Renesas R5F563NYDDFB#V0

Overview

R5F563NYDDFB#V0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller in the RX63N Group, featuring integrated Ethernet MAC (10/100 Mbps), full-speed USB 2.0 host/function/OTG, three CAN channels, 12-bit and 10-bit A/D converters (21 + 8 channels), dual 10-bit D/A outputs, hardware AES encryption (DEU), and 1 MB on-chip flash with 256 KB SRAM - designed for industrial networking gateways requiring deterministic real-time control and secure connectivity.

For engineers reviewing the R5F563NYDDFB#V0 datasheet, R5F563NYDDFB#V0 pinout, R5F563NYDDFB#V0 application, or R5F563NYDDFB#V0 equivalent, this MCU delivers verified Ethernet + USB + CAN coexistence, IEEE 802.3-compliant MII/RMII interface, IEC60730 safety support (CRC, self-diagnostic A/D, oscillation detection), and -40°C to +85°C operation in a 144-pin LQFP package.

Technical Context

The R5F563NYDDFB#V0 implements the RXv1 32-bit CISC Harvard architecture with 5-stage pipeline, single-cycle 32×32 multiplier, IEEE-754 single-precision FPU (165 DMIPS @ 100 MHz), and memory protection unit (MPU). It supports little-endian data and instruction layout with configurable endian mode per external bus area.

Its peripheral set includes a dedicated EDMAC for Ethernet (2 KB TX/RX FIFO), dual DMAC (4+2 channels), DTC, and clock domain separation: ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK/BCLK (up to 50 MHz), enabling precise timing isolation between CPU, peripherals, flash, and external bus interfaces.

Key Specifications

Pinout & Package

Package: PLQP0144KA-A - 144-pin LQFP, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NYDDFB#V0, R5F563NJDDFB#V0 offers 500 KB more flash for layered security or cloud connectivity stacks, while R5F563NBCDFB#V0 trades 128 KB SRAM for lower unit cost - both retain identical peripheral sets, pinout, and thermal profile.

Availability

R5F563NYDDFB#V0 is available at Aetrix Electronics and suitable for industrial networking gateways, smart energy metering hubs, building automation controllers, and medical infusion pump controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F563NYDDFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group targets industrial automation and networked embedded systems, integrating Ethernet, USB, CAN, and safety features into a single chip to reduce system complexity and certification effort.

FAQ

What is the maximum operating frequency and core architecture of the R5F563NYDDFB#V0?

The R5F563NYDDFB#V0 operates at a maximum frequency of 100 MHz using the RXv1 32-bit CISC Harvard architecture with 5-stage pipeline, delivering 165 DMIPS and including a single-precision IEEE-754 floating-point unit. Its instruction set supports ultra-compact code density and variable-length encoding, enabling efficient use of the 1 MB on-chip flash memory in the R5F563NYDDFB#V0.

Does the R5F563NYDDFB#V0 support Ethernet connectivity, and what interface standards does it implement?

Yes, the R5F563NYDDFB#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It implements MII (Media Independent Interface) and RMII (Reduced MII) standards, includes hardware support for Magic Packet™ wake-on-LAN, and features a dedicated EDMAC with 2 KB transmit and receive FIFOs to minimize CPU overhead during packet processing in the R5F563NYDDFB#V0.

What analog peripherals are integrated into the R5F563NYDDFB#V0, and what are their key performance metrics?

The R5F563NYDDFB#V0 integrates a 21-channel 12-bit A/D converter with 1 µs conversion time (at 50 MHz PCLK), an 8-channel 10-bit A/D converter, two 10-bit D/A outputs, and an on-die temperature sensor accurate to ±1°C. The 12-bit A/D includes a sample-and-hold circuit and supports software, timer-triggered, or external-event-started conversions - all confirmed in the R5F563NYDDFB#V0 datasheet Rev.1.80.

How does the R5F563NYDDFB#V0 support functional safety standards such as IEC60730?

The R5F563NYDDFB#V0 provides hardware-level IEC60730 Class B compliance features including oscillation-stop detection, hardware CRC calculation (with three selectable polynomials), independent watchdog timer (IWDT) with dedicated LOCO clock, self-diagnostic A/D functionality, and clock frequency measurement circuits. These capabilities are silicon-verified and documented in the R5F563NYDDFB#V0's safety manual to streamline certification for household and industrial appliances.

What is the package type and thermal specification for the R5F563NYDDFB#V0?

The R5F563NYDDFB#V0 is housed in a 144-pin LQFP package (PLQP0144KA-A), measuring 20 × 20 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for industrial temperature operation from -40°C to +85°C, with validated thermal performance under continuous 100 MHz operation and full peripheral activation - as specified in the R5F563NYDDFB#V0 datasheet section "Operating Temperature".