Renesas R5F563NBDDLK#U0

Overview

R5F563NBDDLK#U0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision FPU, 1 Mbyte on-chip flash, 128 Kbytes SRAM, and 32 Kbytes data flash. It features 12-bit and 10-bit A/D converters (21 + 8 channels), dual 10-bit D/A outputs, CAN v2.0B (3 channels), USB 2.0 host/function/OTG, and operates from 2.7–3.6 V in industrial temperature range (−40 to +85°C). It targets networked industrial controllers requiring deterministic real-time control and secure connectivity.

For engineers reviewing the R5F563NBDDLK#U0 datasheet, R5F563NBDDLK#U0 pinout, R5F563NBDDLK#U0 application, or R5F563NBDDLK#U0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), 176-pin LFBGA package compatibility, 100-MHz timing margin for deterministic ISR latency, and DEU-based AES-128/192/256 encryption for IEC 60730 Class B compliance in safety-critical firmware updates.

Technical Context

The R5F563NBDDLK#U0 implements the 32-bit RX CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling 165 DMIPS at 100 MHz. It integrates dedicated hardware accelerators including a 32×32→64-bit multiplier (1-cycle), divider (2-cycle), and IEEE-754-compliant FPU for real-time signal processing.

Its peripheral subsystem includes an Ethernet controller (ETHERC) with 2-Kbyte TX/RX FIFOs and descriptor-based EDMAC, three CAN modules (32 mailboxes each), and a parallel data capture unit (PDC) supporting image sensor interfacing via DTC/DMAC-designed for embedded vision edge nodes with low-latency frame ingestion.

Key Specifications

Pinout & Package

Package: PTLG0145KA-A - 145-pin Thin Fine-Pitch Land Grid Array (TFLGA), 7 mm × 7 mm body, 0.5 mm pitch, 0.7 mm height, lead-free, RoHS compliant. Designed for high-density PCB layouts with thermal pad under die for enhanced heat dissipation in fanless industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F563NBDDLK#U0, R5F563NEDDLK#U0 provides double flash capacity for complex protocol stacks, while R5F563NBCDLK#U0 trades I/O count for lower unit cost-neither is pin-compatible, but all three share identical clock, power, and debug interface footprints.

Availability

R5F563NBDDLK#U0 is available at Aetrix Electronics and suitable for industrial automation, building management systems, and medical device applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized Renesas distribution channels.

Supply support for R5F563NBDDLK#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets, with deep expertise in real-time embedded systems.

The RX63N Group, including R5F563NBDDLK#U0, was engineered for deterministic industrial control with integrated Ethernet, functional safety features (IEC 60730), and hardware security-targeting programmable logic controllers, HMIs, and networked medical equipment.

FAQ

What is the maximum operating frequency and core performance of the R5F563NBDDLK#U0?

The R5F563NBDDLK#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS using the 32-bit RX CPU core. Its 5-stage pipeline, variable-length instruction set, and single-cycle 32×32 multiplier enable deterministic real-time execution. The R5F563NBDDLK#U0 achieves this performance while maintaining low power consumption (500 μA/MHz) and full peripheral integration-including Ethernet MAC, USB, and CAN-making it suitable for time-critical industrial control tasks.

Does the R5F563NBDDLK#U0 support Ethernet connectivity, and what interfaces are available?

Yes, the R5F563NBDDLK#U0 includes a fully integrated Ethernet MAC (ETHERC) compliant with IEEE 802.3, supporting 10/100 Mbps in full- and half-duplex modes. It supports both MII and RMII physical layer interfaces, Magic Packet™ wake-on-LAN, and IEEE 802.3x flow control. The dedicated EDMAC handles descriptor-based packet transfers, offloading the CPU and enabling efficient TCP/IP stack implementation in the R5F563NBDDLK#U0's 128 Kbytes of SRAM.

What are the memory resources available on the R5F563NBDDLK#U0?

The R5F563NBDDLK#U0 integrates 1 Mbyte of on-chip flash memory (executed at 100 MHz with zero wait states), 128 Kbytes of SRAM (also zero-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. This memory configuration supports robust firmware partitioning-e.g., separate secure boot loader, application code, and encrypted parameter storage-all within the R5F563NBDDLK#U0 without external memory components.

How does the R5F563NBDDLK#U0 support functional safety standards like IEC 60730?

The R5F563NBDDLK#U0 includes multiple hardware features for IEC 60730 Class B compliance: oscillation-stop detection for clock monitoring, independent watchdog timer (IWDT) with dedicated LOCO clock, CRC calculator with three selectable polynomials, self-diagnostic A/D converter test, and memory protection unit (MPU). These capabilities are documented in Renesas' safety manual for the RX63N Group and are directly implemented in the R5F563NBDDLK#U0 silicon-enabling certified firmware development without external safety monitors.

What package type and pin count does the R5F563NBDDLK#U0 use?

The R5F563NBDDLK#U0 uses the PTLG0145KA-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 7 mm × 7 mm with 0.5 mm pitch. It provides 111 general-purpose I/O pins (including 18 with 5-V tolerance), dedicated Ethernet and USB signals, and a thermal pad for thermal management. This package balances high peripheral density with compact footprint-ideal for space-constrained industrial and medical PCBs where the R5F563NBDDLK#U0 serves as the central controller.