My Inquiry
My Account
Renesas R5F563NDDDLJ#U0
- Part No.:
- R5F563NDDDLJ#U0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-TFLGA
- Datasheet:
-
R5F563NDDDLJ#U0.pdf
- Description:
- IC MCU 32BIT 1.5MB FLSH 100TFLGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,842
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F563NDDDLJ#U0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision IEEE-754 FPU, 1.5 MB on-chip flash, 128 KB SRAM, and 32 KB data flash. It features 100-pin TFLGA (PTLG0100JA-A) packaging, operates from 2.7–3.6 V, supports -40 to +85°C industrial temperature range, and targets networked industrial control and IoT edge nodes requiring deterministic real-time response and secure connectivity.
For engineers reviewing the R5F563NDDDLJ#U0 datasheet, R5F563NDDDLJ#U0 pinout, R5F563NDDDLJ#U0 application, or R5F563NDDDLJ#U0 equivalent, key selection criteria include Ethernet MAC support (MII/RMII), USB 2.0 host/function/OTG capability, CAN v2.0B compliance, 12-bit A/D converter with 21 channels, AES-128/192/256 encryption via DEU, and IEC60730 safety features including CRC, self-diagnostic A/D, and oscillation-stop detection.
Technical Context
The R5F563NDDDLJ#U0 implements the RXv1 CPU core with 5-stage CISC Harvard pipeline, variable-length instructions, and memory protection unit (MPU). Its clock system integrates PLL, 125-kHz LOCO, and 50-MHz HOCO, with independent domain clocks (ICLK up to 100 MHz, PCLK up to 50 MHz) enabling precise peripheral timing control.
It includes dedicated hardware accelerators: EDMAC for Ethernet offload (2 KB TX/RX FIFO), DTC for interrupt-driven transfers, and DEU for AES encryption/decryption in ECB/CBC modes. The MCU supports full-duplex 10/100 Mbps Ethernet with Magic Packet™ wake-on-LAN and IEEE 802.3x flow control - a defining feature distinguishing RX63N from RX631 Group devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC Harvard architecture, 100 MHz max, 165 DMIPS, IEEE-754 single-precision FPU |
| Memory | 1.5 MB flash (no wait states @ 100 MHz), 128 KB SRAM (no wait states), 32 KB reprogrammable data flash (100k cycles) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), USB 2.0 host/function/OTG (full-speed), 3× CAN v2.0B (32 mailboxes each), 4× I²C (1 Mbps), 13× SCI |
| Analog Peripherals | 21-channel 12-bit A/D (1 µs conversion @ 50 MHz PCLK), 8-channel 10-bit A/D, 2× 10-bit D/A, on-die temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256 (ECB/CBC) via DEU, CRC calculator (3 polynomials), IEC60730-compliant self-test functions |
| Package & Environment | 100-pin TFLGA (PTLG0100JA-A, 7 × 7 mm, 0.65-mm pitch), 2.7–3.6 V supply, -40 to +85°C operating range (D version) |
Pinout & Package
Package: 100-pin Thin Fine-Pitch Land Grid Array (TFLGA), PTLG0100JA-A, 7 mm × 7 mm, 0.65 mm pitch, 0.8 mm height, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual 2.7–3.6 V domains (VCC, AVCC0, VREFH, VCC_USB); separate analog/digital ground planes required |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 4–16 MHz external crystal; enables PLL-based 100 MHz system clock generation |
| MDIO / MDC | Management Data Input/Output | IEEE 802.3u-compliant PHY management interface for Ethernet configuration and status monitoring |
| TXD0–TXD3 / RXD0–RXD3 | Ethernet transmit/receive data lines | MII interface signals (4-bit nibble mode); RMII uses TXD0/RXD0 + TX_EN/RX_DV for reduced pin count |
| USB_DP / USB_DM | USB 2.0 differential data pair | Full-speed (12 Mbps) signaling; internal transceiver eliminates need for external PHY |
| CAN0_TX / CAN0_RX | CAN controller channel 0 differential I/O | ISO 11898-1 compliant; requires external CAN transceiver for bus coupling and fault protection |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC with EDMAC | Hardware-accelerated descriptor-based DMA relieves CPU of frame handling; 2 KB TX/RX FIFO reduces latency and jitter in real-time packet processing |
| USB 2.0 Host/Function/OTG | Single-port dual-role controller with integrated transceiver and 2 KB on-chip RAM buffer - enables embedded device-to-device communication without external PHY |
| IEC60730 Safety Support | On-chip CRC calculator, oscillation-stop detection, A/D self-diagnostic, and IWDT with dedicated LOCO clock meet Class B functional safety requirements |
| Flexible Clock Architecture | Independent ICLK/PCLK/FCLK/BCLK domains allow dynamic frequency scaling per subsystem - e.g., run CPU at 100 MHz while peripherals operate at 50 MHz for power optimization |
| DEU AES Engine | Hardware-accelerated encryption/decryption with 128/192/256-bit keys in ECB/CBC modes - enables secure firmware updates and encrypted data logging without software overhead |
Applications
| Industrial Ethernet Gateway | Secure IoT Edge Node |
|---|---|
|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud-connected Ethernet backbone. IC Role / Device Role / Timing Role: Primary MCU executing real-time Modbus stack, managing Ethernet TCP/IP offload via EDMAC, and synchronizing time-critical polling using RTC and MTU2 timers. Use Value: Integrated Ethernet MAC and USB OTG eliminate external PHY and bridge ICs; 1.5 MB flash accommodates dual-application firmware with secure OTA update partitioning. |
Use Scenario: Battery-powered environmental sensor node transmitting encrypted air quality data over Ethernet/Wi-Fi gateway. IC Role / Device Role / Timing Role: Sensor aggregator with AES-encrypted data storage, low-power deep standby mode, and wake-on-LAN triggered by remote command. Use Value: On-chip DEU enables end-to-end encryption without external crypto co-processor; 500 μA/MHz active power and four low-power modes extend battery life in intermittent reporting use cases. |
| Medical Diagnostic Interface | Automated Test Equipment (ATE) |
|
Use Scenario: Front-end controller for ultrasound probe interfacing with analog front-end and display subsystem. IC Role / Device Role / Timing Role: Real-time waveform capture via PDC and DMA, high-resolution A/D sampling (21-channel 12-bit), and USB host control of external storage. Use Value: Parallel data capture unit (PDC) directly streams image sensor output to SRAM; 128 KB SRAM buffers multi-frame acquisitions before compression and transfer. |
Use Scenario: Embedded controller in benchtop test instrument performing signal generation, measurement, and Ethernet-based SCPI command execution. IC Role / Device Role / Timing Role: Precision timing source via RTC and MTU2 PWM outputs, synchronized A/D acquisition across multiple channels, and deterministic USB/Ethernet command response. Use Value: 16-bit MTU2 and TPU timers deliver sub-microsecond PWM resolution and phase-counting accuracy; 100 MHz CPU ensures <100 µs SCPI command latency under full peripheral load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NECDLJ#U0 | 2 MB flash, same 100-pin TFLGA package, identical peripheral set and clock architecture | Higher firmware capacity for complex protocol stacks or dual-image secure boot | Select when >1.5 MB code space required; no PCB or software changes needed beyond flash layout adjustment |
| R5F563NDDDFC#U0 | LQFP-176 package (PLQP0176KB-A), 1.5 MB flash, 256 KB SRAM, adds external bus interface (32-bit, 50 MHz) | Supports external SDRAM, NOR/NAND flash, or FPGA co-processing - not available in TFLGA-100 variant | Choose for designs requiring expandable memory or parallel peripheral interfaces; requires PCB redesign due to larger footprint and different pinout |
Compared with R5F563NDDDLJ#U0, R5F563NECDLJ#U0 offers greater flash headroom within identical form factor and thermal profile, while R5F563NDDDFC#U0 trades compactness for external memory bandwidth and I/O expansion - making it suitable for higher-throughput test or imaging systems where board area permits.
Availability
R5F563NDDDLJ#U0 is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and secure IoT edge applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for R5F563NDDDLJ#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX63N Group is designed for networked industrial control applications demanding real-time performance, functional safety, and integrated connectivity - specifically targeting Ethernet-enabled PLCs, HMIs, and edge gateways where security and deterministic timing are critical.
FAQ
What is the maximum operating frequency and core architecture of the R5F563NDDDLJ#U0?
The R5F563NDDDLJ#U0 operates at a maximum frequency of 100 MHz and implements the 32-bit RXv1 CPU core with a 5-stage pipeline, variable-length instructions, and IEEE-754 single-precision floating-point unit. Its architecture delivers 165 DMIPS and supports memory protection (MPU), JTAG/FINE debugging, and ultra-compact code density - all confirmed in Renesas document R01DS0098EJ0180.
Does the R5F563NDDDLJ#U0 include an Ethernet MAC, and what interface standards does it support?
Yes, the R5F563NDDDLJ#U0 includes a fully integrated Ethernet MAC supporting both MII and RMII physical layer interfaces per IEEE 802.3u, with 10/100 Mbps operation, full/half-duplex modes, IEEE 802.3x flow control, and Magic Packet™ wake-on-LAN detection - a defining feature of the RX63N Group absent in RX631 variants.
What are the memory resources available on the R5F563NDDDLJ#U0?
The R5F563NDDDLJ#U0 provides 1.5 MB of on-chip flash memory (no wait states at 100 MHz), 128 KB of SRAM (no wait states), and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. These values are explicitly listed for part number R5F563NDDDLJ in Table 1.3 of R01DS0098EJ0180 Rev.1.80.
Which security and functional safety features does the R5F563NDDDLJ#U0 support?
The R5F563NDDDLJ#U0 supports AES-128/192/256 encryption/decryption via its Data Encryption Unit (DEU), CRC calculation with three selectable polynomials, oscillation-stop detection, independent watchdog timer (IWDT) with dedicated LOCO clock, and A/D converter self-diagnostic - all documented as IEC60730 Class B compliant features in the RX63N Group datasheet.
What is the package type and pin count of the R5F563NDDDLJ#U0?
The R5F563NDDDLJ#U0 uses a 100-pin Thin Fine-Pitch Land Grid Array (TFLGA) package designated PTLG0100JA-A, measuring 7 mm × 7 mm with 0.65 mm pitch. This package variant is explicitly assigned to R5F563NDDDLJ in Table 1.3 of the official Renesas datasheet R01DS0098EJ0180.
R5F563NDDDLJ#U0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-TFLGA
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 14x12b; D/A 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NDDDLJ#U0 FAQ
1.How can I place an order for R5F563NDDDLJ#U0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NDDDLJ#U0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NDDDLJ#U0 reliable?
The price and inventory of R5F563NDDDLJ#U0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NDDDLJ#U0 is usually 5 days.
3.What payment methods are accepted for R5F563NDDDLJ#U0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NDDDLJ#U0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F563NDDDLJ#U0?
R5F563NDDDLJ#U0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NDDDLJ#U0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NDDDLJ#U0?
For technical support, including R5F563NDDDLJ#U0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NDDDLJ#U0 requirements.
6.How does Aetrix verify that R5F563NDDDLJ#U0 is sourced from the original manufacturer or authorized distributors?
All R5F563NDDDLJ#U0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NDDDLJ#U0 meets industry standards.
7.What is the process for return or replacement of R5F563NDDDLJ#U0?
All R5F563NDDDLJ#U0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NDDDLJ#U0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NDDDLJ#U0 part is unused and in its original packaging.
Return procedure for R5F563NDDDLJ#U0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F563NDDDLJ#U0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
