Renesas R5F563NEDDBG#G0
- Part No.:
- R5F563NEDDBG#G0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R5F563NEDDBG#G0.pdf
- Description:
- 32BIT MCU RX63N 2M/128K LFBGA176
- Quantity:
- Payment:

- Shipping:

Inventory:4,091
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Product details
Overview
R5F563NEDDBG#G0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC (10/100 Mbps), single-precision IEEE-754 FPU, 2 Mbytes of on-chip flash memory, 128 Kbytes of SRAM, and 32 Kbytes of data flash. It features 133 general-purpose I/O pins, hardware AES encryption (DEU), and operates from a 2.7–3.6 V supply across –40 to +85°C. It targets industrial networking gateways requiring deterministic real-time control and secure wired connectivity.
For engineers reviewing the R5F563NEDDBG#G0 datasheet, R5F563NEDDBG#G0 pinout, R5F563NEDDBG#G0 application, or R5F563NEDDBG#G0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 176-pin LFBGA (PLBG0176GA-A) package compatibility, 100-MHz timing margin for deterministic ISR latency, and IEC60730-compliant safety features including CRC, IWDT, and A/D self-diagnostic.
Technical Context
The R5F563NEDDBG#G0 implements the CISC Harvard-architecture RX CPU core with 5-stage pipeline, variable-length instructions, and MPU support. Its clock system integrates PLL, HOCO (50 MHz), LOCO (125 kHz), and subclock oscillators, enabling independent domain clocking (ICLK up to 100 MHz, PCLK up to 50 MHz).
It includes dedicated hardware accelerators: EDMAC for zero-CPU-load Ethernet packet handling (2 KB TX/RX FIFO), DEU for AES-128/192/256 encryption/decryption, and DTC/DMAC/EXDMAC for parallel peripheral-to-memory transfers - critical for real-time sensor fusion and protocol stack offload in gateway applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RX 32-bit CISC with 5-stage pipeline, 165 DMIPS @ 100 MHz - enables high-throughput protocol stack execution without external co-processor. |
| Flash Memory | 2 Mbytes main flash, 100 MHz no-wait access - supports dual-bank operation for safe over-the-air firmware updates. |
| SRAM | 128 Kbytes on-chip SRAM, no-wait access - sufficient for TCP/IP stack buffers, CAN message queues, and real-time task stacks. |
| Ethernet Interface | IEEE 802.3-compliant 10/100 Mbps MAC with MII/RMII support and Magic Packet™ wake-on-LAN - enables embedded switch/router functionality in compact form factor. |
| Analog Peripherals | 21-channel 12-bit ADC (1 µs conversion), 8-channel 10-bit ADC, 2-channel 10-bit DAC, and on-die temperature sensor (±1°C) - supports local analog monitoring without external signal conditioning. |
| Security & Safety | AES-128/192/256 ECB/CBC via DEU; CRC calculator with three polynomials; IEC60730-compliant IWDT, oscillation-stop detection, and A/D self-diagnostic - meets Class B functional safety requirements. |
| Package & Environment | 176-pin LFBGA (PLBG0176GA-A), 13 × 13 mm, 0.8 mm pitch; operating temperature –40 to +85°C - suitable for convection-cooled industrial PCB layouts with standard reflow profiles. |
Pinout & Package
Package: 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), PLBG0176GA-A, 13 × 13 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | 12 dedicated VCC/VSS pairs ensure stable core/peripheral voltage delivery; decoupling required per Renesas layout guidelines (R01DS0098EJ0180 §7.2). |
| MD[0:3] | Mode selection inputs | Configure boot source (ROM/flash) and debug interface (JTAG/FINE); must be pulled high/low at reset for correct startup mode. |
| ETH_MDC / ETH_MDIO | Ethernet management interface | Connects to PHY's management port for register configuration and link status polling; requires 50 Ω series termination. |
| ETH_TXD[0:3] / ETH_RXD[0:3] | Ethernet data lanes | MII interface signals; routed as matched-length differential pairs (100 Ω ±10%) for EMI compliance and signal integrity. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 full-speed interface | Supports host/function/OTG operation; VBUS sensing enables bus-power/self-power mode auto-detection per USB spec. |
| AD00–AD20 | Analog input channels | 21-pin group for 12-bit ADC; shared with GPIO; internal sample-and-hold enables simultaneous multi-channel sampling. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Eliminates need for external PHY+MAC IC, reducing BOM cost and PCB area by ~30% vs. discrete solutions while maintaining full IEEE 802.3 compliance. |
| Dedicated EDMAC | Offloads Ethernet frame DMA handling from CPU, freeing >15% of CPU bandwidth for application logic during sustained 100 Mbps traffic. |
| Hardware AES Engine (DEU) | Performs AES-128 encryption/decryption in <100 cycles per block - enables TLS 1.2 handshake acceleration without software crypto library overhead. |
| IEC60730 Safety Support | On-chip CRC, IWDT, oscillator failure detection, and A/D self-test reduce external safety component count and simplify certification evidence generation. |
| Flexible Clock Architecture | Independent ICLK/PCLK/FCLK/BCLK domains allow precise power/performance tuning - e.g., run CPU at 100 MHz while peripherals operate at 25 MHz to cut dynamic power by 35%. |
Applications
| Industrial Ethernet Gateway | Secure PLC Communication Module |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic between legacy fieldbus devices and cloud SCADA systems. IC Role / Device Role / Timing Role: Primary protocol processor with integrated Ethernet MAC, real-time scheduler, and TLS 1.2 endpoint. Use Value: Single-chip solution reduces latency jitter (<5 µs interrupt response) and eliminates inter-chip synchronization errors common in multi-IC gateway designs. |
Use Scenario: Adding encrypted remote diagnostics and firmware update capability to DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Secure communication coprocessor managing TLS handshakes, certificate validation, and AES-encrypted payload transport. Use Value: Hardware DEU enables end-to-end encryption at line rate (100 Mbps) without degrading ladder logic scan time - maintains deterministic PLC cycle times. |
| Building Automation Controller | Energy Management System Hub |
|
Use Scenario: Central HVAC controller interfacing with BACnet MS/TP field devices and connecting to enterprise BACnet/IP network. IC Role / Device Role / Timing Role: Real-time BACnet stack executor with integrated RTC, CAN, and Ethernet interfaces. Use Value: On-chip RTC with battery backup and 133 GPIOs enable direct sensor/actuator interfacing - eliminates external timing IC and level-shifter components. |
Use Scenario: Smart meter data concentrator collecting consumption data from RS485-connected meters and transmitting via Ethernet to utility head-end systems. IC Role / Device Role / Timing Role: Data aggregation engine with 12-bit ADC for auxiliary voltage/current monitoring and hardware CRC for data integrity verification. Use Value: Integrated 21-channel ADC and CRC calculator validate meter readings locally before transmission - reduces false alarms and retransmission overhead by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NECDDBG#G0 | Same package (PLBG0176GA-A), identical 2 MB flash/128 KB SRAM, but lacks Ethernet MAC and DEU. | Suitable only for non-networked control applications where Ethernet and AES are unnecessary. | Select only if Ethernet and security acceleration are excluded from system requirements - saves cost but removes key R5F563NEDDBG#G0 differentiators. |
| R5F566NHDDFK#V0 | RX66N successor: 160 MHz CPU, 4 MB flash, enhanced Ethernet (TSN-ready), but larger 216-pin LFBGA package. | Targets next-gen gateways requiring higher throughput, time-sensitive networking, and extended memory for edge AI inference. | Choose when future-proofing for TSN or >100 Mbps aggregate throughput is required - not drop-in compatible due to pinout and power sequencing changes. |
Compared with R5F563NECDDBG#G0, the R5F563NEDDBG#G0 delivers essential Ethernet and AES capabilities in the same footprint; versus R5F566NHDDFK#V0, it offers proven industrial qualification and lower system integration risk at the cost of peak performance headroom.
Availability
R5F563NEDDBG#G0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLC modules, building automation controllers, and energy management hubs requiring stable component supply and long-term manufacturability.
Supply support for R5F563NEDDBG#G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power management ICs for automotive, industrial, and IoT applications.
The RX63N Group was designed specifically for industrial networking and real-time control applications requiring integrated Ethernet, functional safety, and cryptographic acceleration - positioning R5F563NEDDBG#G0 as a purpose-built solution for edge gateway development.
FAQ
What is the maximum operating frequency and core architecture of the R5F563NEDDBG#G0?
The R5F563NEDDBG#G0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for industrial control loops and protocol stack processing in the R5F563NEDDBG#G0.
Does the R5F563NEDDBG#G0 support Ethernet connectivity, and what interface standards does it implement?
Yes, the R5F563NEDDBG#G0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It implements MII and RMII physical layer interfaces and includes Magic Packet™ wake-on-LAN detection. The dedicated EDMAC hardware handles descriptor-based frame transfers, minimizing CPU overhead during sustained Ethernet traffic - a defining feature distinguishing the R5F563NEDDBG#G0 from non-Ethernet RX631 variants.
What security and functional safety features are built into the R5F563NEDDBG#G0?
The R5F563NEDDBG#G0 includes a hardware Data Encryption Unit (DEU) supporting AES-128/192/256 in ECB and CBC modes, CRC calculation with three configurable polynomials, independent watchdog timer (IWDT) with dedicated oscillator, oscillation-stoppage detection, and A/D converter self-diagnostic functions. These features collectively support IEC60730 Class B compliance, enabling R5F563NEDDBG#G0-based designs to meet industrial safety certification requirements without external safety monitors.
What is the package type and pin count of the R5F563NEDDBG#G0, and how does it compare to other RX63N variants?
The R5F563NEDDBG#G0 uses a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLBG0176GA-A, measuring 13 × 13 mm with 0.8 mm ball pitch. This matches the pinout of other 176-pin RX63N variants like R5F563NECDDBG#G0 but differs from 177-pin TFLGA or 144-pin LQFP versions. The 176-pin LFBGA provides 133 general-purpose I/Os with 5-V tolerance on 18 pins - a key mechanical and routing constraint for R5F563NEDDBG#G0 PCB layout.
How much on-chip memory does the R5F563NEDDBG#G0 provide, and what are its access characteristics?
The R5F563NEDDBG#G0 integrates 2 Mbytes of on-chip flash memory with 100 MHz no-wait-state access, 128 Kbytes of SRAM also with no-wait access, and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. Flash supports background programming/erasing (BGO), enabling firmware updates without halting application execution. These memory resources are fully utilized in the R5F563NEDDBG#G0 to host real-time OS, protocol stacks, and application code within a single-chip solution.
R5F563NEDDBG#G0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RX63N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 133
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NEDDBG#G0 FAQ
1.How can I place an order for R5F563NEDDBG#G0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NEDDBG#G0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NEDDBG#G0 reliable?
The price and inventory of R5F563NEDDBG#G0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NEDDBG#G0 is usually 5 days.
3.What payment methods are accepted for R5F563NEDDBG#G0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NEDDBG#G0 transactions.
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4.How is shipping managed for R5F563NEDDBG#G0?
R5F563NEDDBG#G0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NEDDBG#G0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NEDDBG#G0?
For technical support, including R5F563NEDDBG#G0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NEDDBG#G0 requirements.
6.How does Aetrix verify that R5F563NEDDBG#G0 is sourced from the original manufacturer or authorized distributors?
All R5F563NEDDBG#G0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NEDDBG#G0 meets industry standards.
7.What is the process for return or replacement of R5F563NEDDBG#G0?
All R5F563NEDDBG#G0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NEDDBG#G0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NEDDBG#G0 part is unused and in its original packaging.
Return procedure for R5F563NEDDBG#G0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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