Renesas R5F563NECDFC#V0

Overview

R5F563NECDFC#V0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, 2 Mbyte flash, 128 Kbyte SRAM, 32 Kbyte data flash, single-precision FPU, and IEEE 802.3-compliant 10/100 Mbps connectivity - deployed in industrial gateways requiring real-time protocol bridging and secure firmware updates.

For engineers reviewing the R5F563NECDFC#V0 datasheet, R5F563NECDFC#V0 pinout, R5F563NECDFC#V0 application, or R5F563NECDFC#V0 equivalent, key selection criteria include Ethernet MAC + USB 2.0 OTG coexistence, 12-bit A/D (21 ch) + 10-bit D/A (2 ch) mixed-signal capability, AES-128/192/256 DEU for secure boot, and -40°C to +85°C operation in LQFP-176 package.

Technical Context

The R5F563NECDFC#V0 implements the RXv1 CPU core with 5-stage CISC Harvard pipeline, supporting 165 DMIPS at 100 MHz and IEEE-754 single-precision floating-point operations. Its memory subsystem includes zero-wait-state 100 MHz flash and SRAM, plus background-programmable 32 Kbyte data flash rated for 100,000 erase/write cycles.

It integrates dedicated hardware accelerators: EDMAC for Ethernet offload (2 KB TX/RX FIFO), EXDMAC for TFT LCD streaming, and DEU for AES encryption/decryption in ECB/CBC modes. Clock management supports independent ICLK (100 MHz), PCLK (50 MHz), FCLK (50 MHz), and BCLK (50 MHz) domains with PLL, HOCO, LOCO, and subclock sources.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin LQFP, 24 mm × 24 mm, 0.5 mm pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NECDFC#V0, R5F563NECDFB#V0 reduces pin count and I/O while retaining core connectivity, whereas R5F563NFHDFC#V0 doubles SRAM capacity within the same 176-pin LQFP footprint - enabling higher-performance real-time workloads without layout revision.

Availability

R5F563NECDFC#V0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLC controllers, smart energy meter hubs, and building automation controllers requiring stable component supply and long-term manufacturability.

Supply support for R5F563NECDFC#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RX63N Group - including R5F563NECDFC#V0 - was designed for industrial networking applications demanding integrated Ethernet, real-time determinism, functional safety support, and secure firmware execution in extended temperature environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F563NECDFC#V0?

The R5F563NECDFC#V0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with 5-stage pipeline, achieving 165 DMIPS and supporting IEEE-754 single-precision floating-point arithmetic. Its CISC Harvard architecture enables ultra-compact code density and deterministic interrupt latency critical for real-time industrial control - all verified in the R01DS0098EJ0180 datasheet.

Does the R5F563NECDFC#V0 include an Ethernet MAC, and what physical layer interfaces does it support?

Yes, the R5F563NECDFC#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting 10/100 Mbps in full- and half-duplex modes. It supports both MII and RMII physical layer interfaces, with dedicated ETH_MDC/MDIO pins for PHY management and WOL/Magic Packet detection - confirmed in Section 1.1 and Table 1.1 of the R01DS0098EJ0180 specification.

How much on-chip memory does the R5F563NECDFC#V0 provide, and is the data flash reprogrammable?

The R5F563NECDFC#V0 provides 2 Mbyte of on-chip flash memory (zero-wait-state at 100 MHz), 128 Kbyte of SRAM, and 32 Kbyte of on-chip data flash. The data flash is reprogrammable up to 100,000 times and supports background programming/erasing (BGO), enabling firmware updates without halting application execution - as specified in Table 1.1 and Section 1.1 of R01DS0098EJ0180.

What security features are integrated into the R5F563NECDFC#V0 for firmware protection?

The R5F563NECDFC#V0 includes a dedicated Data Encryption Unit (DEU) supporting AES-128/192/256 encryption and decryption in ECB and CBC modes, plus a Memory Protection Unit (MPU) for runtime privilege enforcement. These features enable secure boot, encrypted OTA updates, and runtime code integrity - documented in Sections 1.1 and 1.2 of the R01DS0098EJ0180 datasheet.

What is the package type and thermal specification for the R5F563NECDFC#V0?

The R5F563NECDFC#V0 uses the PLQP0176KB-A package: a 176-pin LQFP measuring 24 mm × 24 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for industrial temperature operation from -40°C to +85°C (D version), with thermal resistance θJA ≈ 35°C/W under standard JEDEC conditions - per Package Outline Drawing PLQP0176KB-A and Table 1.3 in R01DS0098EJ0180.