Renesas R5F563NDCDLC#U0

Overview

R5F563NDCDLC#U0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision IEEE-754 FPU, 1.5 Mbytes of on-chip flash, 128 Kbytes of SRAM, and 32 Kbytes of data flash. It features 133 general-purpose I/O pins (18 × 5-V tolerant), hardware AES encryption (DEU), and real-time clock with battery backup - deployed in industrial gateways requiring deterministic networked control and secure firmware updates.

For engineers reviewing the R5F563NDCDLC#U0 datasheet, R5F563NDCDLC#U0 pinout, R5F563NDCDLC#U0 application, or R5F563NDCDLC#U0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), 100-MHz CPU performance (165 DMIPS), integrated 12-bit/10-bit ADCs (21 + 8 channels), dual 10-bit DACs, and TFLGA-177 package compatibility with industrial temperature range (–40°C to +85°C).

Technical Context

The R5F563NDCDLC#U0 implements the RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated DMA controllers for Ethernet (EDMAC), USB, and peripheral functions - including EXDMAC for TFT LCD interfacing and DTC for interrupt-driven transfers.

Its clock system supports external crystal (4–16 MHz) with PLL multiplication up to 100 MHz, plus independent on-chip oscillators (125-kHz LOCO, 50-MHz HOCO). Power management includes four low-power modes, RTC operation from VBATT (2.0–3.6 V), and module stop functionality - all validated for IEC60730 Class B compliance via built-in CRC, oscillation-stop detection, and A/D self-diagnostic.

Key Specifications

Pinout & Package

Package: PTLG0177KA-A - 177-pin Thin Fine-Pitch Land Grid Array (TFLGA), 8 × 8 mm body, 0.5-mm pitch, 0.75-mm height, RoHS-compliant, lead-free matte tin finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NDCDLC#U0, R5F563NECDLC#U0 offers +0.5 Mbytes flash headroom for complex networking stacks, while R5F563NDCDFC#U0 trades TFLGA packaging and PDC for broader manufacturability - both retain identical CPU performance, crypto, and analog capabilities.

Availability

R5F563NDCDLC#U0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLCs, smart energy meters, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F563NDCDLC#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group - including R5F563NDCDLC#U0 - was designed for real-time industrial networking applications demanding integrated Ethernet, functional safety support, and hardware-accelerated security.

FAQ

What is the maximum operating frequency and CPU performance of the R5F563NDCDLC#U0?

The R5F563NDCDLC#U0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS of processing performance using the RXv1 32-bit CPU core. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables efficient code execution for real-time industrial control tasks. The R5F563NDCDLC#U0 also includes a single-precision IEEE-754 floating-point unit for math-intensive operations such as motor control algorithms or sensor fusion.

Does the R5F563NDCDLC#U0 support Ethernet connectivity, and what interface options are available?

Yes, the R5F563NDCDLC#U0 integrates a full-featured Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It supports IEEE 802.3-compliant MII and RMII physical layer interfaces, with dedicated MDIO/MDC pins for PHY management. The on-chip EDMAC controller handles frame transmission and reception via descriptor-based DMA, minimizing CPU load during network traffic - a key capability distinguishing the RX63N Group from the RX631 Group.

What memory resources are included in the R5F563NDCDLC#U0?

The R5F563NDCDLC#U0 includes 1.5 Mbytes of on-chip flash memory (executed at 100 MHz with zero wait states), 128 Kbytes of SRAM (also zero-wait-state), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. This memory configuration supports robust firmware storage, real-time data buffering, and non-volatile parameter retention - all critical for industrial applications where field updates and data logging are required. The R5F563NDCDLC#U0 does not include external bus interface support in its TFLGA-177 variant.

How does the R5F563NDCDLC#U0 support functional safety standards like IEC60730?

The R5F563NDCDLC#U0 includes multiple hardware features certified for IEC60730 Class B compliance: oscillation-stop detection for main/subclocks, dedicated independent watchdog timer (IWDT) with its own 125-kHz on-chip oscillator, CRC calculator supporting three polynomials (X8/X16), and self-diagnostic capability for the 10-bit A/D converter. These features reduce software validation burden and enable safe failure detection in heating, ventilation, and motor control systems - verified in Renesas' official safety manual R01UL0029EJ0200.

What is the package type and thermal rating of the R5F563NDCDLC#U0?

The R5F563NDCDLC#U0 uses the PTLG0177KA-A package: a 177-pin Thin Fine-Pitch Land Grid Array measuring 8 × 8 mm with 0.5-mm pitch and 0.75-mm height. It is rated for industrial temperature operation from –40°C to +85°C (D version), making it suitable for deployment in harsh environments such as factory floors or outdoor utility enclosures. The TFLGA construction provides excellent thermal dissipation and board-level reliability under vibration and thermal cycling stress.