Renesas R5F563NECDBG#G0

Overview

R5F563NECDBG#G0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller in the RX63N Group, featuring integrated Ethernet MAC (10/100 Mbps), full-speed USB 2.0 host/function/OTG, three CAN channels, 2 MB on-chip flash, 128 KB SRAM, 32 KB data flash, IEEE-754 single-precision FPU, and hardware AES encryption. It operates from 2.7–3.6 V at –40 to +85°C and targets industrial networking gateways requiring deterministic real-time control and secure connectivity.

For engineers reviewing the R5F563NECDBG#G0 datasheet, R5F563NECDBG#G0 pinout, R5F563NECDBG#G0 application, or R5F563NECDBG#G0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 176-pin LFBGA (PLBG0176GA-A) package compatibility, 100 MHz timing margin for deterministic ISR latency, and IEC60730-compliant self-test features including CRC, IWDT, and A/D diagnostic functions.

Technical Context

The R5F563NECDBG#G0 implements the RXv1 core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling 165 DMIPS at 100 MHz. Its memory subsystem includes zero-wait-state 100 MHz flash and SRAM, plus dedicated EDMAC for Ethernet offloading and DTC/DMAC/EXDMAC for multi-channel peripheral-to-memory transfers.

It integrates dual-clock domain operation: ICLK up to 100 MHz for CPU execution, PCLK up to 50 MHz for peripherals, and independent BCLK/SDRAM clocks. Real-time capabilities are reinforced by MTU2/TPU timers with input capture, PWM, phase counting, and A/D trigger generation-plus RTC with battery backup and time-capture on external events.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 13 × 13 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free solder compatible.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NECDBG#G0, the R5F563NECDFC#G0 trades SDRAM support and 5 extra GPIOs for easier assembly, while R5F563NEDDBG#G0 offers identical hardware functionality with different preloaded firmware - making it a drop-in replacement for field updates.

Availability

R5F563NECDBG#G0 is available at Aetrix Electronics and suitable for industrial networking gateways, programmable logic controllers, secure IoT edge nodes, and human-machine interfaces requiring stable component supply across extended product lifecycles.

Supply support for R5F563NECDBG#G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX63N Group was designed for real-time industrial control with integrated Ethernet, USB, and functional safety features - targeting applications where deterministic performance, security, and long-term supply stability are critical.

FAQ

What is the maximum operating frequency and core architecture of the R5F563NECDBG#G0?

The R5F563NECDBG#G0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution essential for industrial control tasks within the R5F563NECDBG#G0.

Does the R5F563NECDBG#G0 support Ethernet connectivity, and what interface standards does it implement?

Yes, the R5F563NECDBG#G0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It implements MII and RMII physical layer interfaces per IEEE 802.3u and includes Magic Packet™ wake-on-LAN and IEEE 802.3x flow control. The R5F563NECDBG#G0 requires an external PHY but handles all MAC-layer framing and DMA via its dedicated EDMAC.

What are the memory resources available on the R5F563NECDBG#G0?

The R5F563NECDBG#G0 includes 2 MB of on-chip flash memory (zero wait states at 100 MHz), 128 KB of SRAM (zero wait states), and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. It also supports external memory expansion via an 8-area, 128 MB SDRAM interface and configurable 8/16/32-bit CS bus - all accessible without performance penalty due to its multi-bus architecture.

How does the R5F563NECDBG#G0 support functional safety compliance for industrial applications?

The R5F563NECDBG#G0 includes hardware features required for IEC60730 Class B compliance: oscillation-stop detection, frequency measurement circuitry, CRC calculator with three polynomials, independent watchdog timer (IWDT) with dedicated LOCO clock, and self-diagnostic capability for the 10-bit A/D converter. These are documented in Renesas Application Note R01AN1439 and validated in the R5F563NECDBG#G0 silicon.

What package type and pin count does the R5F563NECDBG#G0 use, and what are its thermal specifications?

The R5F563NECDBG#G0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 13 × 13 mm body size and 0.8 mm ball pitch. It operates over the industrial temperature range of –40°C to +85°C and is rated for reflow soldering per J-STD-020. This package provides 133 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors - optimized for dense industrial PCB layouts.