Renesas R5F563NFDGFB#V0

Overview

R5F563NFDGFB#V0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, full-speed USB 2.0 host/function/OTG, CAN, 12-bit and 10-bit A/D converters, 10-bit D/A converters, real-time clock, AES encryption (DEU), and 2 MB on-chip flash memory. It operates from a single 2.7–3.6 V supply and supports -40 to +85°C industrial temperature range. This MCU targets networked industrial controllers requiring deterministic real-time response, secure firmware updates, and multi-protocol connectivity.

For engineers reviewing the R5F563NFDGFB#V0 datasheet, R5F563NFDGFB#V0 pinout, R5F563NFDGFB#V0 application, or R5F563NFDGFB#V0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 2 MB flash/256 KB SRAM configuration, LQFP-144 package with 111 GPIOs (18× 5-V tolerant), and IEC60730 safety features including CRC, self-diagnostic A/D, and oscillation-stop detection.

Technical Context

The R5F563NFDGFB#V0 implements the 32-bit RX CPU core with Harvard architecture, 5-stage pipeline, and IEEE-754 single-precision FPU delivering 165 DMIPS at 100 MHz. Its memory subsystem includes no-wait-state 100 MHz flash (2 MB), 256 KB SRAM, and 32 KB data flash rated for 100,000 erase/write cycles.

It integrates dedicated hardware accelerators: Ethernet DMA controller (EDMAC) with 2 KB TX/RX FIFOs, USB 2.0 transceiver with 2 KB buffer, DEU for AES-128/192/256 in ECB/CBC modes, and CRC calculator supporting three polynomials. The peripheral set includes three CAN modules (32 mailboxes each), four I²C interfaces (one FM+), and up to 13 SCI channels with flexible mode selection.

Key Specifications

Pinout & Package

Package: PLQP0144KA-A - 144-pin LQFP, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F563NFDGFB#V0, R5F563NEDDFB trades 128 KB SRAM for identical flash and package compatibility, while R5F563NJDDFB removes Ethernet capability entirely but retains SRAM-making both viable only when those specific resources are overspecified for the target design.

Availability

R5F563NFDGFB#V0 is available at Aetrix Electronics and suitable for industrial automation, building management systems, and secure IoT edge nodes requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F563NFDGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX63N Group, including R5F563NFDGFB#V0, was designed for high-integrity networked industrial control-integrating Ethernet, USB, CAN, safety features, and large memory to replace multi-chip solutions in PLCs, HMIs, and gateways.

FAQ

What is the maximum operating frequency and core performance of the R5F563NFDGFB#V0?

The R5F563NFDGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core and delivers 165 DMIPS. It includes a single-precision IEEE-754 floating-point unit, 32-bit multiplier (1-cycle execution), and divider (2-cycle execution), enabling efficient real-time signal processing and control algorithms in the R5F563NFDGFB#V0.

Does the R5F563NFDGFB#V0 support Ethernet connectivity, and what interfaces are available?

Yes, the R5F563NFDGFB#V0 includes a fully integrated IEEE 802.3-compliant Ethernet MAC supporting 10/100 Mbps in full- and half-duplex modes. It supports both MII and RMII physical layer interfaces, Magic Packet™ wake-on-LAN, and IEEE 802.3x flow control-enabling direct connection to standard Ethernet PHYs without external glue logic in the R5F563NFDGFB#V0.

What are the memory resources available on the R5F563NFDGFB#V0?

The R5F563NFDGFB#V0 integrates 2 Mbytes of on-chip flash memory (no wait states at 100 MHz), 256 Kbytes of SRAM (no wait states), and 32 Kbytes of data flash rated for 100,000 erase/write cycles. Flash supports on-board programming and parallel programming for production, and SRAM retains content during deep software standby-key capabilities of the R5F563NFDGFB#V0.

How does the R5F563NFDGFB#V0 support functional safety standards like IEC60730?

The R5F563NFDGFB#V0 includes hardware features required for Class B compliance: oscillation-stop detection, CRC calculator (with three polynomials), self-diagnostic A/D converter, independent watchdog timer (IWDT) with dedicated LOCO clock, and memory protection unit (MPU). These are documented in Renesas' IEC60730 safety manual for the RX63N Group and apply directly to the R5F563NFDGFB#V0.

What package type and pin count does the R5F563NFDGFB#V0 use?

The R5F563NFDGFB#V0 uses the PLQP0144KA-A package: a 144-pin LQFP with 20 × 20 mm body size, 0.5 mm pitch, and exposed thermal pad. It provides 111 general-purpose I/O pins-including 18× 5-V tolerant inputs-and supports JTAG and FINE debugging interfaces, confirming its exact mechanical and electrical identity as the R5F563NFDGFB#V0.