Renesas R5F563NYDDFC#V0

Overview

R5F563NYDDFC#V0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller with integrated Ethernet MAC, full-speed USB 2.0 host/function/OTG, CAN 2.0B (3 channels), 12-bit and 10-bit A/D converters (21 + 8 channels), dual 10-bit D/A outputs, hardware AES encryption (DEU), and 1 MB on-chip flash + 256 KB SRAM in a 176-pin LQFP package. It targets industrial networking gateways requiring deterministic real-time control, secure firmware updates, and multi-protocol connectivity.

For engineers reviewing the R5F563NYDDFC#V0 datasheet, R5F563NYDDFC#V0 pinout, R5F563NYDDFC#V0 application, or R5F563NYDDFC#V0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 100 MHz FPU-enabled performance (165 DMIPS), 1 MB flash/256 KB RAM configuration, -40°C to +85°C temperature grade, and PLQP0176KB-A package compatibility with existing 24×24 mm PCB footprints.

Technical Context

The R5F563NYDDFC#V0 implements the RXv1 core with IEEE 754-compliant single-precision FPU, 5-stage pipeline, and memory protection unit (MPU). Its clock system integrates PLL, HOCO (50 MHz), LOCO (125 kHz), and subclock oscillator for RTC - all configurable via independent dividers for ICLK (100 MHz), PCLK (50 MHz), FCLK (50 MHz), and BCLK (50 MHz).

Peripheral integration includes dedicated EDMAC for Ethernet DMA, EXDMAC (2-channel) for TFT/LCD transfers, DTC for interrupt-driven data movement, and parallel data capture (PDC) support only in larger packages - excluded here per Table 1.2. The device belongs to the RX63N Group, distinguishing it from RX631 by presence of Ethernet controller, SDRAM interface, and battery-backed RTC.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin LQFP, 24 mm × 24 mm, 0.5 mm pitch, exposed pad (thermal pad not electrically connected), RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NYDDFC#V0, R5F563NJDDFC#V0 offers 50% more flash for protocol stack headroom while retaining full SRAM, whereas R5F563NECDFC#V0 trades 128 KB SRAM for double flash - making the Y-series optimal for balanced real-time control and communication workloads.

Availability

R5F563NYDDFC#V0 is available at Aetrix Electronics and suitable for industrial gateways, secure firmware update nodes, motor control edge controllers, and smart building HVAC hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F563NYDDFC#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX63N Group, including R5F563NYDDFC#V0, was designed for industrial networking and real-time control systems requiring integrated Ethernet, security, and mixed-signal capability in a single chip - targeting programmable logic controllers, gateway devices, and factory automation equipment.

FAQ

What is the maximum operating frequency and core type of the R5F563NYDDFC#V0?

The R5F563NYDDFC#V0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with 5-stage pipeline, delivering 165 DMIPS performance. It includes a single-precision IEEE 754 floating-point unit, memory protection unit (MPU), and support for little-endian or big-endian data arrangement - all confirmed in R01DS0098EJ0180 Rev.1.80 Section 1.1.

Does the R5F563NYDDFC#V0 include an Ethernet controller, and what standards does it support?

Yes, the R5F563NYDDFC#V0 includes a fully integrated Ethernet MAC supporting IEEE 802.3 10/100 Mbps operation in full- and half-duplex modes, with MII and RMII physical layer interfaces. It complies with IEEE 802.3x flow control and Magic Packet™ wake-on-LAN - a defining feature distinguishing the RX63N Group from RX631, as documented in R01DS0098EJ0180 Section 1.1 and Table 1.2.

What are the memory resources available on the R5F563NYDDFC#V0?

The R5F563NYDDFC#V0 integrates 1 MB of on-chip flash memory (no wait states at 100 MHz), 256 KB of SRAM (no wait states), and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. These values are explicitly listed for this part number in Table 1.3 of R01DS0098EJ0180 Rev.1.80, confirming its position within the RX63N Group's 1 MB flash / 256 KB SRAM configuration tier.

Which communication interfaces are supported by the R5F563NYDDFC#V0?

The R5F563NYDDFC#V0 supports Ethernet MAC, USB 2.0 host/function/OTG (full-speed), three CAN 2.0B modules (32 mailboxes each), thirteen SCI channels, four I2C interfaces (including one FM+ capable of 1 Mbps), three RSPI ports, and one IEBus channel. This full peripheral set is verified for the RX63N Group in R01DS0098EJ0180 Sections 1.1 and Table 1.2 - and specifically assigned to R5F563NYDDFC#V0 in Table 1.3.

What package type and pin count does the R5F563NYDDFC#V0 use?

The R5F563NYDDFC#V0 uses the PLQP0176KB-A package: a 176-pin LQFP measuring 24 mm × 24 mm with 0.5 mm pitch. This package is explicitly listed for R5F563NYDDFC#V0 in Table 1.3 of R01DS0098EJ0180 Rev.1.80 and supports all peripherals enabled in the RX63N Group, including Ethernet, USB, and CAN - unlike smaller packages which omit certain functions per Table 1.2.