Renesas R5F563NEDDBG#U0
- Part No.:
- R5F563NEDDBG#U0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R5F563NEDDBG#U0.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5F563NEDDBG#U0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller with integrated Ethernet MAC (10/100 Mbps), single-precision IEEE-754 FPU, 2 Mbyte on-chip flash, 128 Kbyte SRAM, and 32 Kbyte data flash. It supports CAN (3 channels), USB 2.0 host/function/OTG, 13 SCI channels, 4 I²C interfaces, and operates from 2.7–3.6 V across –40 to +85°C. Used in industrial gateways requiring deterministic real-time control and network connectivity.
For engineers reviewing the R5F563NEDDBG#U0 datasheet, R5F563NEDDBG#U0 pinout, R5F563NEDDBG#U0 application, or R5F563NEDDBG#U0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), LFBGA-176 package compatibility, 100-MHz timing margin for deterministic ISR latency, and DEU-AES-128/192/256 hardware encryption for secure firmware updates.
Technical Context
The R5F563NEDDBG#U0 implements the RXv1 core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated peripherals including EDMAC (Ethernet DMA), EXDMAC (2-channel), DTC (data transfer controller), and MPU for memory protection-enabling safe partitioning of real-time tasks and network stacks.
Its clock system includes PLL, HOCO (50 MHz), LOCO (125 kHz), and subclock oscillator, with independent division/multiplication for ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (50 MHz), and BCLK (50 MHz). The device supports four low-power modes and RTC battery backup via VBATT (2.0–3.6 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC with 5-stage pipeline, 165 DMIPS @ 100 MHz |
| Max Operating Frequency | 100 MHz system clock (ICLK); enables sub-100 ns interrupt response time |
| Flash Memory | 2 Mbytes main flash, zero-wait-state access at 100 MHz for deterministic code execution |
| SRAM | 128 Kbytes on-chip SRAM, no wait states, supports instruction + operand dual access |
| Ethernet Interface | IEEE 802.3-compliant 10/100 Mbps MAC with MII/RMII support and Magic Packet™ wake-on-LAN |
| Analog Peripherals | 21-channel 12-bit A/D converter (1 µs conversion @ 50 MHz PCLK) + 2-channel 10-bit D/A |
| Security | Data Encryption Unit (DEU) supporting AES-128/192/256 in ECB/CBC modes |
Pinout & Package
Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 × 13 mm, 0.8 mm pitch, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | 12 dedicated VCC/VSS pairs ensure stable 2.7–3.6 V core voltage under 100 MHz operation |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 4–16 MHz external crystals for precise system clock generation |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register configuration and status monitoring |
| ETH_TXD[3:0] / ETH_RXD[3:0] | Ethernet data lanes | 4-bit nibble-wide transmit/receive paths for MII mode; RMII uses ETH_TXD[1:0]/RXD[1:0] |
| USB_VBUS / USB_ID | USB OTG detection inputs | Enables automatic host/device role switching per USB On-The-Go specification |
| AD000–AD020 | Analog input channels | 21 dedicated pins for 12-bit A/D conversion; includes internal temperature sensor channel |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC + EDMAC | Dedicated 2-Kbyte TX/RX FIFO and descriptor-based DMA offload reduces CPU load by >40% in TCP/IP stack throughput |
| Floating-Point Unit | Single-precision IEEE-754 compliance enables real-time motor control algorithms without software emulation overhead |
| Memory Protection Unit (MPU) | Configurable regions enforce privilege separation between application, bootloader, and network stack for IEC 60730 Class B compliance |
| USB 2.0 Host/Function/OTG | Integrated transceiver and 2-Kbyte RAM buffer support simultaneous CDC/DFU class operation without external memory |
| Real-Time Clock with Battery Backup | VBATT-powered RTC maintains calendar/time across deep software standby with <1 µA retention current |
| AES Hardware Acceleration | DEU performs AES-128 encryption/decryption in <100 cycles per block-critical for OTA firmware signature verification |
Applications
| Industrial Ethernet Gateway | Secure PLC Communication Module |
|---|---|
Use Scenario: Aggregating Modbus RTU/TCP field devices into cloud-connected SCADA systems with TLS tunneling. IC Role / Device Role / Timing Role: Primary MCU executing real-time protocol translation, Ethernet packet assembly, and AES-encrypted TLS handshake. Use Value: Integrated Ethernet MAC + DEU eliminates need for external PHY + crypto IC, reducing BOM cost by ~$1.80 and PCB area by 22 mm². |
Use Scenario: Retrofitting legacy PLCs with secure remote diagnostics and firmware update capability over cellular backhaul. IC Role / Device Role / Timing Role: Standalone communication coprocessor handling encrypted OTA updates, watchdog supervision, and CAN-to-USB bridging. Use Value: 2-Mbyte flash stores dual firmware images; 128-Kbyte SRAM buffers full firmware payloads for atomic update validation before commit. |
| Building Automation Controller | Medical Device Network Interface |
Use Scenario: HVAC control panel with BACnet/IP, DALI lighting control, and local web UI served from on-chip flash. IC Role / Device Role / Timing Role: Real-time scheduler managing 100+ concurrent BACnet objects while servicing HTTP requests via lightweight TCP/IP stack. Use Value: 13 SCI channels enable native DALI bus control and RS-485 BACnet trunk without UART expanders; 100 MHz headroom ensures <5 ms jitter on critical control loops. |
Use Scenario: Patient monitor aggregating ECG, SpO₂, and NIBP data streams for HL7-over-HTTP transmission to hospital EMR. IC Role / Device Role / Timing Role: Safety-critical data concentrator performing CRC-16 validation, AES-GCM encryption, and time-stamped packetization prior to Ethernet dispatch. Use Value: IEC 60730-compliant self-test features (oscillation detection, A/D diagnostic, CRC calculator) satisfy Class B functional safety requirements without external supervision IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NECDLC#U0 | TFLGA-177 package (8×8 mm), same 2 Mbyte flash/128 Kbyte SRAM, but lacks LFBGA mechanical robustness for high-vibration environments | Suitable for space-constrained portable medical devices where board flex is minimal | Select when footprint size <64 mm² is mandatory and thermal cycling is limited |
| R5F563NEDDFC#U0 | LQFP-176 package (24×24 mm), identical peripheral set and memory, but 0.5-mm pitch increases solder joint reliability risk vs. LFBGA's 0.8-mm ball pitch | Better suited for prototyping and manual rework due to accessible leads | Choose for low-volume production or when JTAG debugging access trumps long-term field reliability |
Compared with R5F563NEDDBG#U0, the TFLGA alternative offers smaller footprint but lower mechanical ruggedness, while the LQFP variant eases assembly at the expense of thermal performance and vibration resistance-making the LFBGA optimal for industrial gateways requiring 15+ year service life.
Availability
R5F563NEDDBG#U0 is available at Aetrix Electronics and suitable for industrial gateways, building automation controllers, and secure PLC communication modules requiring stable component supply, long lifecycle assurance, and qualified automotive-grade traceability.
Supply support for R5F563NEDDBG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The RX63N Group targets industrial networking applications requiring integrated Ethernet, real-time determinism, functional safety support (IEC 60730), and hardware security-positioning R5F563NEDDBG#U0 as a single-chip solution for edge gateway consolidation.
FAQ
What is the maximum operating frequency and core type of the R5F563NEDDBG#U0?
The R5F563NEDDBG#U0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core. This core delivers 165 DMIPS performance and includes a single-precision IEEE-754 floating-point unit, 5-stage pipeline, and variable-length instruction set optimized for code density and real-time responsiveness. Its architecture supports deterministic interrupt latency critical for industrial control loops.
Does the R5F563NEDDBG#U0 include an Ethernet MAC, and what standards does it support?
Yes, the R5F563NEDDBG#U0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It implements MII and RMII physical layer interfaces, Magic Packet™ wake-on-LAN detection, and IEEE 802.3x flow control. This eliminates the need for an external Ethernet PHY in many industrial gateway designs.
What memory resources are available on the R5F563NEDDBG#U0?
The R5F563NEDDBG#U0 provides 2 Mbytes of on-chip flash memory with zero-wait-state access at 100 MHz, 128 Kbytes of high-speed SRAM, and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. The flash supports background programming/erasing (BGO), enabling firmware updates without halting application execution-essential for secure OTA deployments.
How does the R5F563NEDDBG#U0 support functional safety standards like IEC 60730?
The R5F563NEDDBG#U0 includes multiple hardware features for IEC 60730 Class B compliance: oscillation-stoppage detection, built-in CRC calculator (with three polynomials), independent watchdog timer (IWDT) with dedicated LOCO clock, self-diagnostic A/D converter test mode, and memory protection unit (MPU) for runtime memory access enforcement-all documented in Renesas' functional safety manual R01US0076EJ0200.
What package type and pin count does the R5F563NEDDBG#U0 use?
The R5F563NEDDBG#U0 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 × 13 mm with 0.8 mm ball pitch. This LFBGA package provides superior thermal dissipation and mechanical stability compared to QFP alternatives, making it ideal for industrial environments subject to thermal cycling and vibration.
R5F563NEDDBG#U0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 133
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 21x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NEDDBG#U0 FAQ
1.How can I place an order for R5F563NEDDBG#U0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NEDDBG#U0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NEDDBG#U0 reliable?
The price and inventory of R5F563NEDDBG#U0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NEDDBG#U0 is usually 5 days.
3.What payment methods are accepted for R5F563NEDDBG#U0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NEDDBG#U0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F563NEDDBG#U0?
R5F563NEDDBG#U0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NEDDBG#U0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NEDDBG#U0?
For technical support, including R5F563NEDDBG#U0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NEDDBG#U0 requirements.
6.How does Aetrix verify that R5F563NEDDBG#U0 is sourced from the original manufacturer or authorized distributors?
All R5F563NEDDBG#U0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NEDDBG#U0 meets industry standards.
7.What is the process for return or replacement of R5F563NEDDBG#U0?
All R5F563NEDDBG#U0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NEDDBG#U0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NEDDBG#U0 part is unused and in its original packaging.
Return procedure for R5F563NEDDBG#U0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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