Renesas R5F563NDCDBG#U0

Overview

R5F563NDCDBG#U0 from Renesas is a 100-MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision IEEE-754 FPU, 1.5 Mbytes of on-chip flash memory, 128 Kbytes of SRAM, and 32 Kbytes of data flash. It features 134 general-purpose I/O pins (5-V tolerant), hardware AES encryption (DEU), and real-time clock with battery backup - deployed in industrial gateways requiring deterministic networked control and secure firmware updates.

For engineers reviewing the R5F563NDCDBG#U0 datasheet, R5F563NDCDBG#U0 pinout, R5F563NDCDBG#U0 application, or R5F563NDCDBG#U0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), 100-MHz CPU performance (165 DMIPS), 12-bit/10-bit A/D converters (21+8 channels), dual 10-bit D/A outputs, and LFBGA-176 package compatibility with industrial temperature range (-40 to +85°C).

Technical Context

The R5F563NDCDBG#U0 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated DMA controllers for Ethernet (EDMAC), USB, and peripheral functions, plus an EXDMAC for high-bandwidth transfers to external displays or memory.

Its clock system supports multiple independent domains: ICLK (up to 100 MHz for CPU), PCLK (up to 50 MHz for peripherals), FCLK (50 MHz for FlashIF), and BCLK (50 MHz for external bus). The MCU includes MPU-based memory protection, JTAG/FINE debugging, and IEC60730-compliant safety features including oscillation-stop detection, CRC calculator, and self-diagnostic A/D functionality.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin LFBGA, 13 × 13 mm, 0.8-mm pitch, RoHS-compliant, designed for high-density industrial PCB layouts with thermal pad grounding.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NDCDBG#U0, R5F563NECDBG#U0 offers +512 Kbytes flash for complex protocol stacks, while R5F563NDCDFC#U0 trades LFBGA density for LQFP manufacturability - both retain identical real-time performance, Ethernet capability, and security features.

Availability

R5F563NDCDBG#U0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLC modules, HMI controllers, and networked power quality monitors requiring stable component supply across extended product lifecycles.

Supply support for R5F563NDCDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX63N Group is engineered for real-time industrial connectivity - integrating Ethernet, USB, CAN, and security accelerators to replace multi-chip control subsystems with a single, certified MCU platform.

FAQ

What is the maximum operating frequency and CPU performance of the R5F563NDCDBG#U0?

The R5F563NDCDBG#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance using the RXv1 32-bit CPU core. Its 5-stage pipeline, variable-length instruction set, and single-cycle 32×32 multiplier enable efficient real-time execution. This performance level supports concurrent Ethernet TCP/IP stack, USB device enumeration, and CAN message handling without resource contention - verified in Renesas' R01DS0098EJ0180 datasheet Section 1.1.

Does the R5F563NDCDBG#U0 include hardware encryption capabilities?

Yes, the R5F563NDCDBG#U0 integrates a Data Encryption Unit (DEU) supporting AES-128/192/256 encryption and decryption in ECB and CBC modes. This hardware accelerator offloads cryptographic operations from the CPU, enabling secure boot, encrypted firmware updates, and TLS session establishment with minimal latency impact. The DEU is documented in Section 1.1 and Table 1.1 of the R01DS0098EJ0180 datasheet, confirming its presence in all RX63N Group devices including R5F563NDCDBG#U0.

What package type and pin count does the R5F563NDCDBG#U0 use?

The R5F563NDCDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 × 13 mm with 0.8-mm ball pitch. This LFBGA variant includes an exposed thermal pad for enhanced heat dissipation in industrial environments. Package identification is confirmed in Table 1.3 (Page 9) of the R01DS0098EJ0180 datasheet, where R5F563NDCDBG is explicitly listed with PLBG0176GA-A.

Which analog peripherals are integrated into the R5F563NDCDBG#U0?

The R5F563NDCDBG#U0 integrates a 21-channel 12-bit A/D converter (S12ADa), an 8-channel 10-bit A/D converter (ADb), two 10-bit D/A converters (DAa), and an on-die temperature sensor with ±1°C accuracy. All A/D units support hardware-triggered conversion (via MTU2/TPU/TMR), sample-and-hold, and digital filtering. These analog resources are detailed in Sections 1.1 and Table 1.1 of R01DS0098EJ0180, and are present in all RX63N Group variants including R5F563NDCDBG#U0.

Is the R5F563NDCDBG#U0 compatible with IEC60730 safety standards?

Yes, the R5F563NDCDBG#U0 includes multiple hardware features supporting IEC60730 Class B compliance: oscillation-stop detection, frequency measurement circuitry (MCK), CRC calculator, independent watchdog timer (IWDT), and self-diagnostic A/D functionality. These are explicitly listed under "Useful functions for IEC60730 compliance" in the Features section (Page 1) and Table 1.1 of R01DS0098EJ0180 - confirming their availability in the RX63N Group, including R5F563NDCDBG#U0.