDBG#U0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NBDDBG#U0 part is unused and in its original packaging.
Return procedure for R5F563NBDDBG#U0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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