Renesas R5F563NDDGFB#V0
- Part No.:
- R5F563NDDGFB#V0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F563NDDGFB#V0.pdf
- Description:
- 32BIT MCU RX63N
- Quantity:
- Payment:

- Shipping:

Inventory:1,278
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Product details
Overview
R5F563NDDGFB#V0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC (10/100 Mbps), single-precision IEEE-754 FPU, 165 DMIPS performance, 1.5 Mbytes on-chip flash memory, and 128 Kbytes SRAM. It operates from a 2.7–3.6 V supply, supports -40 to +85°C industrial temperature range, and targets networked industrial control, building automation gateways, and embedded HMI systems requiring real-time connectivity.
For engineers reviewing the R5F563NDDGFB#V0 datasheet, R5F563NDDGFB#V0 pinout, R5F563NDDGFB#V0 application, or R5F563NDDGFB#V0 equivalent, key selection criteria include Ethernet MAC interface support (MII/RMII), USB 2.0 host/function/OTG capability, CAN v2.0B compliance with 32 mailboxes, 21-channel 12-bit A/D converter with sample-and-hold, and hardware AES encryption via DEU module.
Technical Context
The R5F563NDDGFB#V0 implements the 32-bit RX CPU core with 5-stage CISC Harvard pipeline, variable-length instructions, and memory protection unit (MPU). It integrates dedicated peripherals including an Ethernet controller with 2 KB TX/RX FIFOs, EDMAC for descriptor-based DMA offload, and dual USB 2.0 modules (host/function + function-only) sharing 2 KB RAM buffer.
Its clock system combines external crystal oscillator (4–16 MHz), internal PLL, 50 MHz HOCO, and 125 kHz LOCO for independent peripheral clock domains (ICLK up to 100 MHz, PCLK up to 50 MHz). Real-time operation is supported by RTC with battery backup, IWDT with dedicated oscillator, and IEC60730-compliant self-diagnostic features including CRC calculator and A/D converter diagnostics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | RX 32-bit CPU, 100 MHz max, 165 DMIPS - enables deterministic real-time execution of complex control algorithms and protocol stacks. |
| Memory | 1.5 Mbytes flash (no wait states at 100 MHz), 128 Kbytes SRAM, 32 Kbytes data flash - supports large firmware images, real-time data buffering, and field-upgradable parameter storage. |
| Ethernet Interface | IEEE 802.3-compliant MAC with MII/RMII, 10/100 Mbps full/half-duplex - enables direct connection to PHY without external glue logic in industrial Ethernet nodes. |
| Analog Peripherals | 21-channel 12-bit A/D (1 µs conversion @ 50 MHz PCLK), 8-channel 10-bit A/D, 2-channel 10-bit D/A, on-chip temperature sensor (±1°C) - supports multi-sensor monitoring and analog actuator control. |
| Security & Crypto | AES-128/192/256 ECB/CBC via DEU, CRC calculator with three polynomials - provides hardware-accelerated secure boot, firmware authentication, and data integrity checking. |
| Package & Temp | LQFP-144 (PLQP0144KA-A, 20 × 20 mm, 0.5 mm pitch), -40 to +85°C - compatible with standard SMT assembly and suitable for industrial environments with thermal cycling. |
| Power Supply | Single 2.7–3.6 V supply, 500 µA/MHz active current - simplifies power design and enables low-power operation in battery-backed or energy-constrained applications. |
Pinout & Package
Package: PLQP0144KA-A, 144-pin LQFP (20 × 20 mm, 0.5 mm pitch), lead-free, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, VREFH | Core/analog power supply | 2.7–3.6 V main supply; AVCC0 powers analog circuitry; VREFH sets A/D and D/A reference voltage. |
| VBATT | Battery backup supply | 2.3–3.6 V input for RTC and backup registers during main power loss - enables timekeeping and state retention. |
| XTAL, EXTAL | Main crystal oscillator inputs | Supports 4–16 MHz external crystal for precise system clock generation and Ethernet timing compliance. |
| MDIO, MDC, TXD[3:0], RXD[3:0], CRS, COL, RX_ER, TX_EN | Ethernet MAC physical interface | MII mode signals; enables direct connection to standard 10/100BASE-TX PHY without level-shifting or interface translation. |
| USB_VBUS, USB_DP, USB_DM, USB_ID | USB 2.0 transceiver interface | Full-speed (12 Mbps) host/function/OTG support; USB_ID enables dynamic role switching in OTG mode. |
| TXDn, RXDn, SCKn, SINn, SOUTn | SCI/RSPI/I²C multiplexed pins | Configurable serial interfaces - allows flexible peripheral expansion (e.g., SCI for Modbus RTU, RSPI for display driver). |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC + EDMAC | Offloads TCP/IP stack processing via descriptor-based DMA; 2 KB TX/RX FIFOs reduce CPU interrupt overhead in high-throughput network applications. |
| USB 2.0 Host/Function + OTG | Dual-port architecture (one host/function, one function-only) with shared 2 KB buffer - enables simultaneous device enumeration and host-side peripheral attachment (e.g., USB flash + HID keyboard). |
| IEC60730 Compliance Support | Integrated oscillation-stop detection, frequency measurement, CRC calculator, IWDT, and A/D self-diagnostic - reduces certification effort for Class B safety-critical industrial equipment. |
| Flexible Clock System | Independent clock domains (ICLK/PCLK/FCLK/BCLK) with programmable dividers/multipliers - allows optimal power/performance trade-offs per subsystem (e.g., 100 MHz CPU, 50 MHz peripherals, 25 MHz external bus). |
| High-Density I/O | 111 general-purpose I/O pins (18 with 5 V tolerance, open-drain, pull-up configurable) - supports mixed-voltage interfacing and direct drive of LEDs, relays, or sensors without external buffers. |
Applications
| Industrial Ethernet Gateway | Building Automation Controller |
|---|---|
Use Scenario: Aggregating Modbus RTU field devices and bridging to Ethernet/IP or MQTT networks in HVAC or lighting control panels. IC Role / Device Role / Timing Role: Primary MCU executing protocol translation, real-time scheduling, and secure OTA updates via Ethernet and USB. Use Value: Integrated Ethernet MAC and dual USB ports eliminate external PHY and hub ICs, reducing BOM cost and PCB area by >15% versus discrete solutions. |
Use Scenario: Standalone controller managing occupancy sensors, thermostats, and DALI ballasts in smart office zones. IC Role / Device Role / Timing Role: Real-time scheduler coordinating sensor sampling (A/D), actuator PWM (TPU/MTU2), and encrypted cloud telemetry (AES + USB/Ethernet). Use Value: On-chip 12-bit A/D with 21 channels and hardware CRC enable reliable multi-sensor fusion without external ADCs or checksum engines. |
| Embedded HMI Terminal | Networked PLC I/O Module |
Use Scenario: Touch-enabled operator interface with local graphics rendering and remote configuration via web server over Ethernet. IC Role / Device Role / Timing Role: Application processor running lightweight GUI framework, handling USB mass storage for firmware updates, and managing Ethernet communication stack. Use Value: 256 Kbytes SRAM option (available in same package family) supports frame buffer storage and dynamic web content caching without external RAM. |
Use Scenario: DIN-rail mounted digital I/O expansion module with EtherNet/IP slave functionality and local diagnostics. IC Role / Device Role / Timing Role: Deterministic EtherNet/IP slave node with cycle times <1 ms, leveraging MTU2 for precise I/O timestamping and TPU for PWM output control. Use Value: Hardware-supported EtherNet/IP CIP messaging and 100 MHz CPU ensure sub-millisecond jitter in cyclic I/O exchange, meeting Class A motion control requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NECDFB#V0 | 2 Mbytes flash, same 128 Kbytes SRAM, identical package and peripherals | Higher firmware capacity for feature-rich protocols (e.g., full TLS stack, dual Ethernet VLANs) | Select when firmware image size exceeds 1.5 Mbytes or future-proofing for feature expansion is required. |
| R5F563NDDDFB#V0 | Same 1.5 Mbytes flash and 128 Kbytes SRAM, but LQFP-144 package with different pin assignment (non-pin-compatible) | Requires PCB redesign due to altered peripheral pin mapping (e.g., Ethernet signals relocated) | Choose only for new designs where layout flexibility allows reassignment of Ethernet, USB, and CAN signals. |
Compared with R5F563NDDGFB#V0, R5F563NECDFB#V0 offers +512 Kbytes flash for larger protocol stacks without changing footprint, while R5F563NDDDFB#V0 shares memory specs but demands board-level changes due to incompatible pinout - making the original part optimal for drop-in replacement in existing LQFP-144 layouts with verified signal routing.
Availability
R5F563NDDGFB#V0 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, building automation controllers, and embedded HMI terminals requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for R5F563NDDGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX63N Group is designed for real-time industrial connectivity applications, integrating Ethernet, USB, CAN, and security accelerators to replace multi-chip solutions in networked control systems.
FAQ
What is the maximum operating frequency and core architecture of the R5F563NDDGFB#V0?
The R5F563NDDGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with 5-stage pipeline, CISC Harvard architecture, and variable-length instructions. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit (FPU) for efficient mathematical computation in control algorithms and signal processing tasks within the R5F563NDDGFB#V0.
Does the R5F563NDDGFB#V0 support Ethernet connectivity, and what interface modes are available?
Yes, the R5F563NDDGFB#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both MII and RMII physical layer interfaces at 10/100 Mbps in full- and half-duplex modes. It includes dedicated EDMAC with 2 KB TX/RX FIFOs and Magic Packet™ wake-on-LAN support. This Ethernet capability is exclusive to the RX63N Group and not present in the RX631 Group, confirming its role in the R5F563NDDGFB#V0 as a networked industrial controller.
What are the memory resources available on the R5F563NDDGFB#V0?
The R5F563NDDGFB#V0 features 1.5 Mbytes of on-chip flash memory (executed at 100 MHz with zero wait states), 128 Kbytes of SRAM (also zero-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. These resources support robust firmware storage, real-time data buffering, and non-volatile parameter retention - all critical for reliable operation in the R5F563NDDGFB#V0's target applications.
Which communication interfaces does the R5F563NDDGFB#V0 support besides Ethernet?
Beyond Ethernet, the R5F563NDDGFB#V0 supports USB 2.0 full-speed host/function/OTG (dual ports), three CAN 2.0B channels (32 mailboxes each), up to 13 SCI channels (with UART, SPI, I²C, LIN modes), four I²C-bus interfaces (one FM+), three RSPI channels, one IEBus channel, and parallel data capture (PDC). This comprehensive interface set enables seamless integration into heterogeneous industrial networks without external bridge ICs in the R5F563NDDGFB#V0.
Is the R5F563NDDGFB#V0 suitable for safety-critical applications, and what IEC60730 features does it include?
Yes, the R5F563NDDGFB#V0 includes hardware features aligned with IEC60730 Class B requirements: oscillation-stop detection, clock frequency measurement, CRC calculator (with three polynomials), independent watchdog timer (IWDT) with dedicated oscillator, and self-diagnostic functions for the 10-bit A/D converter. These capabilities reduce software validation burden and support functional safety certification for industrial control equipment using the R5F563NDDGFB#V0.
R5F563NDDGFB#V0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NDDGFB#V0 FAQ
1.How can I place an order for R5F563NDDGFB#V0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NDDGFB#V0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NDDGFB#V0 reliable?
The price and inventory of R5F563NDDGFB#V0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NDDGFB#V0 is usually 5 days.
3.What payment methods are accepted for R5F563NDDGFB#V0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NDDGFB#V0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F563NDDGFB#V0?
R5F563NDDGFB#V0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NDDGFB#V0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NDDGFB#V0?
For technical support, including R5F563NDDGFB#V0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NDDGFB#V0 requirements.
6.How does Aetrix verify that R5F563NDDGFB#V0 is sourced from the original manufacturer or authorized distributors?
All R5F563NDDGFB#V0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NDDGFB#V0 meets industry standards.
7.What is the process for return or replacement of R5F563NDDGFB#V0?
All R5F563NDDGFB#V0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NDDGFB#V0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NDDGFB#V0 part is unused and in its original packaging.
Return procedure for R5F563NDDGFB#V0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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